JP2004186290A - Method of manufacturing laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that a belt region which becomes a part of a margin region is provided to a mother laminating material because the margin region where an internal electrode is not formed must be provided to an intermediate laminating material at its circumference, it becomes difficult to give uniform pressure in temporary pressure bonding or a final pressing process due to the existence of such a belt region and deviation occurs in the laminating and pressing processes when it is attempted that the intermediate laminating material in the intermediate size is obtained in a first stage and the laminating material is obtained to form the target laminating ceramic electronic component in a second stage by classifying the process to divide the mother laminating material into the two stages. <P>SOLUTION: On a region corresponding to the belt region 25 of the mother laminating material 11 in a ceramic green sheet 12, a plurality of dummy electrodes 27 are formed in distribution density which is substantially equal to that of an internal electrode 13. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to a method for manufacturing a multilayer ceramic electronic component, which includes a step of removing a multilayer chip for an individual multilayer ceramic electronic component from a mother multilayer. .
[0002]
[Prior art]
FIG. 9 is a cross-sectional view of a multilayer ceramic capacitor 1 as an example of a multilayer ceramic electronic component that is of interest to the present invention.
[0003]
The multilayer ceramic capacitor 1 includes a multilayer chip 4 including a plurality of ceramic layers 3 stacked with an internal electrode 2 interposed therebetween. Both ends of the multilayer chip 4 are electrically connected to a specific internal electrode 2. External electrode 5 is formed so as to be electrically connected.
[0004]
When manufacturing such a multilayer ceramic capacitor 1 on a factory scale, a mother multilayer body from which a plurality of multilayer chips 4 can be taken out by division is manufactured. The mother laminate includes a plurality of stacked ceramic green sheets to be ceramic layers 3 and a plurality of internal electrodes 2 formed at a plurality of locations on a specific ceramic green sheet.
[0005]
By dividing the mother laminate as described above along a predetermined division line, a plurality of laminate chips 4 can be taken out. These multilayer chips 4 are then fired, and then the external electrodes 5 are formed, whereby the desired multilayer ceramic capacitor 1 is obtained.
[0006]
In order to further improve the manufacturing efficiency of the multilayer ceramic capacitor 1, a larger number of mother laminates or a larger number of mother laminates can be used to increase the number of laminates from one mother laminate. It is effective to be able to take out the chip 4.
[0007]
However, as the size of the mother laminate is increased or the number of pieces to be taken is increased, the number of divisions that must be performed on one mother laminate, for example, the number of times of cutting by a cutting blade, in order to take out the laminate chip therefrom. Increase. At this time, since the cutting blade has a predetermined thickness, each time the cutting is performed, a positional shift corresponding to the thickness may occur in the mother laminate. This positional deviation is accumulated as the push-off operation is repeated. For this reason, as the number of times of pushing and cutting increases, in other words, as the size of the mother laminate is increased or the number of pieces to be taken is increased, the displacement generated in the pushing and cutting process by the cutting blade becomes larger. Tend.
[0008]
In order to solve such a problem, the step of dividing the mother laminate is divided into at least two stages, an intermediate laminate having an intermediate size is obtained in a first stage, and the intermediate laminate is divided in a second stage. It has been proposed to obtain a laminated chip by using a conventional method (for example, see Patent Document 1).
[0009]
The mother laminate is subjected to a pressing step before being divided into a plurality of laminate chips. In this pressing step, the raw ceramic contained in the mother laminate flows more or less, and therefore, the internal electrode 2 may be undesirably displaced or deformed.
[0010]
As described above, when the size of the mother laminate is increased or the number of pieces to be taken is increased, the flow of the raw ceramic is more likely to occur in the pressing step, and therefore, the displacement of the internal electrodes 2 in the mother laminate is reduced. And deformation are more likely to occur. As a result, in the laminated chip 1 obtained by dividing the mother laminated body, the specific internal electrode 2 and the external electrode 5 that should not be connected thereto are undesirably connected, A defect such as the electrode 2 being exposed on the side surface of the multilayer chip 4 may be caused.
[0011]
In order to solve this problem, a pressing step with a relatively high pressure is not performed at the stage of the mother laminate, and at least two steps of dividing the mother laminate are performed as in the case of the technique described in Patent Document 1 described above. It has been proposed to obtain an intermediate laminate having an intermediate size in the first stage, and to perform a pressing step with a relatively high pressure on the intermediate laminate (for example, see Patent Document 2).
[0012]
[Patent Document 1]
JP-A-9-129485
[Patent Document 2]
JP 2000-100655 A
[0013]
[Problems to be solved by the invention]
As described above, increasing the size or increasing the number of mother laminates makes it possible to take out more multilayer chips 4 therefrom, so that the efficiency of manufacturing the multilayer ceramic capacitor 1 can be improved. It is effective in improving the quality.
[0014]
On the other hand, when attention is paid to facilities in a factory that mass-produces the multilayer ceramic capacitor 1, it is designed to handle a mother laminate having a predetermined size. Therefore, if the size of the mother laminate is simply increased or the number of the mother laminates is increased, a situation may occur in which the conventionally used manufacturing equipment cannot be used as it is.
[0015]
However, as described above, the process of dividing the mother laminate is divided into at least two stages, and the dimensions of the intermediate laminate having the intermediate dimensions obtained in the first stage of division are handled in a conventional manufacturing facility. If the dimensions are set to be the same as the dimensions of the mother laminate, the intermediate laminate can be handled as it is by conventional manufacturing equipment.
[0016]
However, this intermediate laminate needs to satisfy the following conditions. This will be described with reference to FIG.
[0017]
FIGS. 10A and 10B illustrate a case where the mother laminate is divided into two stages. FIG. 10A illustrates the mother laminate 6 and FIG. 10B illustrates the intermediate laminate 7.
[0018]
In general, a mother laminate applied to a conventional manufacturing facility is provided with a margin region where an internal electrode is not formed at a peripheral portion of a ceramic green sheet provided therein. Therefore, in order for the intermediate laminated body 7 shown in FIG. 10B to be able to be handled by conventional manufacturing equipment in place of the conventional mother laminated body, the ceramic green sheet must also be provided at the periphery of the intermediate laminated body 7. It is necessary to provide a margin region 8 on which no internal electrode is formed.
[0019]
Therefore, as shown in FIG. 10A, a region corresponding to the above-described margin region 8 must be provided also in the mother laminated body 6 divided along the dividing line 9 to take out the intermediate laminated body 7. Must. As a result, in the mother laminate 6, a band-shaped region 10 to be a part of the margin region 8 is provided at a position where each of the division lines 9 passes, for example, so as to extend in a cross shape. Needless to say, in this band-shaped region 10, no internal electrode is formed on the ceramic green sheet at this position.
[0020]
However, as described above, the mother laminate 6 provided with the band-shaped region 10 on which the internal electrode is not formed has the following problem.
[0021]
First, in order to produce the mother laminate 6, a step of laminating a plurality of ceramic green sheets and, for each lamination, temporarily pressing the ceramic green sheets to be laminated on the already laminated ceramic green sheets is performed. Although it is performed, since the strip-shaped region 10 where the internal electrode is not formed exists, it is difficult to apply a uniform pressure over the entire surface of the ceramic green sheet in the temporary pressing step. For this reason, in the temporary press-bonding step, the stacking deviation of the ceramic green sheets may occur.
[0022]
In addition, after the lamination of the ceramic green sheets is completed, if a step of performing a main press on the obtained mother laminated body 6 at a pressure higher than the pressure in the temporary pressure bonding step is performed, the presence of the band-shaped region 10 Therefore, it is difficult to apply a uniform pressure over the entire area of the mother laminate 6. Therefore, a relatively large press distortion occurs in the mother laminated body 6, which may cause a relatively large displacement or deformation of the internal electrodes.
[0023]
The ceramic green sheet is generally formed into a sheet shape on a carrier film, and is subjected to a laminating step in a state where the ceramic green sheet is peeled off from the carrier film. However, an internal electrode to be the band-shaped region 10 is not formed on the ceramic green sheet. If an area exists, the force required for peeling changes abruptly in the area corresponding to the strip-shaped area 10. Therefore, when peeling, the ceramic green sheet may be wrinkled or the ceramic green sheet may be broken.
[0024]
Further, for example, when it is intended to obtain a multilayer ceramic capacitor with a reduced size and a larger capacity, the ceramic layers located between the internal electrodes are made thinner and multilayered. Therefore, the thickness of the ceramic green sheet can be reduced and the number of laminated ceramic green sheets can be increased. In this case, the physical thickness of the mother laminated body 6 between the portion where the internal electrode is located and the band-shaped region 10 where the internal electrode is not located is increased. The difference becomes large, and as a result, when the mother laminate 6 is pressed, a relatively large step is generated between the portion where the internal electrode is located and the strip region 10. Such a step causes a displacement or deformation of the internal electrode.
[0025]
Further, in the stage of producing the mother laminate 6, only the temporary press-bonding for each lamination of the ceramic green sheets is performed. When the main press step is performed in the stage of the intermediate laminate 7, the mother laminate 6 is removed from the intermediate laminate. In the vicinity of the dividing line 9 where the division for obtaining 7 is performed, the adhesion between the ceramic green sheets is low. Therefore, when the division along the division line 9 is performed, there is a case where the stacking deviation of the ceramic green sheets occurs.
[0026]
Further, as described above, when the main pressing step is not performed at the stage of the mother laminated body 6, in the dividing step along the dividing line 9 for obtaining the intermediate laminated body 7, debris of the ceramic green sheet is easily generated. . This debris adheres to the intermediate laminated body 7 when this pressing step is performed on the intermediate laminated body 7, and causes a structural defect of a multilayer ceramic electronic component such as the obtained multilayer ceramic capacitor. There is.
[0027]
Therefore, an object of the present invention is to solve the above-described problem in a method for manufacturing a multilayer ceramic electronic component employing a process as shown in FIG.
[0028]
[Means for Solving the Problems]
The method for manufacturing a multilayer ceramic electronic component according to the present invention includes a plurality of ceramic green sheets, including a plurality of ceramic green sheets on which a plurality of internal electrodes are formed so as to be distributed at a plurality of locations, A step of producing a mother laminate, a step of dividing the mother laminate along at least one primary dividing line to obtain a plurality of intermediate laminates, Is divided along each of the first secondary division line and the plurality of second secondary division lines orthogonal to the first secondary division line, thereby forming a plurality of individual divided ceramic electronic components. Obtaining a laminated chip.
[0029]
Further, each intermediate laminate is provided with a margin region where the internal electrode is not formed at the peripheral portion of the ceramic green sheet provided therein, and accordingly, the mother laminate has a margin region at a position where the primary division line passes. Is provided.
[0030]
In such a method for manufacturing a multilayer ceramic electronic component, in order to solve the above-described technical problem, the distribution density of the internal electrodes is substantially equal to the distribution density of the internal electrodes on a region corresponding to the band-shaped region of the mother laminate in a specific ceramic green sheet. A plurality of dummy electrodes are formed so as to extend over the primary division line and to be distributed at a plurality of locations along the primary division line with a substantially equal distribution density. , A plurality of dummy electrodes are exposed on the end face of the intermediate laminate appearing by dividing along the line.
[0031]
The dummy electrodes are preferably formed on all the ceramic green sheets on which the internal electrodes are formed.
[0032]
The dummy electrode preferably includes at least one of a longitudinal dimension and a width dimension that is the same as the internal electrode.
[0033]
Further, it is preferable that the interval between the plurality of dummy electrodes, the interval between the plurality of internal electrodes, and the interval between the dummy electrode and the internal electrode are the same when viewed in the same direction.
[0034]
The dummy electrodes may be formed with the same dimensions and the same arrangement as the internal electrodes. In this case, the dummy electrode and the internal electrode are apparently indistinguishable from each other. Therefore, from a different viewpoint, the internal electrode is to be used as a dummy electrode.
[0035]
The band-shaped region has, for example, a shape extending in a cross shape so as to divide the mother laminate into four.
[0036]
In the step of dividing the intermediate laminate along at least one of the first secondary division line and the second secondary division line, the dummy electrodes or the intervals between the dummy electrodes exposed on the end face of the intermediate laminate are provided. The step of sensing the position of the portion is performed, and the position of the sensed dummy electrode or the space between the dummy electrodes is divided along at least one of the first secondary division line and the second secondary division line. It may be used as a reference for the position to be made.
[0037]
It is preferable that the dummy electrode is also formed on a specific ceramic green sheet in a region corresponding to a peripheral portion of the mother laminate to be a part of a margin region of the intermediate laminate.
[0038]
In the above case, in the step of manufacturing the mother laminate, before the step of laminating the ceramic green sheets, the ceramic green is formed so that the dummy electrode formed on the region corresponding to the peripheral portion of the mother laminate is divided. Even if the step of cutting the peripheral portion of the sheet is performed, in the step of obtaining the intermediate laminate, the dummy electrode formed on the region corresponding to the peripheral portion of the mother laminate is cut off, A step of cutting the peripheral portion may be performed.
[0039]
In the step of producing the mother laminate, every time the ceramic green sheets are laminated, if the step of temporarily pressing the ceramic green sheets to be laminated on the already laminated ceramic green sheets is performed, the intermediate laminated body After the step of obtaining, the intermediate laminate may be further subjected to the step of main pressing at a pressure higher than the pressure of the temporary compression step, or in the step of producing a mother laminate, in addition to the above-described temporary compression step. After the step of laminating the ceramic green sheets, the main pressing step may be further performed on the mother laminate at a pressure higher than the pressure in the temporary pressing step.
[0040]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a method of manufacturing a multilayer ceramic capacitor as shown in FIG. 9 as an example of a multilayer ceramic electronic component will be described.
[0041]
1 to 3 illustrate a first embodiment of the present invention. Here, FIG. 1 is a plan view showing a ceramic green sheet 12 prepared for manufacturing the mother laminate 11 shown in FIG. 2, and FIG. 2 is a cross-sectional view of the mother laminate 11. FIG. 3 is an end view showing a part of the mother laminate 11. In FIG. 2, it is pointed out that the size in the thickness direction of the mother laminate 11 is illustrated in an exaggerated manner, and that the number of laminated ceramic green sheets 12 is smaller than the actual number.
[0042]
The ceramic green sheet 12 shown in FIG. 1 is formed into a sheet shape on a carrier film (not shown), and a plurality of internal electrodes 13 are formed thereon so as to be distributed at a plurality of locations in a matrix.
[0043]
FIG. 1 shows a mother laminate 11 obtained by laminating the ceramic green sheets 12 shown here, an intermediate laminate 14 obtained by dividing the same, and a laminate chip 15 obtained by dividing the same. The areas to be given respectively are indicated by their respective reference signs. FIG. 1 also shows cutting lines 16 a, 16 b, 17 a, 17 b, 18 and 19 showing cutting positions to be cut on the ceramic green sheets 12 to be laminated to produce the mother laminate 11. Primary dividing lines 20a, 20b and 21 where the division for taking out the intermediate laminated body 14 from the body 11 is performed, and a plurality of parallel lines that are divided for taking out the laminated chip 15 from the intermediate laminated body 14 A first secondary division line 22 and a plurality of second secondary division lines 23 orthogonal to the first secondary division line 22 are illustrated.
[0044]
Further, as shown in FIG. 2, the intermediate laminate 14 is provided with a margin region 24 where the internal electrode 13 is not formed in the peripheral portion of the ceramic green sheet 12 provided therein. Therefore, the mother laminated body 11 is provided with a band-shaped region 25 that becomes a part of the margin region 24 at a position where the primary division lines 20a, 20b, and 21 pass. In FIG. 1, a region corresponding to the band-shaped region 25 in the ceramic green sheet 12 is indicated by this reference numeral “25”. In this embodiment, as can be seen from FIG. 1, the belt-shaped region 25 has a shape extending in a cross shape so as to equally divide the mother laminate 11 into four.
[0045]
Further, a region of the ceramic green sheet 12 corresponding to the peripheral portion 26 of the mother laminate 11 which should be a part of the margin region 24 of the intermediate laminate 14 is also indicated by this reference numeral "26" in FIG. I have.
[0046]
As shown in FIG. 1, a plurality of dummy electrodes 27 are formed on a region of the ceramic green sheet 12 corresponding to the band-shaped region 25 of the mother laminate 11. Further, a plurality of dummy electrodes 27 are also formed on a region corresponding to the peripheral portion 26 of the mother laminate 11.
[0047]
The dummy electrodes 27 and the internal electrodes 13 are formed, for example, by applying a conductive paste on the ceramic green sheet 12 by printing and drying the paste.
[0048]
As can be seen from FIG. 1, the dummy electrodes 27 are formed with a distribution density substantially equal to the distribution density of the internal electrodes 13.
[0049]
In particular, in the dummy electrode 27 formed on the region corresponding to the band-like region 25, the dummy electrode 27 extends over the primary dividing lines 20a, 20b, and 21 and at a plurality of locations along the primary dividing lines 20a, 20b, and 21. It is formed so as to be distributed. Therefore, a plurality of dummy electrodes 27 are exposed on the end face of the intermediate laminated body 14 that appears by dividing the mother laminated body 11 along the primary dividing lines 20a, 20b, and 21.
[0050]
On the other hand, in the dummy electrode 27 formed on the area corresponding to the peripheral portion 26 of the mother laminate 11, cutting performed on the ceramic green sheets 12 laminated to produce the mother laminate 11 is performed. Are formed so as to span the cutting lines 16a, 16b, 17a, 17b, 18 and 19 and to be distributed at a plurality of locations along the cutting lines 16a, 16b, 17a, 17b, 18 and 19. ing. Therefore, after the peripheral portion of the ceramic green sheet 12 is cut so that these dummy electrodes 27 are separated, when the mother laminate 11 is obtained by laminating the ceramic green sheets 12, a plurality of pieces are formed on the end face of the mother laminate 11. The dummy electrodes 27 are exposed.
[0051]
The dummy electrodes 27 are preferably formed on all the ceramic green sheets 12 on which the internal electrodes 13 are formed, as shown in FIG.
[0052]
Further, it is preferable that the dummy electrode 27 includes an electrode which is the same as the internal electrode 13 in at least one of the longitudinal dimension and the width dimension.
[0053]
The distance between the plurality of dummy electrodes 27, the distance between the plurality of internal electrodes 13, and the distance between the dummy electrodes 27 and the internal electrodes 13 are the same when viewed in the same direction. Is preferred.
[0054]
These preferred embodiments make it difficult to cause a sudden change in the force required when the ceramic green sheet 12 is peeled off from the carrier film, and make it easier to apply a uniform pressure in the temporary pressing or main pressing step described later. This is advantageous in that
[0055]
Next, the mother laminated body 11 shown in FIG. 2 is manufactured by laminating a plurality of ceramic green sheets 12 including the plurality of ceramic green sheets 12 shown in FIG.
[0056]
More specifically, as shown in FIG. 2, after a proper number of ceramic green sheets 12 without the internal electrodes 13 and the like are formed, the internal electrodes 13 and the dummy electrodes 17 shown in FIG. 1 are formed. An appropriate number of ceramic green sheets 12 are stacked, and an appropriate number of ceramic green sheets 12 on which the internal electrodes 13 and the like are not formed are further stacked thereon. In such a laminating step, every time the ceramic green sheets 12 are laminated, a step of temporarily compressing the ceramic green sheets 12 to be laminated on the already laminated ceramic green sheets is performed.
[0057]
Since the dummy electrode 27 is formed in such a temporary press-bonding step, a uniform pressure can be applied to the entire surface of the ceramic green sheet 12, and therefore, a misalignment can be suppressed.
[0058]
In the temporary pressing step, a plurality of ceramic green sheets 12 are placed in a mold and a rigid pressing method is performed by pressing the ceramic green sheets 12 from above and below. Alternatively, a rigid body pressing method in which rubber is attached to the lower mold or a rigid body pressing method in which rubber is attached to both upper and lower molds can be applied.
[0059]
The ceramic green sheets 12 laminated to produce the mother laminate 11 are punched along the cutting lines 16a, 17a, 18 and 19 shown in FIG. A punched one along the line 19 is used, and these are alternately stacked. As a result, as shown in FIG. 2, the plurality of internal electrodes 13 are arranged in a zigzag manner in the stacking direction.
[0060]
On the other hand, the dummy electrodes 27 are arranged such that two dummy electrodes 27 are arranged for one internal electrode 13 in the direction of the cutting lines 18 and 19. Therefore, as described above, even if the internal electrodes 13 are arranged in a zigzag shape in the stacking direction, the plurality of dummy electrodes 27 exposed on the end faces extending along each of the cutting lines 18 and 19 of the mother stacked body 11 As shown in FIG. 3, they are aligned in the stacking direction. Further, the plurality of dummy electrodes 27 exposed on the end face extending along each of the cutting lines 16a or 16b and 17a or 17b of the mother laminated body 11 are also aligned in the laminating direction as shown in FIG. Become.
[0061]
At this stage, if the alignment state of the dummy electrodes 27 exposed on the end face of the mother laminate 11 is checked, it can be confirmed whether the ceramic green sheets 12 are properly laminated.
[0062]
The primary division lines 20a and 20b shown in FIG. 1 are located on the same line when the ceramic green sheets 12 are stacked such that the internal electrodes 13 are arranged in a zigzag pattern as described above. . Therefore, in the mother laminate 11 shown in FIG. 2, one primary dividing line 20 is illustrated as corresponding to the primary dividing lines 20a and 20b.
[0063]
As another embodiment, the ceramic green sheets 12 shown in FIG. 1 may be laminated as they are in order to produce the mother laminate 11 shown in FIG. In this case, when laminating, the positions at which the ceramic green sheets 12 are laminated are alternately shifted so that the internal electrodes 13 are arranged in a zigzag manner in the laminating direction. Then, in order to expose the dummy electrode 27, after the mother laminate 11 is obtained, the periphery thereof is cut.
[0064]
Next, the mother laminate 11 shown in FIG. 2 is divided along each of the primary dividing lines 20 and 21, whereby a plurality of, in this embodiment, four, intermediate laminates 14 are obtained. Can be In this division, for example, push cutting or dicing by a cutting blade is applied.
[0065]
Since the dummy electrode 27 is formed in the band-shaped region 25 through which the primary division lines 20 and 21 through which the division for obtaining the intermediate laminate 14 is to be performed pass, the band-shaped region is formed in the above-described temporary compression bonding step. Sufficient pressure can also be applied to 25. Therefore, even if the mother laminate 11 is divided along the primary dividing lines 20 and 21 in order to obtain the intermediate laminate 14, chips of the ceramic green sheets 12 are hardly generated.
[0066]
In the step of dividing the mother laminate 11 along the primary dividing lines 20 and 21, as shown in FIG. 3, the dummy electrodes 27 exposed between the end surfaces of the mother laminate 11 or the dummy electrodes 27 are separated from each other. It is preferable that the position of the gap is sensed, and the sensed position of the gap between the dummy electrodes 27 or the dummy electrodes 27 is used as a reference for the position to be divided along the primary division lines 20 and 21. . In this case, as shown by the thick frame in FIG. 3, selecting the space between the dummy electrodes 27 as the sensing area 28 is shorter than the dimension of the dummy electrode 27 itself, so that higher precision sensing is possible.
[0067]
Next, the intermediate laminate 14 is subjected to a main press at a pressure higher than the pressure in the above-described temporary press-bonding step. In this main press step, in addition to the above-described rigid press method or rigid rubber press method, a hydrostatic press method Can be applied.
[0068]
Also in this main pressing step, since the dummy electrode 27 is formed in the margin region 24 of the intermediate laminate 14, a uniform pressure can be applied over the entire area of the intermediate laminate 14. Dislocation is less likely to occur, and press distortion is less likely to occur, so that deformation and displacement of the internal electrode 13 are less likely to occur.
[0069]
The above-described pressing step may be performed at the stage of the mother laminate 11. In this case, after performing the main pressing step, a dividing step for obtaining the intermediate laminate 14 is performed.
[0070]
Next, each intermediate laminated body 14 is divided along a plurality of first secondary dividing lines 22 and second secondary dividing lines 23, respectively, so that a plurality of The step of obtaining the multilayer chip 18 is performed. In this division, for example, push cutting or dicing by a cutting blade is applied.
[0071]
Also, in the division for obtaining such a stacked chip 15, similarly to the exposed state of the dummy electrode 27 shown in FIG. 3, the dummy electrode 27 or the dummy electrode 27 exposed on the end face of the intermediate stacked body 14. A step of sensing the position of the space between the two is performed, and the position of the sensed dummy electrode 27 or the position of the space between the dummy electrodes 27 is to be divided along each of the secondary division lines 22 and 23. Is preferably used as a reference. Also in this case, it is more preferable to sense the space between the dummy electrodes 27 as in the sensing area 28 shown in FIG.
[0072]
Next, the laminated body chip 15 obtained as described above is fired. Thereby, the laminated chip 4 after sintering for the multilayer ceramic capacitor 1 shown in FIG. 9 is obtained. Next, when the external electrodes 5 are formed on the multilayer chip 4, a desired multilayer ceramic capacitor 1 is obtained.
[0073]
4 to 6 illustrate a second embodiment of the present invention. In FIGS. 4 to 6, elements corresponding to the elements shown in FIGS. 1 to 3 are denoted by the same reference numerals, and redundant description will be omitted. 4 is a view corresponding to FIG. 1, FIG. 5 is a front view of the mother laminate 11, and FIG. 6 is a right side view of the mother laminate 11.
[0074]
The second embodiment differs from the first embodiment in the dimensions of the dummy electrode 27.
[0075]
That is, the dummy electrodes 27 arranged along the cutting lines 18 and 19 and the primary dividing lines 21 include the dummy electrodes 27 having a size larger than the size of the internal electrodes 13, and include the dummy electrodes 27. The spacing between them is offset toward the end of the corresponding end face of the intermediate laminate 14.
[0076]
Further, the dimensions of the dummy electrodes 27 arranged along the cutting lines 16a, 16b, 17a and 17b are also made larger than the dimensions of the internal electrodes 13.
[0077]
In the second embodiment, when the mother laminate 11 is divided into the intermediate laminates 14, or when the intermediate laminate 14 is divided into the laminate chips 15, the positions to be divided are referred to in FIGS. As shown by broken lines, it is preferable that the positions 29 and 30 where the space between the dummy electrodes 27 is aligned in the stacking direction are used as sensing positions.
[0078]
As described above, by selecting the sensing positions 29 and 30, the distance between the sensing positions 29 and the distance between the sensing positions 30 become larger than the size of one stacked chip 15, and thus the sensing area shown in FIG. Even if the dimension of 28 is larger than the dimension of one laminated chip 15, it is possible to prevent the sensing positions 29 and 30 from being erroneously sensed.
[0079]
FIGS. 7 and 8 are views corresponding to FIG. 1 for describing third and fourth embodiments of the present invention, respectively. 7 and 8, elements corresponding to the elements shown in FIG. 1 are denoted by the same reference numerals, and redundant description will be omitted.
[0080]
The third and fourth embodiments are different from the first embodiment in the dimensions of the dummy electrode 27. The third and fourth embodiments do not particularly intend to use the dummy electrode 27 as a reference for the position to be divided.
[0081]
In the third embodiment shown in FIG. 7, the longitudinal dimension of the dummy electrodes 27 arranged along the cutting lines 18 and 19 and the primary dividing line 21 is the same as the longitudinal dimension of the internal electrode 13. is there. Further, the dummy electrodes 27 arranged along the cutting lines 16a, 16b, 17a and 17b and the primary dividing lines 20a and 20b have the same width dimension as the internal electrode 13 in the width direction.
[0082]
In the fourth embodiment shown in FIG. 8, the dummy electrodes 27 are all formed with the same dimensions and the same arrangement as the internal electrodes 13.
[0083]
Although the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.
[0084]
For example, in the illustrated embodiment, the mother laminate 11 is equally divided into four to obtain the intermediate laminate 14, but the division of the mother laminate for obtaining the intermediate laminate may be uneven. Good.
[0085]
The division of the mother laminate for obtaining the intermediate laminate is not limited to four divisions, but may be, for example, two to three divisions or five or more divisions.
[0086]
In the illustrated embodiment, the dummy electrode 27 is formed not only on the peripheral region 26 but also on the peripheral region 26 of the mother laminate 11. However, the dummy electrode 27 may be formed only on the peripheral region 25.
[0087]
Although the illustrated embodiment has been described in relation to the method of manufacturing the multilayer ceramic capacitor, the present invention is not limited to the multilayer ceramic capacitor, and functions as, for example, a resistor, an inductor, a varistor, a filter, a composite module, and the like. The present invention can also be applied to a method for manufacturing a multilayer ceramic electronic component.
[0088]
【The invention's effect】
As described above, according to the present invention, a mother laminate is first produced, and then the mother laminate is divided along a primary dividing line to obtain a plurality of intermediate laminates. In the method for manufacturing a multilayer ceramic electronic component, a plurality of multilayer chips for individual multilayer ceramic electronic components are obtained by dividing the multilayer body along a secondary division line. Is provided with a margin region where the internal electrode is not formed at the peripheral portion of the ceramic green sheet provided therein. Accordingly, the mother laminate should be a part of the margin region at a position where the primary division line passes. A strip region is provided.
[0089]
Therefore, even if the size of the mother laminate is increased, as for the intermediate laminate, conventional manufacturing equipment designed to handle a relatively small-sized mother laminate can be applied. Therefore, it is possible to increase the size of the mother laminate without changing the conventional manufacturing equipment, thereby increasing the number of laminate chips that can be taken out of the mother laminate. As a result, the multilayer ceramic electronic component Can improve the production efficiency.
[0090]
Further, according to the present invention, on a specific ceramic green sheet, on a region corresponding to the band-shaped region of the mother laminate, a plurality of dummy electrodes are provided with a distribution density substantially equal to the distribution density of the internal electrodes. On the end face of the intermediate laminate, which is formed so as to straddle the primary division line and be distributed at a plurality of locations along the primary division line, and appear when the mother laminate is divided along the primary division line A plurality of dummy electrodes are exposed.
[0091]
Therefore, in producing the mother laminate, when the ceramic green sheets to be laminated are temporarily press-bonded, uniform pressure can be applied over the entire surface of the ceramic green sheets. Can be.
[0092]
In addition, after the above-described temporary press-bonding process, in order to obtain an intermediate laminate, when dividing along the primary dividing line, sufficient pressure is applied even in the band-like region, so that dust of the ceramic green sheet is generated. Therefore, the possibility of structural defects of the multilayer ceramic electronic component due to the debris is reduced.
[0093]
Further, when the main laminate or the intermediate laminate is subjected to the main press at a pressure higher than the pressure in the temporary press-bonding step, a uniform pressure can be applied over the entire area of the intermediate laminate or the mother laminate. Even if the number of laminated ceramic green sheets is increased, press distortion is less likely to occur, undesired deformation and displacement of the internal electrodes is less likely to occur, and, in the mother laminate or the intermediate laminate, a band-shaped region or a margin region may be used. Can be made less likely to occur with the portion.
[0094]
In the present invention, when the dummy electrodes are formed on all the ceramic green sheets on which the internal electrodes are formed, the above-described effects are more reliably achieved.
[0095]
The dummy electrode may include one that is the same as the internal electrode in at least one of the longitudinal dimension and the width direction, or may include a gap between a plurality of dummy electrodes, a gap between a plurality of internal electrodes, and a dummy electrode. When the distance between the internal electrode and the internal electrode is the same when viewed in the same direction, the above-described effects are more reliably achieved, and the carrier film used in forming the ceramic green sheet The peeling of the ceramic green sheet from the ceramic green sheet can be smoothly performed, and therefore, at the time of such peeling, inconveniences such as wrinkling of the ceramic green sheet and breakage of the ceramic green sheet can be suppressed.
[0096]
Even if the dummy electrodes are formed with the same dimensions and the same arrangement state as the internal electrodes, not only the above-described effects are achieved, but also the dummy electrodes can be formed in the same manner as the internal electrodes. For example, the process of printing the internal electrodes can be efficiently performed, and there is no need to make any special design change in the equipment for printing to form the dummy electrodes.
[0097]
In the step of dividing the intermediate laminate along the secondary division line, the step of sensing the position of the dummy electrode or the interval between the dummy electrodes exposed on the end face of the intermediate laminate is performed, and the sensing is performed. When the position of the dummy electrode or the space between the dummy electrodes is used as a reference of the position to be divided, the position accuracy of the division can be improved, and the reference of the position to be divided with respect to the dummy electrode can be improved. The function to give can be added.
[0098]
When the dummy electrode is also formed on a region corresponding to the peripheral portion of the mother laminate to be a part of the margin region of the intermediate laminate in the ceramic green sheet, the above-described effect is more reliably achieved. You.
[0099]
In the above case, in the step of manufacturing the mother laminate, before the step of laminating the ceramic green sheets, the ceramic green is formed so that the dummy electrode formed on the region corresponding to the peripheral portion of the mother laminate is divided. In the step of cutting the peripheral portion of the sheet, or in the step of obtaining the intermediate laminate, the mother laminate is cut so that the dummy electrode formed on the region corresponding to the peripheral portion of the mother laminate is divided. When the step of cutting the periphery of the mother laminate is performed, the dummy electrode formed on the region corresponding to the periphery of the mother laminate can also be used as a reference for the position to be divided.
[Brief description of the drawings]
FIG. 1 is a plan view showing a ceramic green sheet 12 for explaining a first embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a mother laminate 11 obtained by laminating the ceramic green sheets 12 shown in FIG.
FIG. 3 is an end view showing a part of the mother laminate 11 shown in FIG. 2;
FIG. 4 is a plan view showing a ceramic green sheet 12 for explaining a second embodiment of the present invention.
FIG. 5 is a front view showing a mother laminate 11 obtained by laminating the ceramic green sheets 12 shown in FIG.
FIG. 6 is a right side view showing a mother laminate 11 obtained by laminating the ceramic green sheets 12 shown in FIG.
FIG. 7 is a plan view showing a ceramic green sheet 12 for explaining a third embodiment of the present invention.
FIG. 8 is a plan view showing a ceramic green sheet 12 for explaining a fourth embodiment of the present invention.
FIG. 9 is a cross-sectional view showing a multilayer ceramic capacitor 1 as an example of a multilayer ceramic electronic component that is of interest to the present invention.
10 (a) is a plan view showing a mother laminate 6, and FIG. 10 (b) is a plan view showing an intermediate laminate 7; FIG.
[Explanation of symbols]
11 Mother laminate
12 ceramic green sheets
13 Internal electrode
14 Intermediate laminate
15 Laminated chip
16a, 16b, 17a, 17b, 18, 19 Cutting line
20, 20a, 20b, 21 Primary dividing line
22 First secondary dividing line
23 Second secondary dividing line
24 Margin area
25 zonal area
26 Perimeter
27 Dummy electrode
28 Sensing area
29, 30 Sensing position

Claims (12)

Including a plurality of ceramic green sheets on which a plurality of internal electrodes are formed so as to be distributed at a plurality of locations, by laminating a plurality of ceramic green sheets, a step of producing a mother laminate,
Dividing the mother laminate along at least one primary dividing line to obtain a plurality of intermediate laminates;
By dividing the intermediate laminate along a plurality of first secondary division lines parallel to each other and a plurality of second secondary division lines orthogonal to the first secondary division line, Obtaining a plurality of multilayer chips for individual multilayer ceramic electronic components,
Each of the intermediate laminates is provided with a margin region where the internal electrode is not formed at a peripheral portion of the ceramic green sheet provided therein, and accordingly, the mother laminate has a position where the primary division line passes. A band-shaped area to be a part of the margin area is provided;
On a specific ceramic green sheet, on a region corresponding to the band-shaped region of the mother laminate, a plurality of dummy electrodes are provided with a distribution density substantially equal to the distribution density of the internal electrodes, and An end face of the intermediate laminate, which is formed so as to straddle a division line and be distributed at a plurality of positions along the primary division line, and appears by dividing the mother laminate along the primary division line. A plurality of the dummy electrodes are exposed above,
A method for manufacturing a multilayer ceramic electronic component. The method of claim 1, wherein the dummy electrode is formed on all the ceramic green sheets on which the internal electrodes are formed. 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the dummy electrode includes one having the same dimension as the internal electrode in at least one of a longitudinal dimension and a width dimension. The distance between the plurality of dummy electrodes, the distance between the plurality of internal electrodes, and the distance between the dummy electrodes and the internal electrodes are the same as each other when viewed in the same direction. 4. The method for manufacturing a multilayer ceramic electronic component according to any one of 1 to 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the dummy electrode is formed with the same dimensions and the same arrangement state as the internal electrodes. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the band-shaped region has a shape extending in a cross shape so as to divide the mother laminate into four. In the step of dividing the intermediate laminate along at least one of the first secondary division line and the second secondary division line, the dummy electrode or the dummy electrode exposed on an end face of the intermediate laminate A step of sensing the position of the gap between the dummy electrodes is performed, and the sensed position of the dummy electrode or the gap between the dummy electrodes is determined by the first secondary dividing line and the second secondary line. 7. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the method is used as a reference for a position to be divided along at least one of the division lines. The said dummy electrode is also formed in the area | region corresponding to the peripheral part of the said mother laminated body which should become a part of the said margin area | region of the said intermediate laminated body in the said specific ceramic green sheet. The method for producing a multilayer ceramic electronic component according to any one of the above. In the step of producing the mother laminate, before the step of laminating the ceramic green sheets, the ceramic electrode is formed such that the dummy electrode formed on a region corresponding to a peripheral portion of the mother laminate is divided. The method for manufacturing a multilayer ceramic electronic component according to claim 8, wherein a step of cutting a peripheral portion of the green sheet is performed. In the step of obtaining the intermediate laminated body, a step of cutting the peripheral part of the mother laminated body is performed so that the dummy electrode formed on a region corresponding to the peripheral part of the mother laminated body is divided. The method for manufacturing a multilayer ceramic electronic component according to claim 8. In the step of producing the mother laminate, every time the ceramic green sheets are laminated, a step of temporarily pressing the ceramic green sheets to be laminated is performed on the already laminated ceramic green sheets, The multilayer ceramic electronic device according to any one of claims 1 to 10, further comprising, after the step of obtaining the intermediate laminate, a step of main-pressing the intermediate laminate at a pressure higher than the pressure in the temporary compression bonding step. The method of manufacturing the part. In the step of producing the mother laminate, each time the ceramic green sheets are laminated, a step of temporarily pressing the ceramic green sheets to be laminated on the ceramic green sheets already laminated, and The multilayer ceramic electronic component according to any one of claims 1 to 10, further comprising, after the step of laminating the sheets, a step of fully pressing the mother laminate at a pressure higher than the pressure in the temporary pressing step. Manufacturing method.

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