JP2005538545A - 半導体デバイスおよび半導体デバイスの製造方法 - Google Patents
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Abstract
Description
図3から図9は、本発明による方法の実施形態による、図1のデバイスの製造の連続的な段階を、図2の断面図に対応して示す断面図である。ウエハ111は、従来の方法で製造される多数の半導体素子1,1’を備えるウエハ111は、(図3)から開始される。図3では単純さを期すため、半導体素子の内の1,1’の二つのみを示し、それらは光活性領域1Aを備える。キャリア本体14、ここではチャネル14Aを介してバキューム装置(図示せず)に接続される一対の板状バキュームピンセット14は、ウエハ111の上方に移動される。このバキューム装置に対して、接着剤層4を備える光透過性フォイル3が存在する。それらのフォイルは、ウエハ111の活性領域1Aに対して位置合わせされる。次に、ウエハ111上に存在する位置合わせ形状を使用してもよい。
1A 光活性部
1B 光非活性部
2 電気接続領域
3 本体(光透過フォイル)
4,18,19,21 接着剤層
5 本体
6 部品
8 導体パターン
9 ワイヤリンク
10 デバイス
11 半導体本体
12 絶縁外装
13 ダイ
14 キャリア本体(板状バキュームピンセット)
15 膜
16 リング
17 電気絶縁フレキシブルフォイル
20 キャリアフィルム
22 レーザビーム
24 UV放射
33 光透過性フィルム
34 溝
111 ウエハ
Claims (19)
- 光電子半導体素子を備え、前記光電子半導体素子は半導体本体を有し、前記半導体本体の表面に光活性部と非光活性部を有し、前記光活性部と前記非光活性部には前記光電子半導体素子の電気接続領域が配置され、前記半導体本体の表面の前記非活性部の上方には光学部品を備える本体が配置される半導体デバイスであって、前記本体は、内部に前記光学部品が形成され、前記半導体本体の表面の前記光活性部上に配置され、前記半導体本体の表面の前記光活性部に接続される光透過性フォイルを備える、ことを特徴とする半導体デバイス。
- 前記フォイルは、光透過性接着剤層によって前記半導体本体の表面に接続されることを特徴とする、請求項1に記載の半導体デバイス。
- 更なる本体が前記半導体本体に取り付けられ、前記更なる本体は、前記半導体本体の表面の前記非活性部の上方に更なる光学部品を備え、前記更なる光学部品は、中空スペースによって前記フォイルから分離されることを特徴とする、請求項1又は2に記載の半導体デバイス。
- 前記更なる本体は、一端が前記フォイルに接着し、他端が前記更なる光学部品を有する円筒部を備えることを特徴とする、請求項3に記載の半導体デバイス。
- 前記光電子半導体素子は、一方の側に導体パターンを備える電気絶縁フレキシブルフォイルに固定され、前記電気接続領域はワイヤリンクによって前記導体パターンに接続され、前記ワイヤリンクは絶縁外装に包囲されていることを特徴とする、請求項1,2,3又は4に記載の半導体デバイス。
- 前記光電子半導体素子は固体画像センサを備え、前記部品はレンズを備え、前記更なる部品は、レンズおよび赤外線放射を通さないフィルタの少なくとも一方を備えることを特徴とする、請求項1,2,3,4,5又は6に記載の半導体デバイス。
- 一つの面が光活性部と光非活性部を有する半導体本体を有する光電子半導体素子を備え、前記光活性部と前記非光活性部内に前記光電子半導体素子の電気接続領域が存在し、前記半導体本体の表面の前記光活性部の上方には、光学部品からなる本体が設けられる半導体デバイスの製造方法であって、内部に前記光学部品が形成され、前記半導体本体の表面の前記光活性部上に取り付けられる光透過性フォイルが、前記本体のために選択されることを特徴とする、半導体デバイスの製造方法。
- 前記光学部品は、光透過性接着剤層によって前記半導体本体の表面に固定されることを特徴とする、請求項7に記載の方法。
- 前記光学部品は、好ましくは同時に加熱しつつ、プロファイルダイで前記フォイルをプレスすることによってフォイルに形成されることを特徴とする、請求項7又は8に記載の方法。
- 更なる光学部品を備える更なる本体は、前記半導体本体に固定され、それによって前記更なる光学部品が前記光透過性フォイルの上方に位置し、中空スペースによって前記光透過性フォイルから分離されることを特徴とする、請求項7,8又は9に記載の方法。
- 前記更なる本体のために、一端が前記フォイルに接着し、他端が前記更なる光学部品を備える円筒部が選択されることを特徴とする、請求項10に記載の方法。
- 前記光電子半導体素子は一方の側に導体パターンを備える電気絶縁フレキシブルフォイルに固定され、前記電気接続領域はワイヤリンクによって前記導体パターンに接続され、前記ワイヤリンクは絶縁外装に包囲されることを特徴とする、請求項7,8,9,10又は11に記載の方法。
- キャリア本体は多数の帯状又は矩形状の光透過性フォイルを備え、前記光透過性フォイルは、前記キャリア本体から離れるような向きの側で前記接着剤層を受け入れ、前記キャリア本体は、多数の半導体素子を含むウエハの上方に移動し、前記フォイルを有する前記キャリア本体が半導体素子の前記ウエハに対して位置合わせされた後、前記フォイルは、前記キャリア本体を前記ウエハにプレスすることによって前記半導体素子に接着し、その後に前記キャリア本体が除去されることを特徴とする、請求項7,8,9,10,11又は12に記載の方法。
- 前記ウエハが前記光透過性フォイルを一旦受け入れ、前記光学部品がその中に一旦形成されると、更なる光学部品を備える更なる本体が前記ウエハ内の前記半導体素子の各々に取り付けられ、それによって前記更なる部品は前記半導体素子の表面の前記活性部の上方に配置され、中空スペースによって前記フォイルから分離されることを特徴とする、請求項13に記載の方法。
- 前記ウエハは、前記半導体素子の前記面に対向する側で膜に固定され、前記膜は、リング内に配置され、前記更なる光学部品が取り付けられた後、切断によって別個の半導体素子中に分割されることを特徴とする、請求項14に記載の方法。
- 個々の半導体素子は、一方の側が導体パターンを備える帯状電気絶縁フレキシブルフォイルに固定され、前記電気接続部はワイヤリンクによって前記導体パターンにリンクされ、前記ワイヤリンクは外装に包囲され、その後、前記帯状フレキシブルフォイルは、各々が半導体素子を有する部分に分割されることを特徴とする、請求項15に記載の方法。
- UV放射によって分離され得る接着剤によってUV透過性キャリアフィルム上に光透過性フィルムを接着し、レーザビームによる切断によって前記光透過性フィルムに帯状又は矩形状フォイルを形成することで前記フォイルが作られ、その後前記フィルムの余剰部分は、それから部分的に押圧除去又は完全に除去され得ることを特徴とする、請求項13,14,15又は16に記載の方法。
- 前記キャリア本体は前記UV透過性キャリアフィルムによって形成され、前記キャリア本体は前記フィルムの余剰部分が除去され、前記フォイルが前記ウエハに固定された後に、UV光に露光されることによって除去されることを特徴とする、請求項17に記載の方法。
- 前記キャリア本体は前記フォイルを備える前記UV透過性キャリアフィルムを取り出す板状のバキュームピンセットの対によって形成され、その後前記UV透過性キャリアフィルムはUV露光によって除去され、その後、前記フィルムの余剰部分は、前記キャリア本体から破断されることを特徴とする、請求項17に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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EP02078668 | 2002-09-09 | ||
PCT/IB2003/003645 WO2004023564A2 (en) | 2002-09-09 | 2003-08-11 | Optoelectronic semiconductor device and method of manufacturing such a device |
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JP2005538545A true JP2005538545A (ja) | 2005-12-15 |
JP4510629B2 JP4510629B2 (ja) | 2010-07-28 |
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US (1) | US7351951B2 (ja) |
EP (1) | EP1540740B1 (ja) |
JP (1) | JP4510629B2 (ja) |
KR (1) | KR20050038041A (ja) |
CN (1) | CN100550430C (ja) |
AU (1) | AU2003255926A1 (ja) |
TW (1) | TW200417048A (ja) |
WO (1) | WO2004023564A2 (ja) |
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- 2003-08-11 US US10/526,867 patent/US7351951B2/en not_active Expired - Fee Related
- 2003-08-11 JP JP2004533717A patent/JP4510629B2/ja not_active Expired - Fee Related
- 2003-08-11 AU AU2003255926A patent/AU2003255926A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
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AU2003255926A8 (en) | 2004-03-29 |
JP4510629B2 (ja) | 2010-07-28 |
US7351951B2 (en) | 2008-04-01 |
CN100550430C (zh) | 2009-10-14 |
AU2003255926A1 (en) | 2004-03-29 |
WO2004023564A2 (en) | 2004-03-18 |
KR20050038041A (ko) | 2005-04-25 |
EP1540740A2 (en) | 2005-06-15 |
WO2004023564A3 (en) | 2005-01-13 |
CN1682376A (zh) | 2005-10-12 |
US20050258350A1 (en) | 2005-11-24 |
EP1540740B1 (en) | 2019-06-12 |
TW200417048A (en) | 2004-09-01 |
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