JP4601639B2 - 平板表示装置の製造方法 - Google Patents
平板表示装置の製造方法 Download PDFInfo
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- JP4601639B2 JP4601639B2 JP2007092396A JP2007092396A JP4601639B2 JP 4601639 B2 JP4601639 B2 JP 4601639B2 JP 2007092396 A JP2007092396 A JP 2007092396A JP 2007092396 A JP2007092396 A JP 2007092396A JP 4601639 B2 JP4601639 B2 JP 4601639B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims description 106
- 239000011521 glass Substances 0.000 claims description 57
- 238000000137 annealing Methods 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 41
- 230000001678 irradiating effect Effects 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 12
- 238000005304 joining Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 7
- 239000010408 film Substances 0.000 description 31
- 230000008569 process Effects 0.000 description 22
- 239000010410 layer Substances 0.000 description 20
- 238000007789 sealing Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000000644 propagated effect Effects 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 229910052779 Neodymium Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052741 iridium Inorganic materials 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 241000135309 Processus Species 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- MBPCKEZNJVJYTC-UHFFFAOYSA-N 4-[4-(n-phenylanilino)phenyl]aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(N(C=2C=CC=CC=2)C=2C=CC=CC=2)C=C1 MBPCKEZNJVJYTC-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- E—FIXED CONSTRUCTIONS
- E03—WATER SUPPLY; SEWERAGE
- E03B—INSTALLATIONS OR METHODS FOR OBTAINING, COLLECTING, OR DISTRIBUTING WATER
- E03B7/00—Water main or service pipe systems
- E03B7/07—Arrangement of devices, e.g. filters, flow controls, measuring devices, siphons or valves, in the pipe systems
- E03B7/072—Arrangement of flowmeters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L55/00—Devices or appurtenances for use in, or in connection with, pipes or pipe systems
- F16L55/02—Energy absorbers; Noise absorbers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Public Health (AREA)
- Water Supply & Treatment (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
2 第2基板
3 発光部
4 パッド部
5 ガラスフリット
6 レーザ照射器
11 絶縁層
12 TFTの活性層
12a チャンネル領域
12b ソース領域
12c ドレイン領域
13 ゲート絶縁膜
14 ゲート電極
15 層間絶縁膜
16a ソース電極
16b ドレイン電極
17 平坦化膜
18 画素定義膜
31 画素電極
32 有機発光膜
33 対向電極
34 パッシベーション膜
Claims (15)
- 第1基板の一方の面に発光素子を備える発光部を複数個形成する段階と、
第2基板を準備する段階と、
前記第1基板または第2基板の一方の面にガラスフリットを各発光部を取り囲むように形成する段階と、
前記第1基板と第2基板との間に、前記ガラスフリットが介在するように前記第1基板と第2基板とを対向配置する段階と、
第1強度のレーザを照射し、前記ガラスフリットを溶かし、前記ガラスフリットにより前記第1基板と第2基板とを接合する段階と、
第1強度のレーザが照射された領域に第2強度のレーザを照射し、前記第1基板または第2基板をアニーリングする段階とを含むことを特徴とする平板表示装置の製造方法。 - 前記第2強度は、前記第1強度より低い強度であることを特徴とする請求項1に記載の平板表示装置の製造方法。
- 前記第2強度は、前記第1強度の70ないし80%であることを特徴とする請求項2に記載の平板表示装置の製造方法。
- 前記第2強度のレーザでアニーリングする段階は、前記第1強度のレーザで、前記ガラスフリットを溶かして接合する段階とは前記発光部について逆の順序でレーザを照射して進められることを特徴とする請求項1に記載の平板表示装置の製造方法。
- 前記発光部は、第1方向にm個、第2方向にn個配列され、
前記第1強度のレーザで前記ガラスフリットを溶かして接合する段階は、第1方向に進められ、
前記第2強度のレーザでアニーリングする段階は、第1方向の逆方向に進められることを特徴とする請求項1に記載の平板表示装置の製造方法。 - 前記発光部は、第1方向にm個、第2方向にn個配列され、
前記第1強度のレーザで、前記ガラスフリットを溶かして接合する段階は、第2方向にまず進行した後、第1方向に進められる順序を反復的に行うことであり、
前記第2強度のレーザでアニーリングする段階は、第2方向にまず進められた後、第1方向の逆方向に進められる順序を反復的に行うことを特徴とする請求項1に記載の平板表示装置の製造方法。 - 前記第1強度のレーザで前記ガラスフリットを溶かして接合する段階、及び前記第2強度のレーザでアニーリングする段階は、それぞれ一回に二つ以上の発光部に対して進められることを特徴とする請求項1に記載の平板表示装置の製造方法。
- 前記発光部は、第1方向にm個、第2方向にn個配列され、
前記第1強度のレーザで前記ガラスフリットを溶かして接合する段階は、第1方向に沿った1列の発光部に対して進められた後、第2方向に沿って次の1列の発光部に対して進められることであり、
前記第2強度のレーザでアニーリングする段階は、前記第1強度のレーザで前記ガラスフリットを溶かして接合する段階とは前記発光部について逆の順序でレーザを照射して進められることを特徴とする請求項7に記載の平板表示装置の製造方法。 - 前記第1強度のレーザで接合する段階後に、
前記第1基板及び第2基板を180°回転させる段階をさらに含むことを特徴とする請求項1に記載の平板表示装置の製造方法。 - 前記第1強度のレーザで接合する段階と、前記第2強度のレーザでアニーリングする段階とで、レーザを照射するレーザ照射器の進行方向が同じであることを特徴とする請求項9に記載の平板表示装置の製造方法。
- 前記第1強度または第2強度のレーザは、前記第1基板側から照射されることを特徴とする請求項1に記載の平板表示装置の製造方法。
- 前記第1強度または第2強度のレーザは、前記第2基板側から照射されることを特徴とする請求項1に記載の平板表示装置の製造方法。
- 前記第1強度または第2強度のレーザは、前記第1基板及び第2基板の両側から照射されることを特徴とする請求項1に記載の平板表示装置の製造方法。
- 前記アニーリング段階後に、前記第1基板または第2基板を、前記各発光部別に切断する段階をさらに含むことを特徴とする請求項1に記載の平板表示装置の製造方法。
- 前記発光素子は、有機電界発光素子であることを特徴とする請求項1に記載の平板表示装置の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070003961A KR100838077B1 (ko) | 2007-01-12 | 2007-01-12 | 평판 표시장치의 제조방법 |
Publications (2)
Publication Number | Publication Date |
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JP2008170926A JP2008170926A (ja) | 2008-07-24 |
JP4601639B2 true JP4601639B2 (ja) | 2010-12-22 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007092396A Active JP4601639B2 (ja) | 2007-01-12 | 2007-03-30 | 平板表示装置の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7780493B2 (ja) |
EP (1) | EP1944817B1 (ja) |
JP (1) | JP4601639B2 (ja) |
KR (1) | KR100838077B1 (ja) |
CN (1) | CN101221910B (ja) |
TW (1) | TWI376356B (ja) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5080838B2 (ja) * | 2007-03-29 | 2012-11-21 | 富士フイルム株式会社 | 電子デバイスおよびその製造方法 |
US8716850B2 (en) * | 2007-05-18 | 2014-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US9281132B2 (en) | 2008-07-28 | 2016-03-08 | Corning Incorporated | Method for sealing a liquid within a glass package and the resulting glass package |
EP2321694A4 (en) * | 2008-07-28 | 2012-05-30 | Corning Inc | METHOD FOR SEALING A LIQUID IN A GLASS PACKAGING AND RESULTING GLASS PACKAGING |
KR101453878B1 (ko) | 2008-08-07 | 2014-10-23 | 삼성디스플레이 주식회사 | 평판 표시장치의 제조방법 |
KR101117715B1 (ko) * | 2009-04-30 | 2012-02-24 | 삼성모바일디스플레이주식회사 | 레이저 조사 장치 및 상기 레이저 조사 장치를 이용한 평판 디스플레이 장치의 제조 방법 |
US8568184B2 (en) * | 2009-07-15 | 2013-10-29 | Apple Inc. | Display modules |
JP5697385B2 (ja) * | 2009-10-30 | 2015-04-08 | キヤノン株式会社 | ガラス基材の接合体、気密容器、及びガラス構造体の製造方法 |
KR101206608B1 (ko) * | 2009-11-17 | 2012-11-29 | (주)엘지하우시스 | 유리기판의 레이저 실링장치 |
KR101117732B1 (ko) * | 2010-01-19 | 2012-02-24 | 삼성모바일디스플레이주식회사 | 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
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TWI792087B (zh) | 2011-05-05 | 2023-02-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
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KR102038844B1 (ko) | 2011-06-16 | 2019-10-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 밀봉체의 제작 방법 및 밀봉체, 그리고 발광 장치의 제작 방법 및 발광 장치 |
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US7780493B2 (en) | 2010-08-24 |
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EP1944817A2 (en) | 2008-07-16 |
KR100838077B1 (ko) | 2008-06-16 |
CN101221910B (zh) | 2011-07-20 |
EP1944817B1 (en) | 2019-05-01 |
US20080171485A1 (en) | 2008-07-17 |
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CN101221910A (zh) | 2008-07-16 |
EP1944817A3 (en) | 2011-10-26 |
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