JP4614858B2 - 感光性樹脂組成物およびその積層体 - Google Patents
感光性樹脂組成物およびその積層体 Download PDFInfo
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- JP4614858B2 JP4614858B2 JP2005292470A JP2005292470A JP4614858B2 JP 4614858 B2 JP4614858 B2 JP 4614858B2 JP 2005292470 A JP2005292470 A JP 2005292470A JP 2005292470 A JP2005292470 A JP 2005292470A JP 4614858 B2 JP4614858 B2 JP 4614858B2
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- photosensitive resin
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- 150000001875 compounds Chemical class 0.000 claims description 35
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- 125000000217 alkyl group Chemical group 0.000 claims description 15
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- 125000003118 aryl group Chemical group 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
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- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 6
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- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
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- LYCNQAIOLGIAFA-UHFFFAOYSA-N 4-[bis[4-(dimethylamino)-2-methylphenyl]methyl]-n,n,3-trimethylaniline Chemical compound CC1=CC(N(C)C)=CC=C1C(C=1C(=CC(=CC=1)N(C)C)C)C1=CC=C(N(C)C)C=C1C LYCNQAIOLGIAFA-UHFFFAOYSA-N 0.000 description 2
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- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
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- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
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- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
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- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004803 chlorobenzyl group Chemical group 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
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- 235000019382 gum benzoic Nutrition 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
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- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 2
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
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Landscapes
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (2)
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CN104111584A (zh) * | 2009-05-20 | 2014-10-22 | 旭化成电子材料株式会社 | 感光性树脂组合物 |
TWI491981B (zh) * | 2009-11-04 | 2015-07-11 | Sumitomo Chemical Co | Coloring the photosensitive resin composition |
WO2013115262A1 (ja) * | 2012-02-02 | 2013-08-08 | 日立化成株式会社 | 感光性樹脂組成物及びそれを用いた感光性エレメント、スペーサーの形成方法、並びに、スペーサー |
US20150293443A1 (en) * | 2012-11-20 | 2015-10-15 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
JP6591078B2 (ja) * | 2016-08-30 | 2019-10-16 | 富士フイルム株式会社 | 感光性樹脂組成物、転写フィルム、タッチパネル用保護膜、タッチパネル及びその製造方法、並びに画像表示装置 |
CN114114835B (zh) * | 2021-12-13 | 2024-05-28 | 陕西彩虹新材料有限公司 | 一种添加剂及包含该添加剂的光刻胶组合物 |
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