JP4582144B2 - 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール - Google Patents

熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール Download PDF

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Publication number
JP4582144B2
JP4582144B2 JP2007525482A JP2007525482A JP4582144B2 JP 4582144 B2 JP4582144 B2 JP 4582144B2 JP 2007525482 A JP2007525482 A JP 2007525482A JP 2007525482 A JP2007525482 A JP 2007525482A JP 4582144 B2 JP4582144 B2 JP 4582144B2
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JP
Japan
Prior art keywords
thin
conductive sheet
heat conductive
sheet
pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007525482A
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English (en)
Japanese (ja)
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JPWO2007010615A1 (ja
Inventor
圭 山本
哲史 反田
和弘 多田
星紀 平松
直志 山田
浩美 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2007010615A1 publication Critical patent/JPWO2007010615A1/ja
Application granted granted Critical
Publication of JP4582144B2 publication Critical patent/JP4582144B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2007525482A 2005-07-22 2005-07-22 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール Expired - Fee Related JP4582144B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/013461 WO2007010615A1 (ja) 2005-07-22 2005-07-22 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール

Publications (2)

Publication Number Publication Date
JPWO2007010615A1 JPWO2007010615A1 (ja) 2009-01-29
JP4582144B2 true JP4582144B2 (ja) 2010-11-17

Family

ID=37668504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007525482A Expired - Fee Related JP4582144B2 (ja) 2005-07-22 2005-07-22 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール

Country Status (3)

Country Link
JP (1) JP4582144B2 (enExample)
TW (1) TW200705627A (enExample)
WO (1) WO2007010615A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2653867A1 (en) * 2006-05-31 2007-12-06 Denki Kagaku Kogyo Kabushiki Kaisha Led light source unit
JP5410098B2 (ja) * 2007-01-30 2014-02-05 電気化学工業株式会社 Ｌｅｄ光源ユニット
JP4854571B2 (ja) * 2007-04-06 2012-01-18 三菱電機株式会社 半導体レーザ装置
JP2010073965A (ja) * 2008-09-19 2010-04-02 Denso Corp 半導体冷却ユニット
JP5484429B2 (ja) * 2011-11-18 2014-05-07 三菱電機株式会社 電力変換装置
JP5877056B2 (ja) * 2011-12-22 2016-03-02 日本シイエムケイ株式会社 パワーモジュール用絶縁放熱基板とその製造方法
JP6813473B2 (ja) * 2017-12-26 2021-01-13 公益財団法人鉄道総合技術研究所 放熱基板及びその製造方法
JP2019176060A (ja) * 2018-03-29 2019-10-10 帝人株式会社 電気絶縁性熱伝導シート及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995002313A1 (fr) * 1993-07-06 1995-01-19 Kabushiki Kaisha Toshiba Feuille d'evacuation thermique
JP2004172286A (ja) * 2002-11-19 2004-06-17 Kyocera Chemical Corp 熱伝導シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995002313A1 (fr) * 1993-07-06 1995-01-19 Kabushiki Kaisha Toshiba Feuille d'evacuation thermique
JP2004172286A (ja) * 2002-11-19 2004-06-17 Kyocera Chemical Corp 熱伝導シート

Also Published As

Publication number Publication date
JPWO2007010615A1 (ja) 2009-01-29
WO2007010615A1 (ja) 2007-01-25
TWI294175B (enExample) 2008-03-01
TW200705627A (en) 2007-02-01

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