JP4559327B2 - レンズを用いた光モジュールのアラインメント方法およびその方法で作成した光モジュール - Google Patents

レンズを用いた光モジュールのアラインメント方法およびその方法で作成した光モジュール Download PDF

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Publication number
JP4559327B2
JP4559327B2 JP2005266402A JP2005266402A JP4559327B2 JP 4559327 B2 JP4559327 B2 JP 4559327B2 JP 2005266402 A JP2005266402 A JP 2005266402A JP 2005266402 A JP2005266402 A JP 2005266402A JP 4559327 B2 JP4559327 B2 JP 4559327B2
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Japan
Prior art keywords
optical element
lens member
lens
optical
alignment mark
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Expired - Fee Related
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JP2005266402A
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English (en)
Japanese (ja)
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JP2007079090A5 (https=
JP2007079090A (ja
Inventor
卓磨 坂
康信 松岡
正人 宍倉
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Hitachi Ltd
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Hitachi Ltd
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Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2005266402A priority Critical patent/JP4559327B2/ja
Priority to US11/501,047 priority patent/US7612881B2/en
Publication of JP2007079090A publication Critical patent/JP2007079090A/ja
Publication of JP2007079090A5 publication Critical patent/JP2007079090A5/ja
Application granted granted Critical
Publication of JP4559327B2 publication Critical patent/JP4559327B2/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4234—Passive alignment along the optical axis and active alignment perpendicular to the optical axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2005266402A 2005-09-14 2005-09-14 レンズを用いた光モジュールのアラインメント方法およびその方法で作成した光モジュール Expired - Fee Related JP4559327B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005266402A JP4559327B2 (ja) 2005-09-14 2005-09-14 レンズを用いた光モジュールのアラインメント方法およびその方法で作成した光モジュール
US11/501,047 US7612881B2 (en) 2005-09-14 2006-08-09 Method of alignment of an optical module and an optical module using thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005266402A JP4559327B2 (ja) 2005-09-14 2005-09-14 レンズを用いた光モジュールのアラインメント方法およびその方法で作成した光モジュール

Publications (3)

Publication Number Publication Date
JP2007079090A JP2007079090A (ja) 2007-03-29
JP2007079090A5 JP2007079090A5 (https=) 2008-05-08
JP4559327B2 true JP4559327B2 (ja) 2010-10-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005266402A Expired - Fee Related JP4559327B2 (ja) 2005-09-14 2005-09-14 レンズを用いた光モジュールのアラインメント方法およびその方法で作成した光モジュール

Country Status (2)

Country Link
US (1) US7612881B2 (https=)
JP (1) JP4559327B2 (https=)

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US9366832B2 (en) 2014-04-08 2016-06-14 Sumitomo Electric Industries, Ltd. Optical connection structure

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US8351794B2 (en) * 2009-03-10 2013-01-08 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Parallel optical transceiver module having a heat dissipation system that dissipates heat and protects components of the module from particulates and handling
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JP5641056B2 (ja) * 2010-12-21 2014-12-17 日本電気株式会社 光モジュール及びその製造方法
JP2012155215A (ja) * 2011-01-27 2012-08-16 Nitto Denko Corp 光導波路の製法およびそれに用いられる光導波路体
EP2581776A1 (en) 2011-10-13 2013-04-17 Tyco Electronics Svenska Holdings AB Optical connector with alignment element, optical unit and assembly method
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JP6475911B2 (ja) * 2013-12-16 2019-02-27 住友電気工業株式会社 光コネクタ保持具、光コネクタモジュール、光学基板モジュール及び光モジュール
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Publication number Publication date
US7612881B2 (en) 2009-11-03
US20070058904A1 (en) 2007-03-15
JP2007079090A (ja) 2007-03-29

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