JP4502130B2 - Manufacturing method of laminated electronic component - Google Patents

Description

  The present invention relates to a method for manufacturing a laminated electronic component.

  In general, a multilayer electronic component such as a multilayer ceramic capacitor is manufactured by the following process. First, an internal electrode pattern made of a conductive paste is formed on a ceramic green sheet. Next, a plurality of ceramic green sheets having internal electrode patterns are laminated to form a sheet laminate. And after pressing a sheet | seat laminated body, it cut | disconnects to a some chip | tip area | region and obtains a lamination | stacking green chip. Furthermore, well-known processes such as binder removal, firing and terminal electrode formation are performed on the multilayer green chip to obtain a multilayer electronic component.

  In the manufacturing process of such a laminated electronic component, the problem of a step due to the layer thickness of the internal electrode pattern cannot be ignored. As a technique for solving the problem of the step, a technique of forming a step absorption layer made of a ceramic paste around the internal electrode pattern is known (see Patent Document 1).

However, in the technique disclosed in Patent Document 1, the step absorption layer is formed on almost the entire surface where the internal electrode pattern is not formed. For this reason, when cut | disconnecting a sheet | seat laminated body later, a cutting blade will also enter a level | step difference absorption layer. The ceramic constituting the step absorption layer is harder than the conductor constituting the internal electrode pattern, and the cutting of the step absorption layer leads to an increase in cutting load as seen in the entire sheet laminate. When the cutting load of the sheet laminate is large, problems such as generation of cracks due to impact at the time of cutting, inclination of the cut surface, cutting deviation, and reduction in the life of the cutting blade are caused.
JP 2001-358036 A

  The subject of this invention is providing the manufacturing method of the laminated electronic component which can reduce the cutting load of a sheet | seat laminated body.

  In order to solve the above-described problem, in the method for manufacturing a multilayer electronic component according to the present invention, a plurality of internal electrode patterns are formed on one surface of the ceramic green sheet at intervals from each other when viewed in a certain direction. Further, a step absorption layer is formed in a region excluding a planned cutting line set based on the position of the internal electrode pattern in a region where the internal electrode pattern is not formed on the one surface of the ceramic green sheet. Further, a sheet laminate including at least one ceramic green sheet on which the internal electrode pattern and the step absorption layer are formed is prepared. Further, the sheet laminate is cut according to the planned cutting line.

  In the multilayer electronic component manufacturing method according to the present invention described above, a plurality of internal electrode patterns are formed on one surface of the ceramic green sheet at intervals from each other when viewed in a certain direction. Further, a step-absorbing layer is formed in a region excluding the planned cutting line set based on the position of the internal electrode pattern in the region where the internal electrode pattern is not formed on one surface of the ceramic green sheet. Therefore, a basic structure for absorbing a step due to the layer thickness of the internal electrode pattern can be obtained.

  Further, a sheet laminate including at least one ceramic green sheet on which the internal electrode pattern and the step absorption layer are formed is produced, and the sheet laminate is cut according to the above-described cutting line. Therefore, it becomes possible to put a cutting blade in the position where the level | step difference absorption layer is not formed, and this can reduce the cutting load of a sheet | seat laminated body. Therefore, problems such as generation of cracks due to impact at the time of cutting, inclination of the cut surface, cutting deviation, and reduction in the life of the cutting blade can be reduced.

  In one embodiment, the sheet laminate is produced in such a manner that the positions of the internal electrode patterns viewed in the length direction are alternately shifted. Further, in the region where the internal electrode pattern is not formed on the one surface of the ceramic green sheet, the step is formed in a region excluding a first planned cutting line set between the internal electrode patterns adjacent in the length direction. An absorption layer is formed.

  In another embodiment, the sheet laminate is produced in such a manner that the positions of the internal electrode patterns viewed in the length direction are alternately shifted. Of the region where the internal electrode pattern is not formed on the one surface of the ceramic green sheet, the first cutting planned line set between the internal electrode patterns adjacent in the length direction and the internal electrode viewed in the length direction The step absorption layer is formed in a region excluding the second planned cutting line set at the center of the pattern.

  As described above, according to the present invention, it is possible to provide a method for manufacturing a laminated electronic component that can reduce the cutting load on the sheet laminate.

  Hereinafter, an embodiment of a method for manufacturing a multilayer electronic component according to the present invention will be described. First, the multilayer electronic component will be described.

  FIG. 1 is a schematic cross-sectional view showing an example of a laminated electronic component to which the laminated electronic component manufacturing method according to the present invention can be applied. The illustrated multilayer electronic component includes a ceramic substrate 1 and n layers of internal electrodes 21 to 2n. In the illustrated embodiment, the manufacturing method according to the present invention is applied to a multilayer ceramic capacitor, but it can also be applied to other multilayer electronic components such as a multilayer inductor.

  The ceramic substrate 1 is made of, for example, a dielectric material mainly composed of barium titanate. The ceramic substrate 1 has a substantially rectangular parallelepiped shape having a length direction X, a width direction Y, and a thickness direction Z, and terminal electrodes 41 and 42 are provided on both end faces 160 and 170 viewed in the length direction X. ing.

  The internal electrode layers 21 to 2n are laminated with a gap in the thickness direction Z inside the ceramic substrate 1. Specifically, the internal electrodes 21 to 2 n are arranged with their positions viewed in the length direction X being alternately shifted, and are alternately led to both end surfaces 160 and 170 of the ceramic substrate 1.

  More specifically, the internal electrode 21 has a rectangular shape having a length direction X and a width direction Y when viewed in a plane, and one side viewed in the length direction X is led out to the end face 160 of the ceramic substrate 1. Are connected to the terminal electrode 41. The other side viewed in the length direction X is spaced from the other end face 170 of the ceramic substrate 1 in the length direction X.

  The next internal electrode 22 also has a rectangular shape having a length direction X and a width direction Y when viewed in plan, and one side viewed in the length direction X is spaced from the end surface 160 of the ceramic substrate 1 in the length direction X. The other side viewed in the length direction L is led out to the end face 170 of the ceramic substrate 1 and connected to the terminal electrode 42. The same applies to the remaining internal electrodes 23-2n.

  With such an internal electrode alternate arrangement structure, the internal electrodes and the blank areas are alternately positioned in both end portions 16 and 17 of the ceramic substrate 1 as viewed in the length direction X as viewed in the thickness direction Z. In addition, in the central portion 18 of the ceramic substrate 1 as viewed in the length direction X, only the internal electrodes are positioned as viewed in the thickness direction Z.

  The internal electrodes 21 to 2n are made of, for example, Ni or Cu. The number n of layers of the internal electrodes 21 to 2n can be set to an arbitrary value of 2 or more according to required characteristics. In the case of a multilayer ceramic capacitor, for example, there are 200 layers.

  Next, a method for manufacturing such a multilayer electronic component will be described.

  FIG. 2 is a diagram showing steps included in an embodiment of a method for manufacturing a laminated electronic component according to the present invention. Referring to FIG. 2, a ceramic green sheet (unfired ceramic sheet) 11 is shown. The ceramic green sheet 11 is made of a ceramic paste in which ceramic powder, a solvent, a binder, and the like are mixed, and has a certain thickness. The ceramic green sheet 11 is attached to a support (not shown) such as a flexible plastic film.

  Next, as shown in FIG. 2, a plurality of internal electrode patterns 20 are formed on one surface of the ceramic green sheet 11. These internal electrode patterns 20 are formed on the surface of the ceramic green sheet 11 so as to be spaced from each other in the length direction X and spaced from each other in the width direction Y. More specifically, the internal electrode patterns 20 each have a rectangular shape having a length direction X and a width direction Y, and are arranged in a matrix along the length direction X and the width direction Y. As a numerical example, the length of the internal electrode pattern 20 seen in the length direction X and the width seen in the width direction Y are 7.0 mm and 1.5 mm, and the interval seen in the length direction X and the width direction Y The observed intervals are 0.6 mm and 0.6 mm.

  Such an internal electrode pattern 20 is formed by printing a conductor paste in which a conductor powder, a solvent, a binder and the like are mixed in a predetermined pattern. The layer thickness of the internal electrode pattern 20 is 2 μm, for example.

  Furthermore, based on the position of the internal electrode pattern 20, first to third scheduled cutting lines P1 to P3 are set. First, the first and second scheduled cutting lines P1 and P2 are scheduled cutting lines along the width direction Y. The first planned cutting line P1 is set between the internal electrode patterns 20 adjacent in the length direction X. The second planned cutting line P2 is set at the center of the internal electrode pattern 20 viewed in the length direction X.

  Next, the third planned cutting line P3 is a planned cutting line along the length direction X. The third planned cutting line P3 is set between the internal electrode patterns 20 adjacent in the width direction Y.

  Next, as shown in FIG. 3, a step absorption layer 30 is formed on one surface of the ceramic green sheet 11. The step absorption layer 30 is formed in a region excluding the planned cutting line in a region where the internal electrode pattern 20 is not formed on one surface of the ceramic green sheet 11. In the case of the illustrated embodiment, the step absorbing layer 30 is formed in a region excluding the first planned cutting line P1 extending in the width direction Y and the third planned cutting line P3 extending in the length direction X.

  Specifically, the step absorption layer 30 is formed so as to surround each internal electrode pattern 20 for each internal electrode pattern 20. When viewed in the length direction X, these step absorption layers 30 are arranged at intervals with respect to the first planned cutting line P1, and when viewed in the width direction Y, these step absorption layers 30 are sandwiched with the third planned cutting line P3. They are arranged at intervals. The interval between the step absorption layers 30 in the first planned cutting line P1 or the third planned cutting line P3 will be described later. Regarding the second planned cutting line P2, the step absorption layer 30 is continuously formed across the second planned cutting line P2.

  Such a step absorption layer 30 is formed by printing a ceramic paste in a predetermined pattern. Examples of the printing method include screen printing, gravure printing, and offset printing. The step absorption layer 30 is basically composed of a ceramic paste having the same configuration as the ceramic green sheet 11. In addition, the layer thickness of the step absorption layer 30 is preferably set to be approximately the same as the layer thickness of the internal electrode pattern 20.

  In this embodiment, the formation of the step absorption layer (see FIG. 3) is performed after the formation of the internal electrode pattern (see FIG. 2), but the temporal order of the formation of the internal electrode pattern and the formation of the step absorption layer is as follows. The relationship is arbitrary. For example, the internal electrode pattern may be formed after the step absorption layer is formed, or the internal electrode pattern and the step absorption layer may be formed simultaneously.

  Next, as illustrated in FIG. 4, a sheet laminate including at least one ceramic green sheet 11 on which the internal electrode pattern 20 and the step absorption layer 30 are formed is manufactured. Specifically, a sheet laminate is manufactured using the ceramic green sheet 11 on which the internal electrode pattern 20 and the step absorption layer 30 are formed as unit layers 61 to 6n. The arrangement of the unit layers 61 to 6n in the production of the sheet laminate is as follows.

  First, paying attention to the length direction X, the unit layers 61 to 6n are arranged by alternately shifting the positions seen in the length direction X (offset lamination). Specifically, each of the unit layers 61 to 6n includes, in addition to the portion 81 where only the internal electrode pattern 20 is located in the stacking direction Z, the internal electrode pattern 20 and a blank area where the internal electrode pattern is not formed in the stacking direction Z. Arranged so that alternating portions 82 occur. More specifically, the portion 82 where the internal electrode pattern 20 and the blank area are alternately located is in the central portion of the internal electrode pattern 20 as viewed in the length direction X. Looking at two unit layers adjacent to each other in the stacking direction Z, the first planned cutting line P1 of one unit layer and the second planned cutting line P2 of the other unit layer overlap in the stacking direction Z. .

  Next, paying attention to the width direction Y, the unit layers 61 to 6n are arranged with their positions seen in the width direction Y aligned.

  Furthermore, although illustration is omitted, in the production of the sheet laminate, in addition to the unit layers 61 to 6n described above, a ceramic green sheet not provided with an internal electrode pattern is disposed as an outer unit layer. The outer unit layer is disposed outside the unit layers 61 to 6n when viewed in the stacking direction Z.

  As a method for producing a sheet laminate, ceramic green sheets 11 provided with internal electrode patterns 20 and step absorption layers 30 are prepared as unit layers 61 to 6n, and these unit layers 61 to 6n are sequentially laminated. Techniques can be employed. Alternatively, a method of producing a sheet laminate by repeating a ceramic green sheet forming process, an internal electrode pattern and a step absorption layer printing process, etc. on a flexible support as many times as necessary may be employed. .

  The sheet laminate obtained in this way is subjected to a pressure treatment.

  Next, as shown in FIG. 5, the sheet laminate is cut into a plurality of chip regions. Specifically, the sheet laminated body is cut along the length direction X and the width direction Y according to the above-described planned cutting line.

  First, cutting along the width direction Y will be described. The sheet laminate is cut along cutting lines C1 and C2 according to first and second scheduled cutting lines P1 and P2 (see FIG. 4).

  Next, the cutting along the length direction X will be described. The sheet laminate is cut along the cutting line C3 according to the third planned cutting line P3 (see FIG. 4).

  As a technique for cutting the sheet laminate, the sheet laminate using a rotary blade cutting method in which a disk-shaped cutting blade is rotated to cut the sheet laminate, or a cutting tool having a fixed cutting blade is used. It is possible to adopt a push-cut method that pushes down the. The thickness of the cutting blade is, for example, several tens of μm to several hundreds of μm.

  When the sheet laminate is cut in this manner, a laminated green chip is obtained. Furthermore, when steps such as binder removal, firing, and terminal electrode formation are performed, the multilayer electronic component shown in FIG. 1 is obtained.

  The above-described method for manufacturing a laminated electronic component will be described by paying attention to the arrangement of the internal electrode patterns 20 viewed in the length direction X. First, as shown in FIG. 2, a plurality of internal electrode patterns 20 are formed on one surface of the ceramic green sheet 11 at intervals from each other when viewed in the length direction X. Further, as shown in FIG. 3, the first planned cutting line set between the internal electrode patterns 20 adjacent in the length direction X in the region where the internal electrode pattern 20 is not formed on one surface of the ceramic green sheet 11. The step absorption layer 30 is formed in the region excluding P1. Therefore, a basic structure for absorbing a step due to the layer thickness of the internal electrode pattern 20 is obtained.

  Then, as shown in FIG. 4, after producing a sheet laminate including at least one ceramic green sheet 11 on which the internal electrode pattern 20 and the step absorption layer 30 are formed, as shown in FIG. Then, the cutting is performed according to the first planned cutting line P1. Therefore, the cutting blade can be put in a position where the step absorption layer 20 is not formed (position of the first planned cutting line P1). Thereby, the cutting load of a sheet laminated body, specifically, the cutting load at the time of cutting a sheet laminated body along the width direction Y can be reduced. Therefore, problems such as generation of cracks due to impact at the time of cutting, inclination of the cut surface, cutting deviation, and reduction in the life of the cutting blade can be reduced.

  From the point of view of cutting deviation, it is preferable that the interval between the step absorption layers 30 in the first planned cutting line P1 is set to a value smaller than the thickness of the cutting blade placed at the position of the first planned cutting line P1. .

  Further, either the internal electrode pattern 20 or the step absorption layer 30 is formed at the position of the first planned cutting line P1 by the internal electrode pattern formation step shown in FIG. 2 and the step absorption layer formation step shown in FIG. An area that will not be created. Therefore, in the stacking step shown in FIG. 4, air permeability in the stacking direction Z can be ensured through this region. For example, air comes out in the stacking direction Z. Therefore, delamination caused by air entrapment, for example, stacking deviation and generation of unevenness can be reduced, and stacking yield can be improved.

  Further, since the step absorption layer 30 is not formed at the position of the first planned cutting line P1, a slight depression is generated at the position of the first planned cutting line P1 when viewed from the entire sheet laminate. 4). Therefore, by specifying this recess by image processing and aligning the position of the cutting blade, high-accuracy cutting by image processing becomes possible. Therefore, the cutting yield can be improved.

  Next, a description will be given by paying attention to the arrangement of the internal electrode patterns 20 in the width direction Y. First, as shown in FIG. 2, a plurality of internal electrode patterns 20 are formed on one surface of the ceramic green sheet 11 at intervals from each other when viewed in the width direction Y. Further, as shown in FIG. 3, a third planned cutting line P <b> 3 set between the internal electrode patterns 20 adjacent in the width direction Y in the region where the internal electrode pattern 20 is not formed on one surface of the ceramic green sheet 11. A step absorption layer 30 is formed in the region excluding.

  And after producing a sheet | seat laminated body as shown in FIG. 4, as shown in FIG. 5, a sheet | seat laminated body is cut | disconnected according to the 3rd cutting projected line P3. Therefore, the cutting blade can be put in a position where the step absorption layer 20 is not formed (position of the third planned cutting line P3). Thereby, the cutting load of a sheet laminated body, specifically, the cutting load at the time of cutting a sheet laminated body along the length direction X can be reduced.

  From the point of view of cutting deviation, it is preferable to set the interval between the step absorption layers 30 in the third planned cutting line P3 to a value smaller than the thickness of the cutting blade placed at the position of the third planned cutting line P3. .

  Hereinafter, the operational effects relating to the third planned cutting line P3 are the same as those of the first planned cutting line P1. For example, the effect of improving air permeability is obtained, and cutting by image processing becomes possible. Therefore, redundant description is omitted.

  Further, in the illustrated embodiment, as the configuration of the sheet laminate, a configuration including a plurality of ceramic green sheets 11 having the step absorption layer 30 in the region excluding the planned cutting line is employed. It is not limited to such a configuration, and the number of layers of the ceramic green sheet 11 having the step absorption layer 30 in the region excluding the planned cutting line is arbitrary. This will be clear from the fact that the basic operation and effect can be obtained even in a configuration in which only one ceramic green sheet 11 having the step absorption layer 30 is provided in a region excluding the planned cutting line.

  FIG. 6 is a diagram showing steps included in another embodiment of the method for manufacturing a laminated electronic component according to the present invention. This embodiment also relates to a method for manufacturing the multilayer electronic component shown in FIG. In the figure, the same reference numerals are given to the components that are the same as the components that appeared in the previous embodiment, and redundant description will be omitted as much as possible.

  In the present embodiment, the step absorption layer 30 includes the first and second planned cutting lines P1 and P2 extending in the width direction Y and the length direction in a region where the internal electrode pattern 20 is not formed on one surface of the ceramic green sheet 11. It is formed in a region excluding the third planned cutting line P3 extending to X. As described above, the first scheduled cutting line P1 is a scheduled cutting line set between the internal electrode patterns 20 adjacent in the length direction X, and the second scheduled cutting line P2 has a length. This is a planned cutting line set at the center of the internal electrode pattern 20 as viewed in the direction X. The third planned cutting line P3 is a planned cutting line set between the internal electrode patterns 20 adjacent in the width direction Y.

  Specifically, the step absorption layer 30 is formed on both sides in the length direction X of the internal electrode pattern for each internal electrode pattern 20. When viewed in the length direction X, these step absorption layers 30 are arranged at intervals with the first planned cutting line P1 or the second planned cutting line P2 interposed therebetween. The interval between the step absorption layers 30 in the first and second planned cutting lines P1 and P2 will be described later.

  And after producing the sheet laminated body provided with the ceramic green sheet 11 in which the internal electrode pattern 20 and the level | step difference absorption layer 30 were formed at least one layer, the sheet laminated body is followed according to the 1st-3rd cutting plan lines P1-P3. Disconnect. About these points, it is the same as that of previous embodiment (refer FIG. 4, FIG. 5).

  As described with reference to FIG. 6, the step absorption layer 30 includes the first cutting planned line P <b> 1 set between the internal electrode patterns 20 adjacent to each other in the length direction X and the inside as viewed in the length direction X. The electrode pattern 20 is formed in a region excluding the second planned cutting line P2 set in the center portion. According to the configuration of such a step absorption layer, it is possible to further reduce the cutting load of the sheet laminated body, specifically, the cutting load when cutting the sheet laminated body along the width direction Y.

  From the point of view of cutting deviation, the distance between the step absorption layers 30 in the first and second planned cutting lines P1 and P2 is the thickness of the cutting blade to be placed at the positions of the first and second planned cutting lines P1 and P2. It is preferable to set a smaller value.

  Further, when viewed from the position of the second planned cutting line P2, the internal electrode pattern 20 is continuously formed across the second planned cutting line P2, and the step absorption layer 30 is formed by the second planned cutting line P2. It is formed with an interval across the line P2. That is, at the position of the second planned cutting line P2, only the step absorption layer 30 is spaced, and the internal electrode pattern 20 is not spaced.

  The ceramic constituting the step absorption layer 30 is harder than the conductor constituting the internal electrode pattern 20. Therefore, from the viewpoint of reducing the cutting load of the sheet laminated body, a considerable effect can be obtained even with a structure in which only the step absorption layer 30 is provided with an interval at the second planned cutting line P2.

  Furthermore, according to the structure in which the internal electrode pattern 20 is continuously formed across the second planned cutting line P2, even when the actual cutting blade position is shifted to some extent from the second planned cutting line P2, A state in which the cut end face of the internal electrode pattern 20 is exposed can be obtained. The cut end face of the internal electrode pattern 20 is useful for ensuring connectivity with the terminal electrode in the subsequent terminal electrode forming step.

It is typical sectional drawing which shows an example of the multilayer electronic component which can apply the manufacturing method of the multilayer electronic component which concerns on this invention. It is a figure which shows the process included in one Embodiment of the manufacturing method of the multilayer electronic component which concerns on this invention. It is a figure which shows the process after the process shown in FIG. FIG. 4 is a diagram showing a step after the step shown in FIG. 3. It is a figure which shows the process after the process shown in FIG. It is a figure which shows the process included in another embodiment of the manufacturing method of the multilayer electronic component which concerns on this invention.

Explanation of symbols

11 Ceramic Green Sheet 20 Internal Electrode Pattern 30 Step Absorption Layer

Claims (2)

A plurality of internal electrode patterns are formed on one surface of the ceramic green sheet, spaced apart from each other when viewed in a certain direction,
In the region where the internal electrode pattern is not formed on the one surface of the ceramic green sheet, a step absorption layer is formed in a region excluding the planned cutting line set based on the position of the internal electrode pattern,
Producing a sheet laminate comprising at least one layer of the ceramic green sheet on which the internal electrode pattern and the step absorption layer are formed;
Cutting the sheet laminate according to the planned cutting line;
The sheet laminate is produced in such a manner that the positions of the internal electrode patterns seen in the length direction are alternately shifted,
The step absorption layer is formed between a first planned cutting line P1 set between internal electrode patterns adjacent in the length direction X and internal electrode patterns adjacent in the width direction Y orthogonal to the length direction. Formed in a region excluding the third scheduled cutting line P3 set to
A first interval of the step absorption layer sandwiching the first cutting line P1, and the third distance between the third said step absorption layer sandwiching the cutting line P3 of each than the thickness of the cutting blade Is also set to a small value ,
In the sheet laminate, the ceramic green sheets appearing in each of the first interval and the third interval are all removed by the cutting using the cutting blade.
A method for manufacturing a laminated electronic component. A method for manufacturing a laminated electronic component according to claim 1,
The step absorption layer includes the first planned cutting line P1 and the third planned cutting line P3, and the second planned cutting line P2 set at the center of the internal electrode pattern as viewed in the length direction. Formed in the area excluding and
A first interval of the step absorption layer sandwiching the first scribing line P1, a second distance between the second said step absorption layer sandwiching the cutting line P2 of the third cutting line P3 The third interval between the step-absorbing layers sandwiched is set to a value smaller than the thickness of the cutting blade ,
In the sheet laminate, the ceramic green sheets appearing in the first to third intervals are all removed by the cutting using the cutting blade.
A method for manufacturing a laminated electronic component.