JP4554557B2 - 冷却器 - Google Patents
冷却器 Download PDFInfo
- Publication number
- JP4554557B2 JP4554557B2 JP2006163584A JP2006163584A JP4554557B2 JP 4554557 B2 JP4554557 B2 JP 4554557B2 JP 2006163584 A JP2006163584 A JP 2006163584A JP 2006163584 A JP2006163584 A JP 2006163584A JP 4554557 B2 JP4554557 B2 JP 4554557B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- transfer member
- heat transfer
- flow path
- cooling fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
図1から図8を参照して、本発明に基づく実施の形態1における冷却器について説明する。
図9を参照して、本発明に基づく実施の形態2における冷却器について説明する。本願実施の形態における冷却器は、伝熱部材の第1流路および第2流路の構成が実施の形態1と異なる。
図10および図11を参照して、本発明に基づく実施の形態3における冷却器について説明する。本実施の形態においては、伝熱部材の形状が実施の形態1と異なる。
図12および図13を参照して、本発明に基づく実施の形態4における冷却器について説明する。
第1溝5aと同様に、第2溝5bは、排出溝5dに向かって徐々に深くなるように形成されている。
Claims (7)
- 冷却流体が表面に噴霧されるための伝熱部材を備え、
前記伝熱部材は、前記表面に形成された第1流路と、
前記表面に形成され、前記第1流路に交差する第2流路と
を含み、
前記第1流路は、前記伝熱部材の一方の端面から他方の端面まで延びるように形成され、
前記第2流路は、その端部が前記伝熱部材の主面の内部の領域に配置されるように形成され、
前記第1流路および前記第2流路は、それぞれが底面を有する溝状に形成され、
前記第2流路の底面が前記第1流路の底面よりも低くなるように形成されている、冷却器。 - 前記第1流路は、前記冷却流体を前記表面のほぼ全体に供給するように形成され、
前記第1流路は、過剰な前記冷却流体を排出できるように形成され、
前記第2流路は、前記冷却流体の蒸発を促進するように形成された、請求項1に記載の冷却器。 - 前記第2流路は、前記第2流路が延びる方向と垂直な断面における形状が階段状になるように形成された、請求項1または2に記載の冷却器。
- 前記伝熱部材は、前記表面が中央部から外周部に向かって、高さが低くなるように凸面状に形成された、請求項1から3のいずれかに記載の冷却器。
- 前記伝熱部材は、前記表面が中央部から外周部に向かって、高さが低くなるように傾斜している、請求項1から3のいずれかに記載の冷却器。
- 前記第1流路および前記第2流路は、溝状に形成され、
前記第1流路および前記第2流路のうち少なくとも一方の流路は、前記表面の中央部から外周部に向かって徐々に深くなるように形成された、請求項1から5のいずれかに記載の冷却器。 - 前記第2流路は、溝状に形成され、
前記第2流路は、少なくとも一部が毛管現象を生じるように形成された、請求項1から6のいずれかに記載の冷却器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006163584A JP4554557B2 (ja) | 2006-06-13 | 2006-06-13 | 冷却器 |
PCT/JP2007/062199 WO2007145354A1 (ja) | 2006-06-13 | 2007-06-12 | 冷却器 |
CN2007800210366A CN101461059B (zh) | 2006-06-13 | 2007-06-12 | 冷却器 |
US12/304,426 US20090145586A1 (en) | 2006-06-13 | 2007-06-12 | Cooler |
DE112007001422T DE112007001422B4 (de) | 2006-06-13 | 2007-06-12 | Kühler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006163584A JP4554557B2 (ja) | 2006-06-13 | 2006-06-13 | 冷却器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007335517A JP2007335517A (ja) | 2007-12-27 |
JP4554557B2 true JP4554557B2 (ja) | 2010-09-29 |
Family
ID=38831862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006163584A Expired - Fee Related JP4554557B2 (ja) | 2006-06-13 | 2006-06-13 | 冷却器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090145586A1 (ja) |
JP (1) | JP4554557B2 (ja) |
CN (1) | CN101461059B (ja) |
DE (1) | DE112007001422B4 (ja) |
WO (1) | WO2007145354A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5156658B2 (ja) | 2009-01-30 | 2013-03-06 | 株式会社日立製作所 | Lsi用電子部材 |
US7782616B1 (en) * | 2009-04-23 | 2010-08-24 | Delphi Technologies, Inc. | Heat-dissipating component having stair-stepped coolant channels |
CN109219326A (zh) * | 2018-11-16 | 2019-01-15 | 广东工业大学 | 一种喷雾散热装置 |
DE102020208705A1 (de) | 2020-07-13 | 2022-01-13 | Mahle International Gmbh | Brennstoffzellensystem |
DE102020208712A1 (de) | 2020-07-13 | 2022-01-13 | Mahle International Gmbh | Kühlsystem |
DE102020208704A1 (de) | 2020-07-13 | 2022-01-13 | Mahle International Gmbh | Brennstoffzellensystem |
DE102020210612A1 (de) | 2020-08-20 | 2022-02-24 | Mahle International Gmbh | Wärmeübertrageranordnung und Brennstoffzellenfahrzeug |
DE102021203315A1 (de) | 2021-03-31 | 2022-10-06 | Mahle International Gmbh | Kühlanordnung für ein Brennstoffzellensystem |
WO2022207345A1 (de) | 2021-03-31 | 2022-10-06 | Mahle International Gmbh | Kühlanordnung für ein brennstoffzellensystem |
DE102021206021A1 (de) | 2021-06-14 | 2022-12-15 | Mahle International Gmbh | Wärmeübertrager |
DE102021208676A1 (de) | 2021-08-10 | 2023-02-16 | Mahle International Gmbh | Kraftfahrzeug mit Brennstoffzelle |
DE102021210916A1 (de) | 2021-09-29 | 2023-03-30 | Mahle International Gmbh | Kühlanordnung für ein Brennstoffzellensystem |
JP7385329B1 (ja) | 2023-06-30 | 2023-11-22 | 株式会社関東技研 | 霧箱 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60136349A (ja) * | 1983-12-26 | 1985-07-19 | Hitachi Ltd | 半導体チップの冷却装置 |
JPH06252300A (ja) * | 1992-12-28 | 1994-09-09 | Hitachi Ltd | 冷却装置を備えた集積回路チップ及びその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2204181B (en) * | 1987-04-27 | 1990-03-21 | Thermalloy Inc | Heat sink apparatus and method of manufacture |
JPH0330457A (ja) * | 1989-06-28 | 1991-02-08 | Hitachi Ltd | 半導体装置の冷却方法および半導体装置 |
JP2822655B2 (ja) * | 1990-10-11 | 1998-11-11 | 日本電気株式会社 | 電子部品冷却機構 |
CA2053055C (en) * | 1990-10-11 | 1997-02-25 | Tsukasa Mizuno | Liquid cooling system for lsi packages |
US5220804A (en) * | 1991-12-09 | 1993-06-22 | Isothermal Systems Research, Inc | High heat flux evaporative spray cooling |
US5403783A (en) * | 1992-12-28 | 1995-04-04 | Hitachi, Ltd. | Integrated circuit substrate with cooling accelerator substrate |
DE19510124A1 (de) * | 1995-03-21 | 1996-09-26 | Km Europa Metal Ag | Austauscherrohr für einen Wärmeaustauscher |
US5924482A (en) | 1997-10-29 | 1999-07-20 | Motorola, Inc. | Multi-mode, two-phase cooling module |
US6175495B1 (en) * | 1998-09-15 | 2001-01-16 | John Samuel Batchelder | Heat transfer apparatus |
US6205799B1 (en) * | 1999-09-13 | 2001-03-27 | Hewlett-Packard Company | Spray cooling system |
US6920915B1 (en) * | 1999-10-02 | 2005-07-26 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus and method for cooling a semiconductor substrate |
DE10156374C1 (de) * | 2001-11-16 | 2003-02-27 | Wieland Werke Ag | Beidseitig strukturiertes Wärmeaustauscherrohr und Verfahren zu dessen Herstellung |
US7836706B2 (en) * | 2002-09-27 | 2010-11-23 | Parker Intangibles Llc | Thermal management system for evaporative spray cooling |
JP4128986B2 (ja) * | 2003-09-04 | 2008-07-30 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー. | 自立型噴霧冷却モジュール |
CN1898520B (zh) * | 2003-10-23 | 2012-06-13 | 沃尔弗林管子公司 | 用于制造强化传热表面的方法及工具 |
JP2005166751A (ja) * | 2003-11-28 | 2005-06-23 | Ngk Spark Plug Co Ltd | 半導体部品の冷却装置、冷却装置付き半導体部品及び半導体部品の冷却装置の製造方法 |
US20050183844A1 (en) * | 2004-02-24 | 2005-08-25 | Isothermal Systems Research | Hotspot spray cooling |
US7143816B1 (en) * | 2005-09-09 | 2006-12-05 | Delphi Technologies, Inc. | Heat sink for an electronic device |
US7461690B2 (en) * | 2005-09-27 | 2008-12-09 | Delphi Technologies, Inc. | Optimally shaped spreader plate for electronics cooling assembly |
-
2006
- 2006-06-13 JP JP2006163584A patent/JP4554557B2/ja not_active Expired - Fee Related
-
2007
- 2007-06-12 CN CN2007800210366A patent/CN101461059B/zh not_active Expired - Fee Related
- 2007-06-12 US US12/304,426 patent/US20090145586A1/en not_active Abandoned
- 2007-06-12 WO PCT/JP2007/062199 patent/WO2007145354A1/ja active Search and Examination
- 2007-06-12 DE DE112007001422T patent/DE112007001422B4/de not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60136349A (ja) * | 1983-12-26 | 1985-07-19 | Hitachi Ltd | 半導体チップの冷却装置 |
JPH06252300A (ja) * | 1992-12-28 | 1994-09-09 | Hitachi Ltd | 冷却装置を備えた集積回路チップ及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2007335517A (ja) | 2007-12-27 |
DE112007001422B4 (de) | 2012-09-20 |
WO2007145354A1 (ja) | 2007-12-21 |
CN101461059A (zh) | 2009-06-17 |
DE112007001422T5 (de) | 2009-04-23 |
US20090145586A1 (en) | 2009-06-11 |
CN101461059B (zh) | 2010-12-22 |
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