TWI294175B - - Google Patents

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Publication number
TWI294175B
TWI294175B TW094131420A TW94131420A TWI294175B TW I294175 B TWI294175 B TW I294175B TW 094131420 A TW094131420 A TW 094131420A TW 94131420 A TW94131420 A TW 94131420A TW I294175 B TWI294175 B TW I294175B
Authority
TW
Taiwan
Prior art keywords
sheet
thin
thin body
heat
thermally conductive
Prior art date
Application number
TW094131420A
Other languages
English (en)
Chinese (zh)
Other versions
TW200705627A (en
Inventor
Kei Yamamoto
Tetsuji Sorita
Kazuhiro Tada
Seiki Hiramatsu
Naoshi Yamada
Hiromi Ito
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW200705627A publication Critical patent/TW200705627A/zh
Application granted granted Critical
Publication of TWI294175B publication Critical patent/TWI294175B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
TW094131420A 2005-07-22 2005-09-13 Heat transfer sheet, and manufacturing method thereof, power module using the heat transfer sheet TW200705627A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/013461 WO2007010615A1 (ja) 2005-07-22 2005-07-22 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール

Publications (2)

Publication Number Publication Date
TW200705627A TW200705627A (en) 2007-02-01
TWI294175B true TWI294175B (enExample) 2008-03-01

Family

ID=37668504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131420A TW200705627A (en) 2005-07-22 2005-09-13 Heat transfer sheet, and manufacturing method thereof, power module using the heat transfer sheet

Country Status (3)

Country Link
JP (1) JP4582144B2 (enExample)
TW (1) TW200705627A (enExample)
WO (1) WO2007010615A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090279300A1 (en) * 2006-05-31 2009-11-12 Denki Kagaku Kogyo Kabushiki Kaisha Led light source unit
KR101333355B1 (ko) * 2007-01-30 2013-11-28 덴끼 가가꾸 고교 가부시키가이샤 Ｌｅｄ 광원 유닛
JP4854571B2 (ja) * 2007-04-06 2012-01-18 三菱電機株式会社 半導体レーザ装置
JP2010073965A (ja) * 2008-09-19 2010-04-02 Denso Corp 半導体冷却ユニット
JP5484429B2 (ja) * 2011-11-18 2014-05-07 三菱電機株式会社 電力変換装置
JP5877056B2 (ja) * 2011-12-22 2016-03-02 日本シイエムケイ株式会社 パワーモジュール用絶縁放熱基板とその製造方法
JP6813473B2 (ja) * 2017-12-26 2021-01-13 公益財団法人鉄道総合技術研究所 放熱基板及びその製造方法
JP2019176060A (ja) * 2018-03-29 2019-10-10 帝人株式会社 電気絶縁性熱伝導シート及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69328687D1 (de) * 1993-07-06 2000-06-21 Toshiba Kawasaki Kk Wärmeleitende platte
JP2004172286A (ja) * 2002-11-19 2004-06-17 Kyocera Chemical Corp 熱伝導シート

Also Published As

Publication number Publication date
JP4582144B2 (ja) 2010-11-17
JPWO2007010615A1 (ja) 2009-01-29
WO2007010615A1 (ja) 2007-01-25
TW200705627A (en) 2007-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees