JP2005129612A - Manufacturing method of laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that ceramic sheets are torn and a structure defect such as delamination occurs since air tends to be accumulated between the adjacent ceramic green sheets when a green laminated body is to be manufactured by laminating the ceramic green sheet where a conductive paste film and a ceramic paste film for level difference absorption for absorbing a level difference by thickness of the conductive paste film are formed. <P>SOLUTION: Thickness in a W gap in the ceramic paste film for level difference absorption 26 is made thinner than the conductive paste film 25. A path 38 extending from one end face of the green laminated body to the other end face crossing a center is formed. Air is discharged to an outer part through the path 38. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and in particular, a conductive paste film is formed, and a step due to the thickness of the conductive paste film is absorbed, so that the conductive paste film is not formed. The present invention relates to a method for manufacturing a multilayer ceramic electronic component comprising a step of laminating ceramic green sheets in such a state in which a step-absorbing ceramic paste film is formed in a region.

  FIG. 9 is a cross-sectional view schematically showing a multilayer ceramic capacitor 1 as an example of a multilayer ceramic electronic component of interest to the present invention.

  The multilayer ceramic capacitor 1 includes a multilayer body 2. The multilayer body 2 includes a plurality of laminated ceramic layers 3 and internal conductor films 4 and 5 formed along a specific interface between the ceramic layers 3.

  External electrodes 6 and 7 are formed at opposite ends of the laminate 2, respectively. The internal conductor film 4 is electrically connected to one external electrode 6, and the internal conductor film 5 is electrically connected to the other external electrode 7. The internal conductor film 4 and the internal conductor film 5 are alternately arranged in the stacking direction via the ceramic layer 3 so as to form a capacitance between them.

  When an attempt is made to efficiently manufacture such a multilayer ceramic capacitor 1 on a factory scale, a mother-state green multilayer body from which a plurality of chip-shaped multilayer bodies 2 can be taken out by division is produced. The green laminate is a plurality of laminated ceramic green sheets to be the ceramic layer 3 and the inner conductor films 4 and 5, and is distributed at a plurality of locations on the specific ceramic green sheet. And a plurality of conductive paste films formed.

  The green laminated body in the mother state as described above can be taken out along a predetermined dividing line, whereby a plurality of raw laminated body chips can be taken out. These raw multilayer chips are fired to form the multilayer body 2, and then the external electrodes 6 and 7 are formed, whereby the desired multilayer ceramic capacitor 1 is obtained.

  In order to further improve the manufacturing efficiency of the multilayer ceramic capacitor 1, it is necessary to make the mother green laminate having a larger area so that a larger number of laminate chips can be taken out from one green laminate. It is valid.

  On the other hand, in the multilayer ceramic capacitor 1, in order to reduce the size and increase the capacity, the ceramic green sheet to be the ceramic layer 3 is being made thinner and multilayered and the conductive paste film is multilayered. However, as the thinning and the multi-layering progress, the step due to the thickness of the conductive paste film has a greater effect, and may cause problems such as delamination and cracking after firing. is there.

  Therefore, in order to solve the above-described problem, for the step absorption for absorbing the step due to the thickness of the conductive paste film in the region where the conductive paste film is not formed on the ceramic green sheet constituting the green laminate. A ceramic paste film is formed. For example, Patent Document 1 proposes forming the step-absorbing ceramic paste film 10 in a manner as shown in FIG.

  Referring to FIG. 10, a conductive paste film 13 to be the inner conductor films 4 and 5 is formed on a long ceramic green sheet 12 backed by a long carrier film 11. In order to absorb such a level difference due to the thickness of the conductive paste film 13, the step absorbing ceramic paste film 10 is formed in a stripe shape in a region where the conductive paste film 13 is not formed.

  As shown in FIG. 10, a long ceramic green sheet 12 on which a conductive paste film 13 and a step-absorbing ceramic paste film 10 are formed is sequentially cut along a cut line 14 indicated by a broken line, for example. Thus, a plurality of ceramic green sheets 17 having a predetermined size are taken out. The plurality of ceramic green sheets 17 are laminated as shown in FIG.

  As shown in FIG. 11 (1), the cut ceramic green sheet 17 is sucked and held based on vacuum suction through the suction holes 18 by the suction head 19 provided with a number of suction holes 18. Then, by the movement of the suction head 19, first, the ceramic green sheet 17 of a predetermined size is peeled from the carrier film 11, and then, as shown in FIG. 11 (1), from the already stacked ceramic green sheets 17. Then, the ceramic green sheets 17 held by the suction head 19 are stacked on the green laminate 20 as shown in FIG. 11 (2).

By repeating such a process a desired number of times, a green laminate 20 in which a desired number of ceramic green sheets 17 are laminated is obtained.
JP-A-11-97285

  However, when the ceramic green sheet 17 having a predetermined size shown in FIG. 10 is subjected to the laminating process shown in FIG. 11, the following problem may be encountered.

  First, as described above, the step-absorbing ceramic paste film 10 is formed in a stripe shape in the region where the conductive paste film 13 is not formed on the ceramic green sheet 17 of a predetermined size shown in FIG. Here, on the ceramic green sheet 17, there is a region where neither the step-absorbing ceramic paste film 10 nor the conductive paste film 13 is formed. This region includes the step-absorbing ceramic paste film 10 and the conductive paste. It is surrounded by any of the membranes 13 and is not open towards the end.

  Therefore, as shown in FIG. 11 (2), when the ceramic green sheets 17 are stacked on the green laminated body 20, air may not be discharged smoothly between the adjacent ceramic green sheets 17. In particular, air at the center of the green laminate 20 is likely to stay without being discharged. This tendency becomes more prominent when the planar size of the ceramic green sheet 17 is increased to, for example, 200 mm square or more. Such residual air in the green laminate 20 causes structural defects such as delamination.

  In addition, as described above, the air that tries to stay at the center of the green laminate 20 acts to deform the ceramic green sheet 17 more greatly in the portion covering the suction hole 18. As a result, the ceramic green sheet 17 may be deformed undesirably, or in the worst case, the ceramic green sheet 17 may be broken at the suction hole 18 as shown by a broken line in FIG. . Such breakage of the ceramic green sheet 17 causes a short circuit failure of the multilayer ceramic capacitor 1.

  In order to make the above-described problems less likely to occur, it is considered to lower the stacking speed, more specifically, the lowering speed of the suction head 19, that is, the speed at which the ceramic green sheet 17 is brought closer to the green stacked body 20. It is done. However, lowering the speed of the suction head 19 in this way is not preferable because it causes a reduction in productivity.

  Although the above description has been made in relation to the method of manufacturing the multilayer ceramic capacitor 1, the same problem is encountered in the method of manufacturing the multilayer ceramic electronic component other than the multilayer ceramic capacitor.

  Therefore, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component that can solve the above-described problems.

  In the present invention, a plurality of conductive paste films are formed so as to be distributed in a plurality of locations, and steps due to the thickness of the conductive paste film are absorbed. A method for producing a multilayer ceramic electronic component, comprising: a step of producing a ceramic green sheet in which a ceramic paste film is formed; and a step of producing a green laminate by laminating a plurality of ceramic green sheets. In order to solve the above technical problem, the present invention is characterized by having the following configuration.

  That is, in the ceramic paste film for step absorption on the ceramic green sheet, a path continuously extending so as to reach at least one end surface from the central portion of the green laminate is formed, and the step of producing the green laminate The method is characterized in that, when a plurality of ceramic green sheets are stacked, air that tends to stay between adjacent ceramic green sheets is discharged through the passage.

  The passage preferably extends from one end face of the green laminated body so as to cross the central portion and reach the other end face.

  Moreover, it is preferable that a plurality of passages are arranged in the main surface direction of the ceramic green sheet.

  The passage may be formed by partially reducing the thickness of the step-absorbing ceramic paste film or by not partially forming the step-absorbing ceramic paste film.

  The present invention is particularly advantageously applied when the ceramic green sheet is as thin as 3 μm or less after firing.

  Further, when the green laminate is for taking out a plurality of raw laminate chips for a plurality of multilayer ceramic electronic components from here, the green laminate is increased in size. The invention is particularly advantageously applied. In this case, a step of obtaining a plurality of raw laminate chips is further performed by dividing the green laminate.

  According to the method for manufacturing a multilayer ceramic electronic component according to the present invention, the step-absorbing ceramic paste film on the ceramic green sheet continuously extends so as to reach at least one end surface from the center of the green multilayer body. Since the passage is formed, when a plurality of ceramic green sheets are laminated in the process of producing the green laminated body, the air that stays between the adjacent ceramic green sheets, particularly in the central portion of the green laminated body. The air to be wrapped can be smoothly discharged through the passage.

  Accordingly, structural defects such as delamination and damage to the ceramic green sheet caused by residual air in the green laminate can be made difficult to occur, and a multilayer ceramic electronic component can be manufactured with a high yield. it can.

  Moreover, since it is not necessary to make the lamination | stacking speed | rate of a ceramic green sheet low in order not to produce the residue of air between ceramic green sheets, productivity can be maintained highly.

  In the present invention, if the passage extends from one end face of the green laminated body to reach the other end face across the central portion, or a plurality of passages are arranged in the main surface direction of the ceramic green sheet, Air can be discharged more smoothly.

  In this invention, for example, the thickness of the step-absorbing ceramic paste film is partially made relatively thin, or the step-absorbing ceramic paste film is not partially formed, so that the passage is formed. Thus, the passage can be formed more easily.

  Hereinafter, an embodiment of the present invention will be described in relation to a method of manufacturing the multilayer ceramic capacitor 1 shown in FIG.

  1 to 3 are for explaining a first embodiment of the present invention.

  Here, FIG. 1 shows a long composite sheet body in which a conductive paste film 25 and a step absorbing ceramic paste film 26 are formed on a long ceramic green sheet 24 backed by a carrier film 23. FIG.

  2 shows a ceramic green sheet 31 of a predetermined size taken out by cutting the long composite sheet body 27 shown in FIG. 1 along the cut line 28, and the conductive paste film 25 and steps formed thereon. 3 is a plan view showing an absorbent ceramic paste film 26. FIG. In FIG. 2, the ceramic green sheet 31 of a predetermined size is not shown hidden under the conductive paste film 25 and the step absorbing ceramic paste film 26.

  3 is an enlarged cross-sectional view of a part of the structure shown in FIG. 2, wherein (a) is a cross-section along line AA in FIG. 2, and (b) is a cross-section along line BB. , (C) shows a cross section along line CC, and (d) shows a cross section along line DD, respectively.

  As shown in FIG. 1, a long ceramic green sheet 24 lined with a carrier film 23 is prepared. The ceramic green sheet 24 becomes the ceramic layer 3 in the multilayer ceramic capacitor 1 shown in FIG. 9 after firing.

  Next, a plurality of conductive paste films 25 are formed on the ceramic green sheet 24 so as to be distributed at a plurality of locations. For example, a screen printing method, a gravure printing method, an ink jet printing method, or the like is applied to the formation of the conductive paste film 25. The conductive paste film 25 becomes the inner conductor films 4 and 5 in the multilayer ceramic capacitor 1 shown in FIG. 9 after firing.

  In the printing of the conductive paste film 25 described above, it is preferable that the register mark 34 and the stacking alignment mark 35 are printed simultaneously.

  Next, a step-absorbing ceramic paste film 26 is formed on the ceramic green sheet 24 in a region where the conductive paste film 25 is not formed. The step-absorbing ceramic paste film 26 is for absorbing a step due to the thickness of the conductive paste film 25. For the formation of the step-absorbing ceramic paste film 26, for example, a screen printing method, a gravure printing method, an inkjet printing method, or the like can be applied as in the case of the conductive paste film 25. When the step-absorbing ceramic paste film 26 is printed, the register mark 34 described above is used for alignment with the conductive paste film 25.

  The gap dimension between the conductive paste films 25 on which the step absorbing ceramic paste film 26 is to be formed varies depending on the size of the multilayer body 2 included in the multilayer ceramic capacitor 1 to be obtained, but is about 0.1 to 0.6 mm. is there.

  In this embodiment, the step-absorbing ceramic paste film 26 is characterized in that its thickness is partially different. More particularly, it is well illustrated in FIG.

  The step-absorbing ceramic paste film 26 is well illustrated in FIG. 3D at a gap (hereinafter referred to as “L gap”) adjacent to the end of the conductive paste film 25 in the longitudinal direction. Furthermore, although it has a thickness equivalent to that of the conductive paste film 25, a gap (hereinafter referred to as “W gap”) adjacent to the end portion in the width direction of the conductive paste film 25 is shown in FIG. As is well shown in b), the thickness is smaller than that of the conductive paste film 25.

  The thickness control as described above in the step absorbing ceramic paste film 26 can be performed as follows. That is, when the step-absorbing ceramic paste film 26 is formed by the screen printing method, the printing paste volume is controlled by the electroforming pattern, and thereby the printing thickness can be controlled. When the gravure printing method is applied, the printing thickness can be controlled by the opening area and / or shape of the cells formed on the printing plate. When the ink jet printing method is applied, the thickness can be controlled by controlling the discharge amount and / or discharge time of the ink per unit time.

  As described above, the thickness of the portion of the step-absorbing ceramic paste film 26 having a relatively small thickness located in the W gap is 1/3 to 2/3 of the thickness of the conductive paste film 25. Preferably, about 1/2 is more preferable.

  More specifically, when the thickness of the ceramic green sheet 24 is 3 μm in the thickness of the ceramic layer 3 after firing, the thickness of the conductive paste film 25 and the L gap portion of the step-absorbing ceramic paste film 26 are measured. The thickness is about 1.3 μm, and the thickness at the W gap portion of the step-absorbing ceramic paste film 26 is preferably about 0.6 μm.

  When the thickness of the ceramic green sheet 24 is 1.5 μm in terms of the thickness of the ceramic layer 3 after firing, the thickness of the conductive paste film 25 and the thickness of the L gap portion of the step absorbing ceramic paste film 26 are 1.0 μm. The thickness at the W gap portion of the step-absorbing ceramic paste film 26 is preferably about 0.5 μm.

  When the thickness of the ceramic green sheet 24 is 0.5 μm as the thickness of the ceramic layer 3 after firing, the thickness of the conductive paste film 25 and the thickness of the L gap portion of the step-absorbing ceramic paste film 26 are 0. The thickness at the W gap portion of the step-absorbing ceramic paste film 26 is preferably about 0.2 μm.

  In the above description, the conductive paste film 25 is formed first, and then the step absorbing ceramic paste film 26 is formed. However, the formation order may be reversed.

  Next, the long ceramic green sheets 24 are sequentially cut along the cut lines 28 shown by broken lines in FIG. 1, whereby a plurality of ceramic green sheets 31 having a predetermined size as shown in FIG. 2 are taken out. . The cutting process described above is performed while recognizing the position of the alignment mark 35 for stacking.

  Next, the plurality of ceramic green sheets 31 are laminated, thereby producing the green laminate 20 (see FIG. 11). In the process from taking out the ceramic green sheet 31 to stacking, the suction head 19 described above with reference to FIG. 11 is used.

  That is, the ceramic green sheets 31 of a predetermined size sucked and held by the suction head 19 are peeled off from the carrier film 23 and then, as shown in FIG. Then, as shown in FIG. 11B, the ceramic green sheets 31 held by the suction head 19 are stacked on the green laminate 20. At this time, the green laminate 20 may be lightly pressed in the laminating direction by the suction head 19 in order to prevent displacement between the laminated ceramic green sheets 31.

  In the above-described stacking process, the ceramic green sheets 31 are stacked using the position of the stacking alignment mark 35 recognized in the above-described cutting process as a reference.

  Since the step-absorbing ceramic paste film 26 is thinner than the conductive paste film 25 in the W gap portion, a groove-shaped passage 38 is formed in the W gap portion of the step-absorbing ceramic paste film 26. Is done. As shown in FIG. 2, the passage 38 extends from one end of the ceramic green sheet 31 so as to cross the central portion and reach the other end. Accordingly, when the green laminated body 20 is in the state, the passage 38 extends from one end face of the green laminated body so as to cross the central portion and reach the other end face. Further, since the passages 38 are formed in all the W gap portions of the step absorbing ceramic paste film 26, a plurality of passages 38 are arranged in the main surface direction of the ceramic green sheets 31 as shown in FIG.

  Such a passage 38 is shown by an arrow 39 in FIG. 2 in order to produce the green laminated body 20, the air that tries to stay between the adjacent ceramic green sheets 31 when a plurality of ceramic green sheets 31 are laminated. So that it can be discharged smoothly to the outside.

  In order to make the above-mentioned air discharge more perfect, in the laminating step, the speed at which the ceramic green sheet 31 to be laminated is brought closer to the already laminated green laminated body 20, that is, the laminating speed is higher. Although the lower one is preferable, the lamination speed is selected to be 0.3 to 30 mm / second, for example.

  Next, the green laminated body 20 obtained by finishing the laminating process as described above is pressed in the laminating direction and then subjected to a cutting process. In this cutting step, the green laminate 20 is divided so that a plurality of raw laminate chips that become a plurality of laminates 2 for the plurality of multilayer ceramic capacitors 1 are taken out from the green laminate 20. The

  Thereafter, the raw laminate chip is fired. As a result, the laminated body 2 after sintering is obtained, and the laminated body 2 is barrel-polished as necessary, and then the external electrodes 6 and 7 are formed to obtain the target multilayer ceramic capacitor 1.

  Next, experimental examples carried out to confirm the effects of the present invention will be described.

(1) Experimental example 1
In Experimental Example 1, multilayer ceramic capacitors according to Samples 1 to 4 as shown in Table 1 were produced.

  In Table 1, “Ceramic layer thickness” indicates the thickness of the ceramic layer after firing the used ceramic green sheet. When the “thickness of the ceramic layer” is 3 μm, the number of laminated inner conductor films is 250, and when the thickness is 1.5 μm, the number of laminated inner conductor films is 400. In addition, the size of the multilayer body included in the multilayer ceramic capacitor according to each sample was 2.0 mm in length, 1.25 mm in width, and 1.25 mm in thickness.

  In Table 1, “film thickness difference” means the difference between the thickness of the conductive paste film formed on the ceramic green sheet and the thickness at the W gap portion in the step-absorbing ceramic paste film, that is, the conductive paste. It shows how thin the W gap portion of the step-absorbing ceramic paste film is compared with the thickness of the film. The thickness at the L gap portion of the step-absorbing ceramic paste film was set to be equal to the thickness of the conductive paste film. Moreover, each width | variety of L gap and W gap was 0.4 mm.

  The tear occurrence rate in the laminating process of the ceramic green sheet on which the conductive paste film and the step absorbing ceramic paste film are formed as described above is shown in “sheet break occurrence rate”. In the lamination process, ceramic green sheets having a size of 225 mm × 225 m were laminated, and the lamination speed was set to 5 mm / second. Then, the stacking process was performed in a state where the ceramic green sheet was sucked and held by the suction head having a suction hole, and the “sheet breakage rate” at the “center” and “end” of the ceramic green sheet was obtained.

  In Table 1, as can be seen from the comparison between sample 1 and sample 2 and the comparison between sample 3 and sample 4, respectively, by providing a “film thickness difference”, the “sheet breakage rate particularly in the center” Can be reduced.

(2) Experimental example 2
Experimental Example 2 was performed to confirm that the “sheet breakage rate” can be further reduced by lowering the stacking speed in the stacking process for Sample 4 in Experimental Example 1 above.

  More specifically, in Example 1, as described above, the stacking speed was 5 mm / sec. This stacking speed was applied to the ceramic green sheet on which the conductive paste film and the step-absorbing ceramic paste film were formed. Only during the period from the start of stacking to the 30th stacking stage, it was lowered to 0.5 mm / second.

  As a result, in the sample 4 shown in Table 1 in which the lamination speed was 5 mm / second throughout the lamination process, the “sheet tear occurrence rate” in the “central portion” was 5%, as described above, When the stacking speed was lowered to 0.5 mm / second in the initial stage of stacking, the “sheet breakage occurrence rate” at the “center” could be 0%.

  Thus, by lowering the stacking speed, the air that tries to stay between the ceramic green sheets can be discharged more completely, and the “sheet breakage rate” can be further reduced. Note that the lowering of the stacking speed is sufficient only at the initial stage in the stacking process as in the above experimental example. This is because, every time the stacking is performed, the passages for discharging the air are accumulated in the stacking direction, and a deeper passage, that is, a passage that can discharge the air more smoothly is more easily formed.

  FIGS. 4 and 5 are for explaining a second embodiment of the present invention. FIG. 4 corresponds to FIG. 2, and FIG. 5 corresponds to FIG. 4 and 5, elements corresponding to those shown in FIGS. 2 and 3 are denoted by the same reference numerals, and redundant description is omitted.

  In the first embodiment described above, the step absorbing ceramic paste film 26 has a thickness smaller than that of the conductive paste film 25 in the W gap portion, but in this second embodiment, FIG. ), The step-absorbing ceramic paste film 26 is thinner than the conductive paste film 25 in the L gap portion. On the other hand, the W gap portion of the step-absorbing ceramic paste film 26 has a thickness equivalent to that of the conductive paste film 25 as well shown in FIG.

  According to the second embodiment, the groove-shaped passage 38 is formed in the L gap portion of the step-absorbing ceramic paste film 26. As shown in FIG. 4, a plurality of the passages 38 are arranged in the main surface direction of the ceramic green sheet 31, and extend so as to cross the central portion from one end of the ceramic green sheet 31 and reach the other end. Thus, in the stacking process, as shown by the arrow 39, air can be smoothly discharged to the outside.

  The selection of whether the passage 38 is formed in the W gap portion of the step absorbing ceramic paste film 26 as in the first embodiment or the passage 38 is formed in the L gap portion as in the second embodiment is as follows. Depending on which of the following takes precedence:

  That is, in FIG. 9, in order to prevent deformation of the lead portions of the inner conductor films 4 and 5 to the outer electrodes 6 and 7, it is preferable to form a passage 38 in the W gap portion, while the W gap portion. In order to prevent a structural defect in this case, it is preferable to form a passage 38 in the L gap portion. In general, since the W gap portion has a larger number than the L gap portion, it can be said that the passage 38 should be formed in the W gap portion for efficient air discharge.

  FIG. 6 is a view corresponding to FIG. 3 (b) for explaining the third embodiment of the present invention. In FIG. 6, elements corresponding to those shown in FIG. 3B are denoted by the same reference numerals, and redundant description is omitted.

  In the third embodiment shown in FIG. 6, the passage 38 is formed by further thinning a part of the W gap portion of the step absorbing ceramic paste film 26.

  FIG. 7 is a diagram corresponding to FIG. 3B for explaining the fourth embodiment of the present invention. In FIG. 7, elements corresponding to the elements shown in FIG. 3B are denoted by the same reference numerals, and redundant description is omitted.

  In the fourth embodiment shown in FIG. 7, the passage 38 is formed by not forming such a step absorbing ceramic paste film 26 in a part of the W gap portion of the step absorbing ceramic paste film 26. The

  In the third and fourth embodiments described above, the passage 38 is preferably set to be about 1/3 to 1/2 of the width direction dimension of the W gap.

  As a modification of the third and fourth embodiments, FIG. 6 and FIG. 7 may be a diagram corresponding to FIG. That is, as a modification of the third and fourth embodiments, the passage 38 may be formed in the L gap portion of the step-absorbing ceramic paste film 26.

  As still another modification, the passage 38 as shown in FIGS. 6 and 7 may be formed in both the W gap portion and the L gap portion of the step absorbing ceramic paste film 26.

  FIG. 8 is a view corresponding to FIG. 1 for explaining a fifth embodiment of the present invention. In FIG. 8, elements corresponding to those shown in FIG. 1 are denoted by the same reference numerals, and redundant description is omitted.

  In the fifth embodiment shown in FIG. 8, the ceramic green sheets 31 of a predetermined size that are taken out by cutting along the cut line 28 and used for the laminating process are enlarged, and a plurality of ceramic green sheets 31 are laminated. The green laminated body obtained by the above is then divided into four, and grooves 42 are formed along a cross-shaped dividing line for carrying out the four divisions. The groove 42 is formed by not forming the conductive paste film 25 and the step absorbing ceramic paste film 26 in this portion.

  The groove 42 functions to discharge air to the outside in the laminating process, like the passage 38 provided in the step absorbing ceramic paste film 26. Therefore, the groove 42 preferably has a wider width, and is, for example, about 0.5 to 2 mm wide.

In order to explain the first embodiment of the present invention, a conductive paste film 25 and a step-absorbing ceramic paste film 26 are formed on a long ceramic green sheet 24 lined with a carrier film 23. It is a top view which shows a part of elongate composite sheet body 27 in. A ceramic green sheet 31 of a predetermined size taken out by cutting the long composite sheet body 27 shown in FIG. 1 along the cut line 28, and the conductive paste film 25 and the step absorbing ceramic paste formed thereon. 3 is a plan view showing a film 26. FIG. It is sectional drawing which expands and shows a part of structure shown in FIG. 2, (a) is a cross section in alignment with line AA of FIG. 2, (b) is a cross section in alignment with line BB, (c). Indicates a cross section taken along the line CC, and (d) shows a cross section taken along the line DD. It is a figure corresponding to FIG. 2 for demonstrating the 2nd Embodiment of this invention. It is sectional drawing which expands and shows a part of structure shown in FIG. 4, (a) is a cross section in alignment with line AA of FIG. 4, (b) is a cross section in alignment with line BB, (c). Indicates a cross section taken along the line CC, and (d) shows a cross section taken along the line DD. It is a figure corresponding to FIG.3 (b) for demonstrating the 3rd Embodiment of this invention. It is a figure corresponding to FIG.3 (b) for demonstrating 4th Embodiment of this invention. It is a figure corresponding to FIG. 1 for demonstrating the 5th Embodiment of this invention. 1 is a cross-sectional view schematically showing a multilayer ceramic capacitor 1 as an example of a multilayer ceramic electronic component of interest to the present invention. It is a figure for demonstrating the prior art interesting to this invention, and is a figure corresponding to FIG. It is sectional drawing which shows the lamination | stacking process of the ceramic green sheet 17 of the predetermined size taken out by the cut along the cut line 14 shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Multilayer ceramic capacitor 2 Laminated body 3 Ceramic layer 4,5 Inner conductor film 17,31 Ceramic green sheet of predetermined size 18 Suction hole 19 Suction head 20 Green laminated body 23 Carrier film 24 Long ceramic green sheet 25 Conductive paste film 26 Step-absorbing ceramic paste film 27 Long composite sheet 28 Cut line 38 Passage 42 Groove

Claims (7)

A plurality of conductive paste films are formed so as to be distributed in a plurality of places, and a step due to the thickness of the conductive paste film is absorbed, so that a step absorbing ceramic paste is formed in a region where the conductive paste film is not formed. Forming a ceramic green sheet on which a film is formed;
A process of producing a green laminate by laminating a plurality of the ceramic green sheets,
In the step-absorbing ceramic paste film on the ceramic green sheet, a passage extending continuously from the central portion of the green laminate to at least one end surface is formed, and the green laminate is manufactured. In the step of, when laminating a plurality of the ceramic green sheets, the air that tries to stay between the adjacent ceramic green sheets is discharged through the passage.
Manufacturing method of multilayer ceramic electronic component.   2. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the passage extends from one end face of the green laminate so as to cross the central portion and reach the other end face.   3. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein a plurality of the passages are arranged in a main surface direction of the ceramic green sheet.   4. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein the passage is formed by partially reducing the thickness of the step-absorbing ceramic paste film.   4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the passage is formed by not partially forming the step-absorbing ceramic paste film.   The method for producing a multilayer ceramic electronic component according to claim 1, wherein the ceramic green sheet has a thickness of 3 μm or less after firing.   The green laminated body is for taking out a plurality of raw laminated chips for a plurality of laminated ceramic electronic components from here, and dividing the green laminated body into a plurality of raw laminated chips. The method for manufacturing a multilayer ceramic electronic component according to claim 1, further comprising a step of obtaining a multilayer chip.

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