JP4519086B2 - パッチアンテナおよび高周波デバイス - Google Patents
パッチアンテナおよび高周波デバイス Download PDFInfo
- Publication number
- JP4519086B2 JP4519086B2 JP2006050971A JP2006050971A JP4519086B2 JP 4519086 B2 JP4519086 B2 JP 4519086B2 JP 2006050971 A JP2006050971 A JP 2006050971A JP 2006050971 A JP2006050971 A JP 2006050971A JP 4519086 B2 JP4519086 B2 JP 4519086B2
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- JP
- Japan
- Prior art keywords
- dielectric substrate
- frequency
- layer
- patch
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
Description
2:信号導体
3:グランド層
4:高周波線路
5:スロット
6:パッチ電極
7:ビア導体
8:接地導体層
9:高周波部品
10:ワイヤーボンディング
11:蓋体
12:開口
13:反射導体層
T:グランド層と誘電体基板の第2の面との距離
Claims (7)
- 複数の層からなる誘電体基板と、該誘電体基板の第1の面に形成された信号導体と、前記誘電体基板内に前記信号導体と所定の間隔をもって形成されたグランド層とからなる高周波線路と、前記グランド層に形成されており、前記高周波線路に電磁気的に結合されたスロットと、前記誘電体基板の第2の面に前記スロットと対向して形成されたパッチ電極と、前記誘電体基板の前記グランド層と前記第2の面との間の層に形成されており、前記第2の面において前記パッチ電極を囲むように配置されている複数のビア導体とを備えており、前記グランド層と前記第2の面との距離が信号波長の1/4であることを特徴とするパッチアンテナ。
- 前記複数のビア導体に接地電位が供給されることを特徴とする請求項1記載のパッチアンテナ。
- 前記パッチ電極の前記高周波線路の高周波伝送方向の長さが信号波長の1/2であることを特徴とする請求項1記載のパッチアンテナ。
- 前記誘電体基板の前記グランド層と前記第2の面との間の層に前記ビア導体どうしを接続する接地導体層を備えていることを特徴とする請求項1記載のパッチアンテナ。
- 請求項1乃至請求項4のいずれかに記載のパッチアンテナを備える配線基板に、前記高周波線路と電気的に接続された高周波部品が搭載されていることを特徴とする高周波デバイス。
- 誘電体基板と、該誘電体基板の第1の面に形成された信号導体と、前記誘電体基板内に前記信号導体と所定の間隔をもって形成されたグランド層とからなる高周波線路と、前記グランド層に形成されており、前記高周波線路に電磁気的に結合されたスロットと、前記誘電体基板の第2の面に前記スロットと対向して形成されたパッチ電極と、前記誘電体基板の前記グランド層と前記第2の面との間の層に形成されており、前記スロットと前記第2の面との間に発生する表面波を抑制する複数のビア導体とを備えており、前記グランド層と前記第2の面との距離が信号波長の1/4であることを特徴とするパッチアンテナ。
- 請求項6に記載のパッチアンテナを備える配線基板に、前記高周波線路に電気的に接続された高周波部品が搭載されていることを特徴とする高周波デバイス。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006050971A JP4519086B2 (ja) | 2006-02-27 | 2006-02-27 | パッチアンテナおよび高周波デバイス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006050971A JP4519086B2 (ja) | 2006-02-27 | 2006-02-27 | パッチアンテナおよび高周波デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007235236A JP2007235236A (ja) | 2007-09-13 |
| JP4519086B2 true JP4519086B2 (ja) | 2010-08-04 |
Family
ID=38555424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006050971A Expired - Fee Related JP4519086B2 (ja) | 2006-02-27 | 2006-02-27 | パッチアンテナおよび高周波デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4519086B2 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008193161A (ja) * | 2007-01-31 | 2008-08-21 | Hitachi Kokusai Electric Inc | マイクロストリップ線路−導波管変換器 |
| JP5328566B2 (ja) * | 2009-08-26 | 2013-10-30 | 京セラ株式会社 | アンテナ基板およびicタグ |
| KR101256556B1 (ko) | 2009-09-08 | 2013-04-19 | 한국전자통신연구원 | 밀리미터파 대역 패치 안테나 |
| JP5681144B2 (ja) * | 2012-05-25 | 2015-03-04 | 日本電信電話株式会社 | 集積化パッチアンテナ |
| JP7019366B2 (ja) * | 2017-10-04 | 2022-02-15 | 株式会社ヨコオ | アンテナ装置 |
| DE112019004921T5 (de) | 2018-10-29 | 2021-06-17 | Murata Manufacturing Co., Ltd. | Antennenvorrichtung, antennenmodul, kommunikationsvorrichtung und radarvorrichtung |
| CN111585029B (zh) * | 2020-05-07 | 2024-11-29 | 华南理工大学 | 一种毫米波低剖面高增益差分喇叭天线 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3921177A (en) * | 1973-04-17 | 1975-11-18 | Ball Brothers Res Corp | Microstrip antenna structures and arrays |
| JPH01135107A (ja) * | 1987-11-19 | 1989-05-26 | Mitsubishi Electric Corp | マイクロストリップアンテナ |
| JPH04284004A (ja) * | 1991-03-13 | 1992-10-08 | Toshiba Corp | 平面アンテナ |
| JP3931504B2 (ja) * | 1999-11-02 | 2007-06-20 | 三菱電機株式会社 | マイクロストリップアンテナ |
| JP2003078337A (ja) * | 2001-08-30 | 2003-03-14 | Tokai Univ | 積層アンテナ |
| JP2004032321A (ja) * | 2002-06-25 | 2004-01-29 | Kyocera Corp | 高周波線路−導波管変換器 |
| JP2003204211A (ja) * | 2002-09-30 | 2003-07-18 | Nec Corp | マイクロ波・ミリ波回路装置 |
| JP2004153415A (ja) * | 2002-10-29 | 2004-05-27 | Kyocera Corp | 高周波線路−導波管変換器 |
| JP2005286435A (ja) * | 2004-03-26 | 2005-10-13 | Kyocera Corp | 高周波線路−導波管変換器 |
-
2006
- 2006-02-27 JP JP2006050971A patent/JP4519086B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007235236A (ja) | 2007-09-13 |
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