JP2006287011A5 - - Google Patents

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Publication number
JP2006287011A5
JP2006287011A5 JP2005105797A JP2005105797A JP2006287011A5 JP 2006287011 A5 JP2006287011 A5 JP 2006287011A5 JP 2005105797 A JP2005105797 A JP 2005105797A JP 2005105797 A JP2005105797 A JP 2005105797A JP 2006287011 A5 JP2006287011 A5 JP 2006287011A5
Authority
JP
Japan
Prior art keywords
thermocompression bonding
unit
display panel
semiconductor device
guide rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005105797A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006287011A (ja
JP4632037B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005105797A priority Critical patent/JP4632037B2/ja
Priority claimed from JP2005105797A external-priority patent/JP4632037B2/ja
Publication of JP2006287011A publication Critical patent/JP2006287011A/ja
Publication of JP2006287011A5 publication Critical patent/JP2006287011A5/ja
Application granted granted Critical
Publication of JP4632037B2 publication Critical patent/JP4632037B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005105797A 2005-04-01 2005-04-01 熱圧着装置及び半導体装置の搭載装置 Expired - Fee Related JP4632037B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005105797A JP4632037B2 (ja) 2005-04-01 2005-04-01 熱圧着装置及び半導体装置の搭載装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005105797A JP4632037B2 (ja) 2005-04-01 2005-04-01 熱圧着装置及び半導体装置の搭載装置

Publications (3)

Publication Number Publication Date
JP2006287011A JP2006287011A (ja) 2006-10-19
JP2006287011A5 true JP2006287011A5 (enExample) 2008-04-24
JP4632037B2 JP4632037B2 (ja) 2011-02-16

Family

ID=37408566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005105797A Expired - Fee Related JP4632037B2 (ja) 2005-04-01 2005-04-01 熱圧着装置及び半導体装置の搭載装置

Country Status (1)

Country Link
JP (1) JP4632037B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101139252B1 (ko) * 2006-11-20 2012-05-14 삼성전자주식회사 본딩장치
JP4392766B2 (ja) * 2007-08-21 2010-01-06 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け装置
CN101933128B (zh) * 2007-12-04 2012-08-29 松下电器产业株式会社 部件压接装置及方法
JP5479701B2 (ja) * 2008-10-06 2014-04-23 株式会社日立ハイテクノロジーズ 表示パネルモジュール組立装置
JP5356873B2 (ja) * 2009-03-24 2013-12-04 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
KR100945002B1 (ko) * 2009-07-20 2010-03-05 안동규 이방성 도전필름을 이용한 본딩장치
CN111801720A (zh) * 2018-03-12 2020-10-20 堺显示器制品株式会社 热压接装置
CN114566715B (zh) * 2022-03-21 2024-02-09 上海兰钧新能源科技有限公司 热压设备和热压方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3393562B2 (ja) * 1994-05-13 2003-04-07 ソニー株式会社 熱圧着装置
JP2877056B2 (ja) * 1995-12-06 1999-03-31 ソニーケミカル株式会社 熱圧着装置
JP4007031B2 (ja) * 2002-03-27 2007-11-14 松下電器産業株式会社 電子部品のボンディング方法

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