CN1703295A - 一种用于填充球栅极阵列模板的设备和方法 - Google Patents

一种用于填充球栅极阵列模板的设备和方法 Download PDF

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Publication number
CN1703295A
CN1703295A CNA2003801012631A CN200380101263A CN1703295A CN 1703295 A CN1703295 A CN 1703295A CN A2003801012631 A CNA2003801012631 A CN A2003801012631A CN 200380101263 A CN200380101263 A CN 200380101263A CN 1703295 A CN1703295 A CN 1703295A
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CN
China
Prior art keywords
ball
substrate
template
grid array
hopper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2003801012631A
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English (en)
Chinese (zh)
Inventor
黄文洲
谭永桦
林贻潮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AOLIGEN TECHNOLOGY Co Ltd
Original Assignee
AOLIGEN TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AOLIGEN TECHNOLOGY Co Ltd filed Critical AOLIGEN TECHNOLOGY Co Ltd
Publication of CN1703295A publication Critical patent/CN1703295A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CNA2003801012631A 2002-10-14 2003-10-13 一种用于填充球栅极阵列模板的设备和方法 Pending CN1703295A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG02062545 2002-10-14
SG200206254 2002-10-14

Publications (1)

Publication Number Publication Date
CN1703295A true CN1703295A (zh) 2005-11-30

Family

ID=32105814

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2003801012631A Pending CN1703295A (zh) 2002-10-14 2003-10-13 一种用于填充球栅极阵列模板的设备和方法

Country Status (6)

Country Link
US (1) US7458499B2 (https=)
JP (1) JP4528626B2 (https=)
CN (1) CN1703295A (https=)
AU (1) AU2003273208A1 (https=)
TW (1) TWI272708B (https=)
WO (1) WO2004035253A1 (https=)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101276759A (zh) * 2007-03-26 2008-10-01 矽品精密工业股份有限公司 焊球植球设备及其撷取装置
CN102105254A (zh) * 2008-06-24 2011-06-22 洛科企业有限公司 用于布置焊球的方法和设备
CN102122606A (zh) * 2010-11-16 2011-07-13 上海微松工业自动化有限公司 一种晶圆级封装微球自动收集及供球循环设备
CN102956513A (zh) * 2011-08-18 2013-03-06 深南电路有限公司 一种球栅阵列器件的植球方法、系统及其夹具
CN101743480B (zh) * 2006-11-22 2013-03-27 洛科企业有限公司 改进的球植入装置和方法
CN103418875A (zh) * 2013-08-20 2013-12-04 歌尔声学股份有限公司 自动植入锡球装置
CN105855659A (zh) * 2016-06-27 2016-08-17 上海嘉强自动化技术有限公司 一种微型锡球焊接的送料装置
CN109300815A (zh) * 2018-10-12 2019-02-01 济南晶恒电子有限责任公司 圆柱形无脚器件引线自动装填机
CN109436848A (zh) * 2018-10-30 2019-03-08 立讯精密工业（滁州）有限公司 一种锡球送料机构
CN110023020A (zh) * 2017-03-03 2019-07-16 奥利进科技有限公司 用于填充球栅阵列的设备和方法
CN116917074A (zh) * 2021-03-24 2023-10-20 株式会社富士 焊球供给装置及焊球供给方法

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WO2006103766A1 (ja) * 2005-03-30 2006-10-05 Fujitsu Limited ボール捕捉装置、半田ボール配置装置、ボール捕捉方法、および半田ボール配置方法
US20080308612A1 (en) * 2007-06-15 2008-12-18 Best Inc. Manual method for reballing using a solder preform
US7802901B2 (en) * 2007-09-25 2010-09-28 Cree, Inc. LED multi-chip lighting units and related methods
JP5056491B2 (ja) * 2007-11-02 2012-10-24 イビデン株式会社 半田ボール搭載装置
WO2009102281A1 (en) * 2008-02-14 2009-08-20 Aurigin Technology Pte Ltd Apparatus and method for solder ball filing
US7780063B2 (en) * 2008-05-15 2010-08-24 International Business Machines Corporation Techniques for arranging solder balls and forming bumps
US8813350B2 (en) * 2011-06-03 2014-08-26 Seagate Technology Llc Solder ball pattern forming
TWI476884B (zh) * 2012-11-21 2015-03-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
TWI469295B (zh) * 2012-11-21 2015-01-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
US8955735B2 (en) * 2013-05-17 2015-02-17 Zen Voce Corporation Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit
US9120170B2 (en) * 2013-11-01 2015-09-01 Zen Voce Corporation Apparatus and method for placing and mounting solder balls on an integrated circuit substrate
CN104485300B (zh) * 2014-12-10 2017-11-24 华进半导体封装先导技术研发中心有限公司 磁性非对称型柱或核球的植球治具及植球方法
US11247285B1 (en) * 2020-04-03 2022-02-15 Seagate Technology Llc Fluidization of agglomerated solder microspheres

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Publication number Priority date Publication date Assignee Title
US5551216A (en) * 1994-09-14 1996-09-03 Vanguard Automation, Inc. Method and apparatus for filling a ball grid array
JP2792596B2 (ja) * 1994-11-07 1998-09-03 キヤノン電子株式会社 はんだチップの実装方法及び実装装置及び供給装置及び整列装置及び吸着ヘッド及び回路基板
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
WO2000054921A1 (en) 1999-03-17 2000-09-21 Novatec Sa Filling device and method for filling balls in the apertures of a ball-receiving element
US6276598B1 (en) * 1999-07-13 2001-08-21 Asm Assembly Automation Ltd. Method and apparatus for ball placement
JP3552610B2 (ja) 1999-10-22 2004-08-11 松下電器産業株式会社 導電性ボールの移載装置および移載方法並びに導電性ボールの供給装置および供給方法
JP3619410B2 (ja) * 1999-11-18 2005-02-09 株式会社ルネサステクノロジ バンプ形成方法およびそのシステム
JP4233190B2 (ja) 1999-11-30 2009-03-04 日立ビアメカニクス株式会社 はんだボールの搭載方法およびその装置
US6766938B2 (en) 2002-01-08 2004-07-27 Asm Assembly Automation Ltd. Apparatus and method of placing solder balls onto a substrate

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101743480B (zh) * 2006-11-22 2013-03-27 洛科企业有限公司 改进的球植入装置和方法
CN101276759A (zh) * 2007-03-26 2008-10-01 矽品精密工业股份有限公司 焊球植球设备及其撷取装置
CN101276759B (zh) * 2007-03-26 2012-10-10 矽品精密工业股份有限公司 焊球植球设备及其撷取装置
CN102105254A (zh) * 2008-06-24 2011-06-22 洛科企业有限公司 用于布置焊球的方法和设备
CN102122606A (zh) * 2010-11-16 2011-07-13 上海微松工业自动化有限公司 一种晶圆级封装微球自动收集及供球循环设备
CN102122606B (zh) * 2010-11-16 2012-07-18 上海微松工业自动化有限公司 一种晶圆级封装微球自动收集及供球循环设备
CN102956513A (zh) * 2011-08-18 2013-03-06 深南电路有限公司 一种球栅阵列器件的植球方法、系统及其夹具
CN103418875A (zh) * 2013-08-20 2013-12-04 歌尔声学股份有限公司 自动植入锡球装置
CN105855659A (zh) * 2016-06-27 2016-08-17 上海嘉强自动化技术有限公司 一种微型锡球焊接的送料装置
CN105855659B (zh) * 2016-06-27 2017-12-19 上海嘉强自动化技术有限公司 一种微型锡球焊接的送料装置
CN110023020A (zh) * 2017-03-03 2019-07-16 奥利进科技有限公司 用于填充球栅阵列的设备和方法
CN110023020B (zh) * 2017-03-03 2021-08-31 奥利进科技有限公司 用于填充球栅阵列的设备和方法
CN109300815A (zh) * 2018-10-12 2019-02-01 济南晶恒电子有限责任公司 圆柱形无脚器件引线自动装填机
CN109436848A (zh) * 2018-10-30 2019-03-08 立讯精密工业（滁州）有限公司 一种锡球送料机构
CN109436848B (zh) * 2018-10-30 2020-09-29 立讯精密工业（滁州）有限公司 一种锡球送料机构
CN116917074A (zh) * 2021-03-24 2023-10-20 株式会社富士 焊球供给装置及焊球供给方法

Also Published As

Publication number Publication date
JP4528626B2 (ja) 2010-08-18
WO2004035253A1 (en) 2004-04-29
JP2006503437A (ja) 2006-01-26
US20060169743A1 (en) 2006-08-03
TWI272708B (en) 2007-02-01
AU2003273208A1 (en) 2004-05-04
TW200406051A (en) 2004-04-16
US7458499B2 (en) 2008-12-02

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Open date: 20051130