JP4527205B2 - 光学検査モジュール、及び統合プロセス工具内で基板上の粒子及び欠陥を検出するための方法 - Google Patents

光学検査モジュール、及び統合プロセス工具内で基板上の粒子及び欠陥を検出するための方法 Download PDF

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JP4527205B2
JP4527205B2 JP54189498A JP54189498A JP4527205B2 JP 4527205 B2 JP4527205 B2 JP 4527205B2 JP 54189498 A JP54189498 A JP 54189498A JP 54189498 A JP54189498 A JP 54189498A JP 4527205 B2 JP4527205 B2 JP 4527205B2
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substrate
inspection module
optical inspection
light
light beam
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キニー，パトリック・ディー
ラオ，ナガラジャ・ピー
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リアル・タイム・メトロジー，インコーポレーテッド
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Input (AREA)
  • Image Processing (AREA)
JP54189498A 1997-03-31 1998-03-30 光学検査モジュール、及び統合プロセス工具内で基板上の粒子及び欠陥を検出するための方法 Expired - Fee Related JP4527205B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4220297P 1997-03-31 1997-03-31
US60/042,202 1997-03-31
PCT/US1998/006222 WO1998044330A2 (en) 1997-03-31 1998-03-30 Optical inspection module and method for detecting particles and defects on substrates in integrated process tools

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JP2001519021A JP2001519021A (ja) 2001-10-16
JP2001519021A5 JP2001519021A5 (https=) 2006-01-05
JP4527205B2 true JP4527205B2 (ja) 2010-08-18

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US (1) US5909276A (https=)
EP (1) EP1016126B1 (https=)
JP (1) JP4527205B2 (https=)
KR (1) KR100540314B1 (https=)
AU (1) AU6942998A (https=)
WO (1) WO1998044330A2 (https=)

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EP1016126A2 (en) 2000-07-05
EP1016126A4 (en) 2009-04-01
US5909276A (en) 1999-06-01
JP2001519021A (ja) 2001-10-16
EP1016126B1 (en) 2018-12-26
KR100540314B1 (ko) 2006-01-10
WO1998044330A3 (en) 1998-12-23
KR20010005875A (ko) 2001-01-15
WO1998044330A2 (en) 1998-10-08

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