JP4596612B2 - 液体吐出ヘッドの製造方法 - Google Patents

液体吐出ヘッドの製造方法 Download PDF

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Publication number
JP4596612B2
JP4596612B2 JP2000200581A JP2000200581A JP4596612B2 JP 4596612 B2 JP4596612 B2 JP 4596612B2 JP 2000200581 A JP2000200581 A JP 2000200581A JP 2000200581 A JP2000200581 A JP 2000200581A JP 4596612 B2 JP4596612 B2 JP 4596612B2
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Japan
Prior art keywords
substrate
orifice plate
silicon
head
manufacturing
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Expired - Fee Related
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JP2000200581A
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English (en)
Japanese (ja)
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JP2001071510A5 (enExample
JP2001071510A (ja
Inventor
良明 鈴木
昌士 宮川
俊雄 樫野
弘明 三原
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Canon Inc
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Canon Inc
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Priority to JP2000200581A priority Critical patent/JP4596612B2/ja
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Publication of JP2001071510A5 publication Critical patent/JP2001071510A5/ja
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  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2000200581A 1999-07-02 2000-07-03 液体吐出ヘッドの製造方法 Expired - Fee Related JP4596612B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000200581A JP4596612B2 (ja) 1999-07-02 2000-07-03 液体吐出ヘッドの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP18962999 1999-07-02
JP11-189629 1999-07-02
JP2000200581A JP4596612B2 (ja) 1999-07-02 2000-07-03 液体吐出ヘッドの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010186184A Division JP4702963B2 (ja) 1999-07-02 2010-08-23 液体吐出ヘッドの製造方法、液体吐出ヘッド、ヘッドカートリッジ、液体吐出記録装置、シリコンプレートの製造方法、およびシリコンプレート

Publications (3)

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JP2001071510A JP2001071510A (ja) 2001-03-21
JP2001071510A5 JP2001071510A5 (enExample) 2007-08-09
JP4596612B2 true JP4596612B2 (ja) 2010-12-08

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JP2000200581A Expired - Fee Related JP4596612B2 (ja) 1999-07-02 2000-07-03 液体吐出ヘッドの製造方法

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JP (1) JP4596612B2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7052117B2 (en) * 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
US6824246B2 (en) * 2002-11-23 2004-11-30 Kia Silverbrook Thermal ink jet with thin nozzle plate
JP2006095891A (ja) * 2004-09-29 2006-04-13 Canon Finetech Inc 液体吐出ヘッドおよびその製造方法
JP4337723B2 (ja) 2004-12-08 2009-09-30 セイコーエプソン株式会社 液滴吐出ヘッドの製造方法及び液滴吐出ヘッド並びに液滴吐出装置
JP4665598B2 (ja) * 2005-05-11 2011-04-06 セイコーエプソン株式会社 シリコン基板の加工方法
JP4632441B2 (ja) 2005-09-05 2011-02-16 キヤノン株式会社 インクジェット記録ヘッドおよびインクジェット記録装置
WO2007105801A1 (ja) * 2006-03-10 2007-09-20 Canon Kabushiki Kaisha 液体吐出ヘッド基体、その基体を用いた液体吐出ヘッドおよびそれらの製造方法
JP4967777B2 (ja) * 2006-05-31 2012-07-04 コニカミノルタホールディングス株式会社 インクジェットヘッドの製造方法
JP2008091779A (ja) * 2006-10-04 2008-04-17 Sanyo Electric Co Ltd 半導体装置の製造方法
US8162439B2 (en) * 2007-06-20 2012-04-24 Konica Minolta Holdings, Inc. Method for manufacturing nozzle plate for liquid ejection head, nozzle plate for liquid ejection head and liquid ejection head
JP2009018463A (ja) * 2007-07-11 2009-01-29 Seiko Epson Corp シリコン製ノズル基板及びその製造方法、液滴吐出ヘッド並びに液滴吐出装置
JP4985199B2 (ja) * 2007-08-07 2012-07-25 パナソニック株式会社 半導体ウェハの個片化方法
JP5218164B2 (ja) * 2009-03-10 2013-06-26 セイコーエプソン株式会社 ノズル基板の製造方法及び液滴吐出ヘッドの製造方法
JP5709536B2 (ja) * 2010-01-14 2015-04-30 キヤノン株式会社 シリコン基板の加工方法
JP2013120660A (ja) * 2011-12-06 2013-06-17 Canon Inc 貫通孔基板の製造方法
US8551692B1 (en) * 2012-04-30 2013-10-08 Fujilfilm Corporation Forming a funnel-shaped nozzle
JP2018056159A (ja) * 2016-09-26 2018-04-05 セイコーエプソン株式会社 粘着テープ剥離治具、半導体チップの製造装置、ｍｅｍｓデバイスの製造装置、液体噴射ヘッドの製造装置、および、粘着テープ剥離方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63199653A (ja) * 1987-02-16 1988-08-18 Canon Inc インクジエツト記録ヘツドの保護膜
JPH01253453A (ja) * 1988-04-01 1989-10-09 Nec Corp インクジェットヘッドおよびその製造方法
JPH0629386A (ja) * 1992-07-10 1994-02-04 Sharp Corp 半導体装置の分割方法
JPH08336976A (ja) * 1995-06-14 1996-12-24 Canon Inc 液体噴射記録ヘッドおよびその製造方法ならびに前記液体噴射記録ヘッドを搭載する液体噴射記録装置
JPH10226079A (ja) * 1997-02-12 1998-08-25 Canon Inc 液体噴射記録ヘッドの製造方法
JP3820747B2 (ja) * 1997-05-14 2006-09-13 セイコーエプソン株式会社 噴射装置の製造方法
JPH1158746A (ja) * 1997-08-18 1999-03-02 Shimeo Seimitsu Kk インクジェットプリンターヘッドのノズル板の表面処理方法

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Publication number Publication date
JP2001071510A (ja) 2001-03-21

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