JP4620453B2 - 大型基板検査システム - Google Patents
大型基板検査システム Download PDFInfo
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- JP4620453B2 JP4620453B2 JP2004508394A JP2004508394A JP4620453B2 JP 4620453 B2 JP4620453 B2 JP 4620453B2 JP 2004508394 A JP2004508394 A JP 2004508394A JP 2004508394 A JP2004508394 A JP 2004508394A JP 4620453 B2 JP4620453 B2 JP 4620453B2
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- Prior art keywords
- substrate
- inspection
- load lock
- lock chamber
- inspection station
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Tests Of Electronic Circuits (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Liquid Crystal (AREA)
Description
[0001]本発明の実施形態は、一般的に大型基板の為の処理システムに関する。
1/2平方メートルまでの大きさの基板を収容するように構成された処理装置は、近い将来に構想される。そのような大きな基板は、フラットパネルディスプレイ製造への実質的な投資を表す。処理中の欠陥をモニタ及び訂正する為に、フラットパネルディスプレイ製造は、次第に製造段階中のデバイス検査に向きを変えている。フラットパネル上に形成されたデバイスをフラットパネルディスプレイ製造業者に検査させる一デバイスは、カリフォルニア州サンタクララに所在するアプライドマテリアルズ社の一部門であるAKT社から入手可能なPUMA(商標)である。
号(「処理装置の為の二重デュアルスロット式ロードロック」と題する弁護士ドケット番号第4946号)に説明されており、両方とも全体が参考の為に組み込まれている。代替え的に、複数の基板を内包するカセットを受けるように構成されたロードロックも同様に利用可能である。
Claims (14)
- 基板を検査する為のシステムにおいて:
ロードロックチャンバと;
前記ロードロックチャンバに結合された移送チャンバと;
前記ロードロックチャンバの上方で少なくとも一部が積み重ねられ前記移送チャンバに結合された検査ステーションであって、所定の平坦な移動範囲内で前記基板を移動させるように適合された位置決め用テーブルと、前記位置決め用テーブルにより検査機構の下方に位置決めされた前記基板の領域を検証するように適合された複数の検査機構とを有する検査ステーションと;
前記ロードロックチャンバ及び前記検査ステーション間で基板を移送するように適合された前記移送チャンバ内に配置されたロボットと;
を備える、前記システム。 - 前記ロードロックチャンバは、2以上の基板を内部に保持するように適合されている、請求項1記載のシステム。
- 前記検査ステーションは、前記ロードロックチャンバの最上部に積み重ねられている、請求項1記載のシステム。
- カメラを含む視覚システムを更に備える、請求項1記載のシステム。
- 前記カメラを前記基板上方に位置決めするように適合されたロボット機構に前記カメラが取り付けられている、請求項4記載のシステム。
- 基板を検査する為のシステムにおいて:
ロードロックチャンバと;
前記ロードロックチャンバに結合された移送チャンバと;
前記ロードロックチャンバの上方で少なくとも一部が積み重ねられ前記移送チャンバに結合された検査ステーションであって、所定の平坦な移動範囲内で前記基板を移動させるように適合された位置決め用テーブルと、前記テーブルに結合され、所定角度まで前記基板を回転するように適合されたターンテーブルと、を有する検査ステーションと;
前記ロードロックチャンバ及び前記検査ステーション間で基板を移送するように適合された前記移送チャンバ内に配置されたロボットと;
を備える、前記システム。 - 前記検査ステーションは、1以上のウインドウを有するフレームを更に備え、前記ウインドウは、前記基板を前記位置決め用テーブルに押し付けるように適合された、請求項1記載のシステム。
- コントローラと前記基板内に形成されたデバイスとの間に電気接続部を提供するように適合された複数の電気的接触用パッドを有するプローバを更に備える、請求項7記載のシステム。
- 前記検査機構は、1以上の電子ビーム発生装置である、請求項1記載のシステム。
- 前記検査機構は、離間された関係で置かれた2つの電子ビーム発生装置である、請求項9記載のシステム。
- 前記コントローラは、前記基板内に形成されたデバイスにわたる電圧変化を測定する、請求項8記載のシステム。
- 前記検査機構は、前記検査ステーション内に配置された基板の所定エリアを視るように適合された視覚システムに接続されている、請求項1記載のシステム。
- 基板を検査する為のシステムにおいて:
ロードロックチャンバと;
前記ロードロックチャンバに結合された移送チャンバと;
前記ロードロックチャンバの上方で少なくとも一部が積み重ねられ前記移送チャンバに結合された検査ステーションと;
前記検査ステーション内に置かれ、検査中、前記検査ステーション内部で前記基板を移動させるように適合された位置決め用テーブルと;
互いに離間関係で固定された位置決め用テーブルの上方に置かれた複数の電子ビーム発生装置と;
前記ロードロックチャンバ及び前記検査ステーション間で前記基板を移送するように適合された前記移送チャンバ内に置かれたロボットと;
を備える、前記システム。 - 前記検査ステーション内に置かれ、前記電子ビーム発生装置に関し前記基板を回転させるように適合された回転デバイスを更に備える、請求項13記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/155,796 US7129694B2 (en) | 2002-05-23 | 2002-05-23 | Large substrate test system |
PCT/US2003/015903 WO2003100837A2 (en) | 2002-05-23 | 2003-05-21 | Large substrate test system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005528786A JP2005528786A (ja) | 2005-09-22 |
JP4620453B2 true JP4620453B2 (ja) | 2011-01-26 |
Family
ID=29549167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004508394A Expired - Fee Related JP4620453B2 (ja) | 2002-05-23 | 2003-05-21 | 大型基板検査システム |
Country Status (7)
Country | Link |
---|---|
US (1) | US7129694B2 (ja) |
EP (1) | EP1506571A2 (ja) |
JP (1) | JP4620453B2 (ja) |
KR (1) | KR100990002B1 (ja) |
CN (1) | CN1656598B (ja) |
TW (1) | TWI315555B (ja) |
WO (1) | WO2003100837A2 (ja) |
Cited By (1)
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DE69923979T2 (de) * | 1999-06-23 | 2006-02-23 | Applied Materials, Inc., Santa Clara | Vorrichtung zur erzeugung von ionenstrahlen |
US6365977B1 (en) | 1999-08-31 | 2002-04-02 | International Business Machines Corporation | Insulating interposer between two electronic components and process thereof |
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KR100375621B1 (ko) * | 2000-05-04 | 2003-03-10 | 엘지전자 주식회사 | 에스알엠의 회전자 위치 정렬방법 및 그의 구현을 위한에스알엠 구동회로 |
US6828587B2 (en) * | 2000-06-19 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP3801849B2 (ja) * | 2000-08-07 | 2006-07-26 | 東京エレクトロン株式会社 | 基板処理装置及びその方法 |
US6524721B2 (en) | 2000-08-31 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd. | Conductive adhesive and packaging structure using the same |
KR100960773B1 (ko) * | 2000-09-15 | 2010-06-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 처리 장비용 더블 이중 슬롯 로드록 |
US20020046001A1 (en) | 2000-10-16 | 2002-04-18 | Applied Materials, Inc. | Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system |
-
2002
- 2002-05-23 US US10/155,796 patent/US7129694B2/en not_active Expired - Fee Related
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2003
- 2003-05-21 KR KR1020047018827A patent/KR100990002B1/ko not_active IP Right Cessation
- 2003-05-21 CN CN038117223A patent/CN1656598B/zh not_active Expired - Fee Related
- 2003-05-21 JP JP2004508394A patent/JP4620453B2/ja not_active Expired - Fee Related
- 2003-05-21 EP EP03734094A patent/EP1506571A2/en not_active Withdrawn
- 2003-05-21 WO PCT/US2003/015903 patent/WO2003100837A2/en not_active Application Discontinuation
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101861823B1 (ko) * | 2011-09-16 | 2018-05-29 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 검사 장비, 및 이를 이용한 유기 발광 표시 장치 제조 시스템 |
Also Published As
Publication number | Publication date |
---|---|
CN1656598B (zh) | 2011-12-07 |
WO2003100837A2 (en) | 2003-12-04 |
KR20040111682A (ko) | 2004-12-31 |
WO2003100837A3 (en) | 2004-03-04 |
TW200402826A (en) | 2004-02-16 |
TWI315555B (en) | 2009-10-01 |
JP2005528786A (ja) | 2005-09-22 |
EP1506571A2 (en) | 2005-02-16 |
US7129694B2 (en) | 2006-10-31 |
US20030218456A1 (en) | 2003-11-27 |
CN1656598A (zh) | 2005-08-17 |
KR100990002B1 (ko) | 2010-10-26 |
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