JP4533058B2 - 照明装置用反射板 - Google Patents

照明装置用反射板 Download PDF

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Publication number
JP4533058B2
JP4533058B2 JP2004264338A JP2004264338A JP4533058B2 JP 4533058 B2 JP4533058 B2 JP 4533058B2 JP 2004264338 A JP2004264338 A JP 2004264338A JP 2004264338 A JP2004264338 A JP 2004264338A JP 4533058 B2 JP4533058 B2 JP 4533058B2
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JP
Japan
Prior art keywords
opening
reflector
hole
substrate
plating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004264338A
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English (en)
Japanese (ja)
Other versions
JP2006080003A (ja
JP2006080003A5 (enExample
Inventor
喜彦 金山
浩二 中津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2004264338A priority Critical patent/JP4533058B2/ja
Publication of JP2006080003A publication Critical patent/JP2006080003A/ja
Publication of JP2006080003A5 publication Critical patent/JP2006080003A5/ja
Application granted granted Critical
Publication of JP4533058B2 publication Critical patent/JP4533058B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Optical Elements Other Than Lenses (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2004264338A 2004-09-10 2004-09-10 照明装置用反射板 Expired - Fee Related JP4533058B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004264338A JP4533058B2 (ja) 2004-09-10 2004-09-10 照明装置用反射板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004264338A JP4533058B2 (ja) 2004-09-10 2004-09-10 照明装置用反射板

Publications (3)

Publication Number Publication Date
JP2006080003A JP2006080003A (ja) 2006-03-23
JP2006080003A5 JP2006080003A5 (enExample) 2007-08-16
JP4533058B2 true JP4533058B2 (ja) 2010-08-25

Family

ID=36159270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004264338A Expired - Fee Related JP4533058B2 (ja) 2004-09-10 2004-09-10 照明装置用反射板

Country Status (1)

Country Link
JP (1) JP4533058B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4863193B2 (ja) * 2005-08-31 2012-01-25 スタンレー電気株式会社 半導体発光装置
US20090032829A1 (en) * 2007-07-30 2009-02-05 Tong Fatt Chew LED Light Source with Increased Thermal Conductivity
JP5064254B2 (ja) * 2008-01-30 2012-10-31 日東電工株式会社 光半導体素子封止用樹脂シートおよび光半導体装置
JP5077679B2 (ja) * 2008-02-29 2012-11-21 日立化成工業株式会社 貼り合わせ基板の製造方法
JP2010238596A (ja) * 2009-03-31 2010-10-21 Showa Denko Kk 照明装置
JP5394899B2 (ja) * 2009-11-19 2014-01-22 パナソニック株式会社 反射板
JP2013030599A (ja) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd 発光デバイスおよび照明器具
JP2022016915A (ja) * 2020-07-13 2022-01-25 国立大学法人愛媛大学 薄板ミラー構造体およびその製造方法、ならびに望遠鏡

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3227295B2 (ja) * 1993-12-28 2001-11-12 松下電工株式会社 発光ダイオードの製造方法
JP3675358B2 (ja) * 2001-05-17 2005-07-27 日立エーアイシー株式会社 表示体およびそれに使用したプリント配線板の製造方法
JP2003218401A (ja) * 2002-01-18 2003-07-31 Matsushita Electric Ind Co Ltd 半導体発光装置およびその製造方法
JP4307094B2 (ja) * 2003-02-04 2009-08-05 パナソニック株式会社 Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置

Also Published As

Publication number Publication date
JP2006080003A (ja) 2006-03-23

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