JP4582144B2 - 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール - Google Patents

熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール Download PDF

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Publication number
JP4582144B2
JP4582144B2 JP2007525482A JP2007525482A JP4582144B2 JP 4582144 B2 JP4582144 B2 JP 4582144B2 JP 2007525482 A JP2007525482 A JP 2007525482A JP 2007525482 A JP2007525482 A JP 2007525482A JP 4582144 B2 JP4582144 B2 JP 4582144B2
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Japan
Prior art keywords
thin
conductive sheet
heat conductive
sheet
pieces
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Expired - Fee Related
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JP2007525482A
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English (en)
Japanese (ja)
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JPWO2007010615A1 (ja
Inventor
圭 山本
哲史 反田
和弘 多田
星紀 平松
直志 山田
浩美 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2007010615A1 publication Critical patent/JPWO2007010615A1/ja
Application granted granted Critical
Publication of JP4582144B2 publication Critical patent/JP4582144B2/ja
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2007525482A 2005-07-22 2005-07-22 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール Expired - Fee Related JP4582144B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/013461 WO2007010615A1 (ja) 2005-07-22 2005-07-22 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール

Publications (2)

Publication Number Publication Date
JPWO2007010615A1 JPWO2007010615A1 (ja) 2009-01-29
JP4582144B2 true JP4582144B2 (ja) 2010-11-17

Family

ID=37668504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007525482A Expired - Fee Related JP4582144B2 (ja) 2005-07-22 2005-07-22 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール

Country Status (3)

Country Link
JP (1) JP4582144B2 (enExample)
TW (1) TW200705627A (enExample)
WO (1) WO2007010615A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101454909B (zh) * 2006-05-31 2012-05-23 电气化学工业株式会社 Led光源单元
CA2676947C (en) * 2007-01-30 2014-03-25 Denki Kagaku Kogyo Kabushiki Kaisha Led light source unit
JP4854571B2 (ja) * 2007-04-06 2012-01-18 三菱電機株式会社 半導体レーザ装置
JP2010073965A (ja) * 2008-09-19 2010-04-02 Denso Corp 半導体冷却ユニット
JP5484429B2 (ja) * 2011-11-18 2014-05-07 三菱電機株式会社 電力変換装置
JP5877056B2 (ja) * 2011-12-22 2016-03-02 日本シイエムケイ株式会社 パワーモジュール用絶縁放熱基板とその製造方法
JP6813473B2 (ja) * 2017-12-26 2021-01-13 公益財団法人鉄道総合技術研究所 放熱基板及びその製造方法
JP2019176060A (ja) * 2018-03-29 2019-10-10 帝人株式会社 電気絶縁性熱伝導シート及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995002313A1 (fr) * 1993-07-06 1995-01-19 Kabushiki Kaisha Toshiba Feuille d'evacuation thermique
JP2004172286A (ja) * 2002-11-19 2004-06-17 Kyocera Chemical Corp 熱伝導シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995002313A1 (fr) * 1993-07-06 1995-01-19 Kabushiki Kaisha Toshiba Feuille d'evacuation thermique
JP2004172286A (ja) * 2002-11-19 2004-06-17 Kyocera Chemical Corp 熱伝導シート

Also Published As

Publication number Publication date
TW200705627A (en) 2007-02-01
WO2007010615A1 (ja) 2007-01-25
TWI294175B (enExample) 2008-03-01
JPWO2007010615A1 (ja) 2009-01-29

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