JP4510629B2 - 半導体デバイスの製造方法 - Google Patents
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- H—ELECTRICITY
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J3/00—Details of electron-optical or ion-optical arrangements or of ion traps common to two or more basic types of discharge tubes or lamps
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
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Description
図3から図9は、本発明による方法の実施形態による、図1のデバイスの製造の連続的な段階を、図2の断面図に対応して示す断面図である。ウエハ111は、従来の方法で製造される多数の半導体素子1,1’を備えるウエハ111は、(図3)から開始される。図3では単純さを期すため、半導体素子の内の1,1’の二つのみを示し、それらは光活性領域1Aを備える。キャリア本体14、ここではチャネル14Aを介してバキューム装置(図示せず)に接続される一対の板状バキュームピンセット14は、ウエハ111の上方に移動される。このバキューム装置に対して、接着剤層4を備える光透過性フォイル3が存在する。それらのフォイルは、ウエハ111の活性領域1Aに対して位置合わせされる。次に、ウエハ111上に存在する位置合わせ形状を使用してもよい。
1A 光活性部
1B 光非活性部
2 電気接続領域
3 本体(光透過フォイル)
4,18,19,21 接着剤層
5 本体
6 部品
8 導体パターン
9 ワイヤリンク
10 デバイス
11 半導体本体
12 絶縁外装
13 ダイ
14 キャリア本体(板状バキュームピンセット)
15 膜
16 リング
17 電気絶縁フレキシブルフォイル
20 キャリアフィルム
22 レーザビーム
24 UV放射
33 光透過性フィルム
34 溝
111 ウエハ
Claims (12)
- 光電子半導体素子を有する半導体デバイスを製造する方法であって、前記光電子半導体素子は、一つの表面が光活性部と非光活性部とを有する半導体本体を有し、前記非光活性部は前記光電子半導体素子の電気接続領域を有し、当該方法は、
前記半導体本体の前記表面の前記光活性部上に光透過性フォイルを配置する工程、
前記光透過性フォイルを光透過性接着剤層によって前記半導体本体の前記表面に固定する工程、及び
前記半導体本体の前記表面の前記光活性部上の前記光透過性フォイル内に、該フォイルをプロファイルダイでプレスすることによって、光学部品を形成する工程、
を有する、方法。 - 前記光透過性フォイル内に該フォイルを前記プロファイルダイでプレスすることによって光学部品が形成されるときに加熱する工程、を更に有する請求項1に記載の方法。
- 更なる光学部品を備える更なる本体を前記半導体本体に固定する工程であり、前記更なる光学部品が前記光透過性フォイルの上方に位置し且つ中空スペースによって前記光透過性フォイルから隔てられるように固定する工程、を更に有する請求項1に記載の方法。
- 前記更なる本体は、一端が前記フォイルに接着され且つ他端が前記更なる光学部品を備える円筒部を有する、請求項3に記載の方法。
- 前記光電子半導体素子を、一方の側が導体パターンを備える電気絶縁フレキシブルフォイルに固定する工程、
前記電気接続領域をワイヤリンクによって前記導体パターンに接続する工程、及び
前記ワイヤリンクを絶縁外装で包囲する工程、
を更に有する請求項1に記載の方法。 - 帯状又は矩形状の多数の前記光透過性フォイルを有するキャリア本体を設ける工程、
多数の前記光透過性フォイルの、前記キャリア本体とは反対側の面に、前記光透過性接着剤層を設ける工程、
多数の前記光電子半導体素子を含むウエハの上方に前記キャリア本体を移動させる工程、
多数の前記光透過性フォイルを有する前記キャリア本体を、多数の前記光電子半導体素子を含む前記ウエハに対して位置合わせする工程、
前記キャリア本体を前記ウエハにプレスすることによって、多数の前記光透過性フォイルを多数の前記光電子半導体素子に接着する工程、及び
前記キャリア本体を除去する工程、
を更に有する請求項1に記載の方法。 - 前記ウエハが前記光透過性フォイルを受け入れ且つ前記光学部品がその中に形成された後、当該方法は更に、
前記ウエハ内の多数の前記光電子半導体素子の各々に、更なる光学部品を備える更なる本体を取り付ける工程であり、前記更なる光学部品が前記光電子半導体素子の前記表面の前記光活性部の上方に位置付けられ且つ中空スペースによって前記光透過性フォイルから隔てられるように取り付ける工程、
を更に有する、請求項6に記載の方法。 - 前記ウエハを、前記光電子半導体素子の前記表面に対向する側で膜に固定する工程、
前記更なる光学部品が取り付けられた後、切断によって、前記ウエハを別個の前記光電子半導体素子に分割する工程、
を更に有する請求項7に記載の方法。 - 個々の前記光電子半導体素子を、一方の側が導体パターンを備える帯状電気絶縁フレキシブルフォイルに固定する工程、
前記電気接続領域をワイヤリンクによって前記導体パターンに接続する工程、
前記ワイヤリンクを外装で包囲する工程、及び
前記帯状電気絶縁フレキシブルフォイルを、各々が前記光電子半導体素子を有する複数の部分に分割する工程、
を更に有する請求項8に記載の方法。 - 多数の前記光透過性フォイルは、
UV放射によって分離され得る接着剤によってUV透過性キャリアフィルム上に光透過性フィルムを接着すること、
レーザビームによる切断によって前記光透過性フィルム内に多数の前記光透過性フォイルを形成すること、及び
前記光透過性フィルムの余剰部分を除去すること、
によって製造される、請求項6に記載の方法。 - 前記キャリア本体は前記UV透過性キャリアフィルムによって形成され、前記キャリア本体は、前記光透過性フィルムの前記余剰部分が除去され且つ多数の前記光透過性フォイルが前記ウエハに固定された後に、UV放射に露光されることによって除去される、請求項10に記載の方法。
- 前記キャリア本体は、前記光透過性フォイルを備える前記UV透過性キャリアフィルムを取り出す板状のバキュームピンセットによって形成され、その後、前記UV透過性キャリアフィルムはUV放射によって除去され、その後、前記光透過性フィルムの前記余剰部分は前記キャリア本体から剥離される、請求項10に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02078668 | 2002-09-09 | ||
PCT/IB2003/003645 WO2004023564A2 (en) | 2002-09-09 | 2003-08-11 | Optoelectronic semiconductor device and method of manufacturing such a device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005538545A JP2005538545A (ja) | 2005-12-15 |
JP4510629B2 true JP4510629B2 (ja) | 2010-07-28 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004533717A Expired - Fee Related JP4510629B2 (ja) | 2002-09-09 | 2003-08-11 | 半導体デバイスの製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7351951B2 (ja) |
EP (1) | EP1540740B1 (ja) |
JP (1) | JP4510629B2 (ja) |
KR (1) | KR20050038041A (ja) |
CN (1) | CN100550430C (ja) |
AU (1) | AU2003255926A1 (ja) |
TW (1) | TW200417048A (ja) |
WO (1) | WO2004023564A2 (ja) |
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-
2003
- 2003-08-11 AU AU2003255926A patent/AU2003255926A1/en not_active Abandoned
- 2003-08-11 CN CNB038213222A patent/CN100550430C/zh not_active Expired - Fee Related
- 2003-08-11 EP EP03793950.1A patent/EP1540740B1/en not_active Expired - Lifetime
- 2003-08-11 KR KR1020057003975A patent/KR20050038041A/ko not_active Application Discontinuation
- 2003-08-11 WO PCT/IB2003/003645 patent/WO2004023564A2/en active Application Filing
- 2003-08-11 US US10/526,867 patent/US7351951B2/en not_active Expired - Fee Related
- 2003-08-11 JP JP2004533717A patent/JP4510629B2/ja not_active Expired - Fee Related
- 2003-09-05 TW TW092124610A patent/TW200417048A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2005538545A (ja) | 2005-12-15 |
US7351951B2 (en) | 2008-04-01 |
AU2003255926A1 (en) | 2004-03-29 |
CN100550430C (zh) | 2009-10-14 |
EP1540740A2 (en) | 2005-06-15 |
US20050258350A1 (en) | 2005-11-24 |
EP1540740B1 (en) | 2019-06-12 |
AU2003255926A8 (en) | 2004-03-29 |
KR20050038041A (ko) | 2005-04-25 |
WO2004023564A3 (en) | 2005-01-13 |
CN1682376A (zh) | 2005-10-12 |
TW200417048A (en) | 2004-09-01 |
WO2004023564A2 (en) | 2004-03-18 |
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