JP4528626B2 - ボールグリッドアレイテンプレートを充填する装置及び方法 - Google Patents

ボールグリッドアレイテンプレートを充填する装置及び方法 Download PDF

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Publication number
JP4528626B2
JP4528626B2 JP2004545151A JP2004545151A JP4528626B2 JP 4528626 B2 JP4528626 B2 JP 4528626B2 JP 2004545151 A JP2004545151 A JP 2004545151A JP 2004545151 A JP2004545151 A JP 2004545151A JP 4528626 B2 JP4528626 B2 JP 4528626B2
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Japan
Prior art keywords
ball
base plate
grid array
solder
ball grid
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Expired - Lifetime
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JP2004545151A
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English (en)
Japanese (ja)
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JP2006503437A (ja
JP2006503437A5 (https=
Inventor
ブーン チェウ ング
ウィン ウォー タム
イー テオー リム
Original Assignee
オーリジン テクノロジー プライベート リミテッド
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Publication of JP2006503437A publication Critical patent/JP2006503437A/ja
Publication of JP2006503437A5 publication Critical patent/JP2006503437A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2004545151A 2002-10-14 2003-10-13 ボールグリッドアレイテンプレートを充填する装置及び方法 Expired - Lifetime JP4528626B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200206254 2002-10-14
PCT/SG2003/000246 WO2004035253A1 (en) 2002-10-14 2003-10-13 An apparatus and method for filling a ball grid array template

Publications (3)

Publication Number Publication Date
JP2006503437A JP2006503437A (ja) 2006-01-26
JP2006503437A5 JP2006503437A5 (https=) 2007-02-15
JP4528626B2 true JP4528626B2 (ja) 2010-08-18

Family

ID=32105814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004545151A Expired - Lifetime JP4528626B2 (ja) 2002-10-14 2003-10-13 ボールグリッドアレイテンプレートを充填する装置及び方法

Country Status (6)

Country Link
US (1) US7458499B2 (https=)
JP (1) JP4528626B2 (https=)
CN (1) CN1703295A (https=)
AU (1) AU2003273208A1 (https=)
TW (1) TWI272708B (https=)
WO (1) WO2004035253A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006103766A1 (ja) * 2005-03-30 2006-10-05 Fujitsu Limited ボール捕捉装置、半田ボール配置装置、ボール捕捉方法、および半田ボール配置方法
KR20090096706A (ko) * 2006-11-22 2009-09-14 록코 벤처스 피티이 리미티드 향상된 볼 장착 장치 및 방법
CN101276759B (zh) * 2007-03-26 2012-10-10 矽品精密工业股份有限公司 焊球植球设备及其撷取装置
US20080308612A1 (en) * 2007-06-15 2008-12-18 Best Inc. Manual method for reballing using a solder preform
US7802901B2 (en) * 2007-09-25 2010-09-28 Cree, Inc. LED multi-chip lighting units and related methods
JP5056491B2 (ja) * 2007-11-02 2012-10-24 イビデン株式会社 半田ボール搭載装置
WO2009102281A1 (en) * 2008-02-14 2009-08-20 Aurigin Technology Pte Ltd Apparatus and method for solder ball filing
US7780063B2 (en) * 2008-05-15 2010-08-24 International Business Machines Corporation Techniques for arranging solder balls and forming bumps
SG157985A1 (en) * 2008-06-24 2010-01-29 Rokko Ventures Pte Ltd Method and apparatus for solder ball placement
CN102122606B (zh) * 2010-11-16 2012-07-18 上海微松工业自动化有限公司 一种晶圆级封装微球自动收集及供球循环设备
US8813350B2 (en) * 2011-06-03 2014-08-26 Seagate Technology Llc Solder ball pattern forming
CN102956513A (zh) * 2011-08-18 2013-03-06 深南电路有限公司 一种球栅阵列器件的植球方法、系统及其夹具
TWI476884B (zh) * 2012-11-21 2015-03-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
TWI469295B (zh) * 2012-11-21 2015-01-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
US8955735B2 (en) * 2013-05-17 2015-02-17 Zen Voce Corporation Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit
CN103418875A (zh) * 2013-08-20 2013-12-04 歌尔声学股份有限公司 自动植入锡球装置
US9120170B2 (en) * 2013-11-01 2015-09-01 Zen Voce Corporation Apparatus and method for placing and mounting solder balls on an integrated circuit substrate
CN104485300B (zh) * 2014-12-10 2017-11-24 华进半导体封装先导技术研发中心有限公司 磁性非对称型柱或核球的植球治具及植球方法
CN105855659B (zh) * 2016-06-27 2017-12-19 上海嘉强自动化技术有限公司 一种微型锡球焊接的送料装置
SG10201701738VA (en) * 2017-03-03 2018-10-30 Aurigin Tech Pte Ltd Apparatus And Method For Filling A Ball Grid Array
CN109300815A (zh) * 2018-10-12 2019-02-01 济南晶恒电子有限责任公司 圆柱形无脚器件引线自动装填机
CN109436848B (zh) * 2018-10-30 2020-09-29 立讯精密工业（滁州）有限公司 一种锡球送料机构
US11247285B1 (en) * 2020-04-03 2022-02-15 Seagate Technology Llc Fluidization of agglomerated solder microspheres
DE112021007378T5 (de) * 2021-03-24 2024-01-18 Fuji Corporation Lotkugel-Zuführungsvorrichtung und Lotkugel-Zuführungsverfahren

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5551216A (en) * 1994-09-14 1996-09-03 Vanguard Automation, Inc. Method and apparatus for filling a ball grid array
JP2792596B2 (ja) * 1994-11-07 1998-09-03 キヤノン電子株式会社 はんだチップの実装方法及び実装装置及び供給装置及び整列装置及び吸着ヘッド及び回路基板
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
WO2000054921A1 (en) 1999-03-17 2000-09-21 Novatec Sa Filling device and method for filling balls in the apertures of a ball-receiving element
US6276598B1 (en) * 1999-07-13 2001-08-21 Asm Assembly Automation Ltd. Method and apparatus for ball placement
JP3552610B2 (ja) 1999-10-22 2004-08-11 松下電器産業株式会社 導電性ボールの移載装置および移載方法並びに導電性ボールの供給装置および供給方法
JP3619410B2 (ja) * 1999-11-18 2005-02-09 株式会社ルネサステクノロジ バンプ形成方法およびそのシステム
JP4233190B2 (ja) 1999-11-30 2009-03-04 日立ビアメカニクス株式会社 はんだボールの搭載方法およびその装置
US6766938B2 (en) 2002-01-08 2004-07-27 Asm Assembly Automation Ltd. Apparatus and method of placing solder balls onto a substrate

Also Published As

Publication number Publication date
CN1703295A (zh) 2005-11-30
WO2004035253A1 (en) 2004-04-29
JP2006503437A (ja) 2006-01-26
US20060169743A1 (en) 2006-08-03
TWI272708B (en) 2007-02-01
AU2003273208A1 (en) 2004-05-04
TW200406051A (en) 2004-04-16
US7458499B2 (en) 2008-12-02

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