JP4525786B2 - 電子部品及び電子部品モジュール - Google Patents
電子部品及び電子部品モジュール Download PDFInfo
- Publication number
- JP4525786B2 JP4525786B2 JP2008090076A JP2008090076A JP4525786B2 JP 4525786 B2 JP4525786 B2 JP 4525786B2 JP 2008090076 A JP2008090076 A JP 2008090076A JP 2008090076 A JP2008090076 A JP 2008090076A JP 4525786 B2 JP4525786 B2 JP 4525786B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- resin substrate
- resin
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 70
- 229920005989 resin Polymers 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 230000003746 surface roughness Effects 0.000 claims description 22
- 239000011888 foil Substances 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 5
- 229910000510 noble metal Inorganic materials 0.000 claims description 5
- 239000010408 film Substances 0.000 description 27
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000000059 patterning Methods 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/033—Punching metal foil, e.g. solder foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
・試料金属箔:厚み200μmCu箔
・誘電体膜:スパッタリングによるBaTiO3膜形成
・アニール:酸素分圧pO2=−12atm雰囲気中、850℃×20min熱処理
・上部電極:スパッタリングによるCu膜形成後、フォトリソグラフィーによるパターンニング
・絶縁膜:ポリイミド塗布後、フォトリソグラフィーによるパターンニング
・端子電極:スパッタリングによるCu膜形成後、フォトリソグラフィーによるパターンニング
・個片コンデンササイズ:1mm×0.5mm
Claims (5)
- 第1の樹脂基板と第2の樹脂基板との間に挟み込むようにして埋め込まれる電子部品であって、
前記第1の樹脂基板に面する実装面と、
前記実装面に対向し、前記第2の樹脂基板に面する対向面と、
前記実装面と前記対向面とに交差する少なくとも1対の側面と
を備え、
支持基板と、前記支持基板の表面に設けられた誘電体膜と、前記誘電体膜の表面に設けられた上部電極とを有し、
前記側面の内で前記支持基板に係る部分のみの表面粗さRaが、15nm≦Ra≦5000nmである、電子部品。 - 前記側面の内で前記支持基板に係る部分のみの表面粗さRaが、20nm≦Ra≦3000nmである、請求項1に記載の電子部品。
- 前記支持基板がCu、Ni、Alの金属箔もしくは、それらの金属を少なくとも1種以上含む金属箔であるもの、またはSiあるいはセラミック基板の上にCu、Ni、Alもしくは貴金属、およびそれらの金属を少なくとも1種以上含む金属電極層を有する構造から構成されている、請求項1又は2に記載の電子部品。
- 前記実装面と前記対向面との間の厚みが1μm〜1000μmである、請求項1〜3のいずれか1項に記載の電子部品。
- 請求項1〜4のいずれか1項に記載の電子部品が、前記第1の樹脂基板と前記第2の樹脂基板との間に挟み込むようにして埋め込まれている電子部品モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008090076A JP4525786B2 (ja) | 2008-03-31 | 2008-03-31 | 電子部品及び電子部品モジュール |
US12/410,699 US8294036B2 (en) | 2008-03-31 | 2009-03-25 | Electronic component and electronic component module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008090076A JP4525786B2 (ja) | 2008-03-31 | 2008-03-31 | 電子部品及び電子部品モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009246100A JP2009246100A (ja) | 2009-10-22 |
JP4525786B2 true JP4525786B2 (ja) | 2010-08-18 |
Family
ID=41115404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008090076A Active JP4525786B2 (ja) | 2008-03-31 | 2008-03-31 | 電子部品及び電子部品モジュール |
Country Status (2)
Country | Link |
---|---|
US (1) | US8294036B2 (ja) |
JP (1) | JP4525786B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5903973B2 (ja) * | 2012-03-26 | 2016-04-13 | Tdk株式会社 | 電子部品内蔵基板及びその製造方法 |
JP2015146346A (ja) * | 2014-01-31 | 2015-08-13 | イビデン株式会社 | 多層配線板 |
JP6357856B2 (ja) * | 2014-05-12 | 2018-07-18 | Tdk株式会社 | 薄膜キャパシタ |
JP2016015432A (ja) * | 2014-07-03 | 2016-01-28 | イビデン株式会社 | 回路基板及びその製造方法 |
JP7351176B2 (ja) * | 2018-10-31 | 2023-09-27 | Tdk株式会社 | 薄膜キャパシタ及びその製造方法並びに電子部品内蔵基板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004031641A (ja) * | 2002-06-26 | 2004-01-29 | Nec Toppan Circuit Solutions Inc | 印刷配線板及びその製造方法並びに半導体装置 |
JP2007158186A (ja) * | 2005-12-07 | 2007-06-21 | Ngk Spark Plug Co Ltd | 誘電体積層構造体の製造方法、誘電体積層構造体、及び配線基板 |
JP2007266459A (ja) * | 2006-03-29 | 2007-10-11 | Tdk Corp | コンデンサの製造方法 |
JP2007329190A (ja) * | 2006-06-06 | 2007-12-20 | Tdk Corp | 誘電体素子 |
JP2008021980A (ja) * | 2006-06-15 | 2008-01-31 | Ngk Spark Plug Co Ltd | コンデンサ、配線基板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2501266B2 (ja) * | 1991-11-15 | 1996-05-29 | 株式会社東芝 | 半導体モジュ―ル |
DE19509262C2 (de) * | 1995-03-15 | 2001-11-29 | Siemens Ag | Halbleiterbauelement mit Kunststoffumhüllung und Verfahren zu dessen Herstellung |
JP2814477B2 (ja) * | 1995-04-13 | 1998-10-22 | ソニーケミカル株式会社 | 非接触式icカード及びその製造方法 |
US6853074B2 (en) * | 1999-12-27 | 2005-02-08 | Matsushita Electric Industrial Co., Ltd. | Electronic part, an electronic part mounting element and a process for manufacturing such the articles |
US6623844B2 (en) * | 2001-02-26 | 2003-09-23 | Kyocera Corporation | Multi-layer wiring board and method of producing the same |
JP5075308B2 (ja) * | 2001-07-11 | 2012-11-21 | 株式会社東芝 | セラミックス回路基板の製造方法 |
DE10310842B4 (de) * | 2003-03-11 | 2007-04-05 | Infineon Technologies Ag | Elektronisches Bauteil mit Halbleiterchip und Kunststoffgehäuse |
JP4058637B2 (ja) * | 2003-10-27 | 2008-03-12 | セイコーエプソン株式会社 | 半導体チップ、半導体装置、回路基板及び電子機器 |
US7259458B2 (en) * | 2004-08-18 | 2007-08-21 | Advanced Micro Devices, Inc. | Integrated circuit with increased heat transfer |
KR101248738B1 (ko) | 2005-12-07 | 2013-03-28 | 엔지케이 스파크 플러그 캄파니 리미티드 | 유전체 구조체, 유전체 구조체의 제조방법 및 유전체구조체를 포함한 배선기판 |
JP2007242851A (ja) | 2006-03-08 | 2007-09-20 | Toyobo Co Ltd | 部品内蔵多層基板 |
TWI387417B (zh) * | 2008-08-29 | 2013-02-21 | Ind Tech Res Inst | 電路板結構及其製作方法 |
-
2008
- 2008-03-31 JP JP2008090076A patent/JP4525786B2/ja active Active
-
2009
- 2009-03-25 US US12/410,699 patent/US8294036B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004031641A (ja) * | 2002-06-26 | 2004-01-29 | Nec Toppan Circuit Solutions Inc | 印刷配線板及びその製造方法並びに半導体装置 |
JP2007158186A (ja) * | 2005-12-07 | 2007-06-21 | Ngk Spark Plug Co Ltd | 誘電体積層構造体の製造方法、誘電体積層構造体、及び配線基板 |
JP2007266459A (ja) * | 2006-03-29 | 2007-10-11 | Tdk Corp | コンデンサの製造方法 |
JP2007329190A (ja) * | 2006-06-06 | 2007-12-20 | Tdk Corp | 誘電体素子 |
JP2008021980A (ja) * | 2006-06-15 | 2008-01-31 | Ngk Spark Plug Co Ltd | コンデンサ、配線基板 |
Also Published As
Publication number | Publication date |
---|---|
US8294036B2 (en) | 2012-10-23 |
JP2009246100A (ja) | 2009-10-22 |
US20090242257A1 (en) | 2009-10-01 |
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