JP4360081B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to a method for manufacturing a multilayer ceramic electronic component comprising a step of taking a multilayer chip for each multilayer ceramic electronic component from a mother multilayer body. .
[0002]
[Prior art]
FIG. 9 is a sectional view showing a multilayer ceramic capacitor 1 as an example of the multilayer ceramic electronic component of interest to the present invention.
[0003]
The multilayer ceramic capacitor 1 includes a multilayer chip 4 including a plurality of ceramic layers 3 stacked with an internal electrode 2 interposed therebetween, and a specific internal electrode 2 is electrically connected to both ends of the multilayer chip 4. External electrodes 5 are formed so as to be connected to each other.
[0004]
When such a multilayer ceramic capacitor 1 is to be manufactured on a factory scale, a mother multilayer body in which a plurality of multilayer chips 4 can be taken out by division is produced. The mother laminate includes a plurality of laminated ceramic green sheets to be the ceramic layer 3 and a plurality of internal electrodes 2 formed in a plurality of locations on a specific ceramic green sheet.
[0005]
The mother laminated body as described above can take out a plurality of laminated body chips 4 by dividing the mother laminated body along a predetermined dividing line. These multilayer chips 4 are then fired, and then external electrodes 5 are formed, whereby a desired multilayer ceramic capacitor 1 is obtained.
[0006]
In order to further improve the production efficiency of the multilayer ceramic capacitor 1, a larger number of laminated bodies can be obtained from one mother laminated body by making the mother laminated body have a larger area or by increasing the number of parts to be taken. It is effective to be able to take out the chip 4.
[0007]
However, the larger the mother laminated body or the larger the number of parts to be taken, the more the number of divisions that must be performed on one mother laminated body, for example, the number of press cuts with a cutting blade, in order to take out the laminated chip from there. Will increase. At this time, since the cutting blade has a predetermined thickness, a positional shift corresponding to this thickness may occur in the mother laminate every time the cutting blade is cut. This misalignment is accumulated as the push-off is repeated. For this reason, the greater the number of press cuts, in other words, the larger the mother laminate or the greater the number of cuts, the greater the displacement that occurs in the press cutting process with the cutting blade. Tend.
[0008]
In order to solve such problems, the process of dividing the mother laminate is divided into at least two stages, an intermediate laminate having an intermediate size is obtained in the first stage, and the intermediate laminate is divided in the second stage thereafter. It has been proposed to obtain a laminated chip (for example, see Patent Document 1).
[0009]
Further, the mother laminate is subjected to a pressing process before being divided into a plurality of laminate chips. In this pressing process, the raw ceramic contained in the mother laminate is more or less fluidized, which may cause undesired displacement and deformation of the internal electrode 2.
[0010]
As described above, when the mother laminate is increased in size or the number is increased, raw ceramic flow is more likely to occur in the pressing process. Therefore, the displacement of the internal electrode 2 in the mother laminate is increased. And deformation are more likely to occur. As a result, in the laminate chip 1 obtained by dividing the mother laminate, the specific internal electrode 2 and the external electrode 5 that should not be connected to the specific internal electrode 2 are undesirably connected, or the specific internal electrode 2 In some cases, the electrode 2 may be exposed to the side surface of the multilayer chip 4.
[0011]
In order to solve this problem, a press process with a relatively high pressure is not performed at the stage of the mother laminated body, and at least two stages of dividing the mother laminated body are performed as in the case of the technique described in Patent Document 1 described above. In the first stage, it has been proposed to obtain an intermediate laminated body having an intermediate size and to perform a pressing process with a relatively high pressure on the intermediate laminated body (see, for example, Patent Document 2).
[0012]
[Patent Document 1]
JP-A-9-129485
[Patent Document 2]
Japanese Patent Laid-Open No. 2000-100635
[0013]
[Problems to be solved by the invention]
As described above, an increase in the size of the mother laminate or an increase in the number of the mother laminates allows a larger number of laminate chips 4 to be taken out therefrom, so that the production efficiency of the multilayer ceramic capacitor 1 is improved. It is effective in improving.
[0014]
On the other hand, paying attention to equipment in a factory that mass-produces the multilayer ceramic capacitor 1, it is designed to handle a mother laminate of a predetermined size. For this reason, if the mother laminate is simply increased in size or increased in number, the production facility that has been conventionally used cannot be used as it is.
[0015]
However, as described above, the process of dividing the mother laminate is divided into at least two stages, and the intermediate laminate dimensions obtained in the first division are handled in a conventional manufacturing facility. If the dimensions are set to be the same as the dimensions of the mother laminated body, the intermediate laminated body can be handled as it is by a conventional manufacturing facility.
[0016]
However, this intermediate laminate needs to satisfy the following conditions. This will be described with reference to FIG.
[0017]
FIG. 10 is for explaining the case where the mother laminated body is divided in two stages, in which (a) shows the mother laminated body 6 and (b) shows the intermediate laminated body 7.
[0018]
In general, a mother laminate applied to a conventional manufacturing facility is provided with a margin region in which an internal electrode is not formed at the peripheral portion of a ceramic green sheet provided therein. Therefore, in order for the intermediate laminate 7 shown in FIG. 10B to be handled by a conventional manufacturing facility instead of the conventional mother laminate, the ceramic green sheet is also formed on the peripheral portion of the intermediate laminate 7. A margin region 8 on which no internal electrode is formed must be provided.
[0019]
Therefore, as shown in FIG. 10A, the mother laminated body 6 divided along the dividing line 9 to take out the intermediate laminated body 7 must also be provided with an area corresponding to the margin area 8 described above. I must. As a result, the mother laminated body 6 is provided with a band-like region 10 that should become a part of the margin region 8 at a position where each of the dividing lines 9 passes so as to extend in a cross shape, for example. Needless to say, in this band-like region 10, no internal electrode is formed on the ceramic green sheet at this position.
[0020]
However, as described above, the mother laminate 6 provided with the band-like region 10 where the internal electrode is not formed has the following problems.
[0021]
First, in order to produce the mother laminated body 6, a process of laminating a plurality of ceramic green sheets, and for each lamination, a process of temporarily pressing the ceramic green sheets to be laminated on the ceramic green sheets that have already been laminated. Although it is carried out, there is a band-like region 10 where no internal electrode is formed. Therefore, it is difficult to apply a uniform pressure over the entire surface of the ceramic green sheet in the temporary press-bonding step. Therefore, in this temporary press-bonding step, the ceramic green sheets may be misaligned.
[0022]
In addition, after the ceramic green sheet has been laminated, when the main pressing is performed on the obtained mother laminated body 6 at a pressure higher than the pressure in the temporary pressure bonding process, the presence of the band-like region 10 is present. For this reason, it is difficult to apply a uniform pressure over the entire area of the mother laminate 6. For this reason, the mother laminate 6 may have a relatively large press distortion, and the internal electrode may be relatively displaced or deformed.
[0023]
Further, the ceramic green sheet is generally formed into a sheet shape on a carrier film and is subjected to a lamination process in a state where it is peeled off from the carrier film, but an internal electrode to be the belt-like region 10 is not formed on the ceramic green sheet. If the region exists, the force required for peeling changes rapidly in the region corresponding to the band-like region 10. Therefore, at the time of peeling, the ceramic green sheet may be wrinkled or the ceramic green sheet may be torn.
[0024]
For example, when trying to reduce the size and increase the capacity of the multilayer ceramic capacitor to be obtained, the ceramic layer located between the internal electrodes is made thinner and multilayered. Therefore, the thickness of the ceramic green sheet can be reduced and the number of laminated layers can be increased. In this case, the physical thickness between the portion where the internal electrode is located in the mother laminated body 6 and the belt-like region 10 where the internal electrode is not located. As a result, when the mother laminated body 6 is pressed, a relatively large step is generated between the portion where the internal electrode is located and the belt-like region 10. Such a level difference causes positional displacement and deformation of the internal electrode.
[0025]
Further, when the mother laminate 6 is manufactured, only the temporary pressure bonding for each lamination of the ceramic green sheets is performed, and when the press process is performed at the stage of the intermediate laminate 7, the mother laminate 6 to the intermediate laminate is used. In the vicinity of the dividing line 9 where the division to obtain 7 is performed, the adhesion between the ceramic green sheets is low. Therefore, when the division along the dividing line 9 is performed, the ceramic green sheet may be misaligned.
[0026]
Further, as described above, when the pressing process is not performed at the stage of the mother laminated body 6, ceramic green sheet scraps are easily generated in the dividing process along the dividing line 9 for obtaining the intermediate laminated body 7. . When this pressing process is performed on the intermediate laminate 7, the scrap adheres to the intermediate laminate 7 and causes structural defects of the multilayer ceramic electronic component such as the obtained multilayer ceramic capacitor. There is.
[0027]
Accordingly, an object of the present invention is to solve the above-described problems in a method for manufacturing a multilayer ceramic electronic component in which a process as shown in FIG. 10 is employed.
[0028]
[Means for Solving the Problems]
A method for manufacturing a multilayer ceramic electronic component according to the present invention includes laminating a plurality of ceramic green sheets including a plurality of ceramic green sheets in which a plurality of internal electrodes are formed so as to be distributed at a plurality of locations. A step of producing a mother laminate, a step of obtaining a plurality of intermediate laminates by dividing the mother laminate along at least one primary dividing line, and a plurality of intermediate laminates parallel to each other A plurality of second multilayer dividing lines orthogonal to the first secondary dividing line and a plurality of second secondary dividing lines orthogonal to the first secondary dividing line. And obtaining a laminated chip.
[0029]
Further, each intermediate laminate is provided with a margin region where no internal electrode is formed at the peripheral edge of the ceramic green sheet provided therein, and accordingly, the mother laminate has a margin region at a position where the primary dividing line passes. A belt-like region to be a part of is provided.
[0030]
In such a method for manufacturing a multilayer ceramic electronic component, in order to solve the above-described technical problem, the distribution density and the substantial density of the internal electrodes are substantially not present on a region corresponding to the belt-shaped region of the mother multilayer body in a specific ceramic green sheet. In general, a plurality of dummy electrodes are formed so as to extend over the primary dividing line and to be distributed at a plurality of locations along the primary dividing line with the same distribution density. As a result, the plurality of dummy electrodes are located in the belt-like region in the mother laminate, and in the step of obtaining the plurality of intermediate laminates, Mother laminate along the primary dividing line When divided, this Min Comparatively Thus, a plurality of dummy electrodes are exposed on the end face of the intermediate laminate that appears.
[0031]
The dummy electrode is preferably formed on all the ceramic green sheets on which the internal electrodes are formed.
[0032]
The dummy electrode preferably includes the same electrode as the internal electrode in at least one of the longitudinal dimension and the width dimension.
[0033]
In addition, it is preferable that the interval between the plurality of dummy electrodes, the interval between the plurality of internal electrodes, and the interval between the dummy electrodes and the internal electrodes are the same when viewed in the same direction.
[0034]
The dummy electrodes may be formed with the same dimensions and the same arrangement as the internal electrodes. In this case, the dummy electrode and the internal electrode are apparently indistinguishable from each other. Therefore, from a different viewpoint, the internal electrode is to be used as the dummy electrode.
[0035]
The band-like region has, for example, a shape extending in a cross shape so as to divide the mother laminated body into four.
[0036]
In the step of dividing the intermediate laminated body along at least one of the first secondary dividing line and the second secondary dividing line, the dummy electrodes exposed on the end face of the intermediate laminated body or the interval between the dummy electrodes The step of sensing the position of the portion is performed, and the position of the sensed dummy electrode or the space between the dummy electrodes is divided along at least one of the first secondary dividing line and the second secondary dividing line. It may be used as a reference for the position to be.
[0037]
It is preferable that the dummy electrode is also formed on a specific ceramic green sheet on a region corresponding to the peripheral portion of the mother stacked body to be a part of the margin region of the intermediate stacked body.
[0038]
In the above case, in the step of producing the mother laminate, before the step of laminating the ceramic green sheets, the ceramic green is separated so that the dummy electrode formed on the region corresponding to the peripheral portion of the mother laminate is divided. Even if the step of cutting the peripheral portion of the sheet is performed, in the step of obtaining the intermediate laminate, the dummy electrode formed on the region corresponding to the peripheral portion of the mother laminate is divided so that the mother laminate is separated. A step of cutting the peripheral edge may be performed.
[0039]
When the step of temporarily bonding the ceramic green sheet to be laminated on the ceramic green sheet that has already been laminated is performed every time the ceramic green sheets are laminated, After the step of obtaining the intermediate laminate, in addition to the above-described temporary press-bonding step, in the step of further pressing the intermediate laminate at a pressure higher than the pressure of the temporary press-bond step, or in the step of manufacturing the mother laminate After the step of laminating the ceramic green sheets, this press step may be further performed on the mother laminated body at a pressure higher than the pressure in the temporary pressure bonding step.
[0040]
DETAILED DESCRIPTION OF THE INVENTION
Below, the manufacturing method of a multilayer ceramic capacitor as shown in FIG. 9 as an example of a multilayer ceramic electronic component is demonstrated.
[0041]
1 to 3 are for explaining a first embodiment of the present invention. Here, FIG. 1 is a plan view showing a ceramic green sheet 12 prepared for producing the mother laminate 11 shown in FIG. 2, and FIG. 2 is a cross-sectional view of the mother laminate 11. 3 is an end view showing a part of the mother laminate 11. In FIG. 2, it is pointed out that the dimension in the thickness direction of the mother laminate 11 is exaggerated, and the number of laminated ceramic green sheets 12 is less than the actual number.
[0042]
The ceramic green sheet 12 shown in FIG. 1 is formed into a sheet shape on a carrier film (not shown), and a plurality of internal electrodes 13 are formed thereon so as to be distributed in a plurality of locations in a matrix shape.
[0043]
FIG. 1 shows a mother laminate 11 obtained by laminating the ceramic green sheets 12 shown here, an intermediate laminate 14 obtained by dividing this, and a laminate chip 15 obtained by dividing this. The areas to be given are indicated with respective reference signs. Further, FIG. 1 shows cutting lines 16a, 16b, 17a, 17b, 18 and 19 indicating the positions of cutting performed on the ceramic green sheets 12 laminated to produce the mother laminate 11, mother lamination. Primary dividing lines 20a, 20b and 21 where the division for taking out the intermediate laminated body 14 from the body 11 is performed, and plural parallel lines where division for taking out the laminated chip 15 from the intermediate laminated body 14 is carried out The first secondary dividing line 22 and a plurality of second secondary dividing lines 23 orthogonal to the first secondary dividing line 22 are shown.
[0044]
Further, as shown in FIG. 2, the intermediate laminate 14 is provided with a margin region 24 in which the internal electrode 13 is not formed at the peripheral portion of the ceramic green sheet 12 provided therein. Therefore, the mother laminated body 11 is provided with a belt-like region 25 to be a part of the margin region 24 at a position where the primary dividing lines 20a, 20b and 21 pass. In FIG. 1, an area corresponding to the band-like area 25 in the ceramic green sheet 12 is indicated by this reference sign “25”. In this embodiment, as can be seen from FIG. 1, the belt-like region 25 has a shape extending in a cross shape so that the mother laminated body 11 is equally divided into four.
[0045]
In addition, an area corresponding to the peripheral edge portion 26 of the mother laminated body 11 to be a part of the margin area 24 of the intermediate laminated body 14 in the ceramic green sheet 12 is also indicated by this reference numeral “26” in FIG. Yes.
[0046]
As shown in FIG. 1, a plurality of dummy electrodes 27 are formed on a region of the ceramic green sheet 12 corresponding to the band-like region 25 of the mother laminated body 11. A plurality of dummy electrodes 27 are also formed on the region corresponding to the peripheral edge portion 26 of the mother laminate 11.
[0047]
The dummy electrode 27 and the internal electrode 13 described above are formed, for example, by applying a conductive paste on the ceramic green sheet 12 by printing and drying it.
[0048]
As can be seen from FIG. 1, the dummy electrode 27 is formed with a distribution density substantially equal to the distribution density of the internal electrodes 13.
[0049]
In particular, in the dummy electrode 27 formed on the region corresponding to the belt-like region 25, it extends across the primary dividing lines 20 a, 20 b and 21 and at a plurality of locations along the primary dividing lines 20 a, 20 b and 21. It is formed to be distributed. Therefore, a plurality of dummy electrodes 27 are exposed on the end face of the intermediate laminate 14 which appears when the mother laminate 11 is divided along the primary dividing lines 20a, 20b and 21.
[0050]
On the other hand, in the dummy electrode 27 formed on the region corresponding to the peripheral portion 26 of the mother laminated body 11, cutting performed on the ceramic green sheets 12 laminated to produce the mother laminated body 11. Is formed so as to cross the cutting lines 16a, 16b, 17a, 17b, 18 and 19 and to be distributed at a plurality of locations along these cutting lines 16a, 16b, 17a, 17b, 18 and 19 ing. Therefore, when the mother laminate 11 is obtained by laminating the peripheral portions of the ceramic green sheets 12 so that the dummy electrodes 27 are divided, a plurality of layers are formed on the end surface of the mother laminate 11. The dummy electrodes 27 are exposed.
[0051]
As shown in FIG. 1, the dummy electrode 27 is preferably formed on all the ceramic green sheets 12 on which the internal electrodes 13 are formed.
[0052]
The dummy electrode 27 preferably includes the same electrode as the internal electrode 13 in at least one of the longitudinal dimension and the width dimension.
[0053]
Further, the interval between the plurality of dummy electrodes 27, the interval between the plurality of internal electrodes 13, and the interval between the dummy electrode 27 and the internal electrode 13 are the same when viewed in the same direction. Is preferred.
[0054]
These preferred embodiments make it difficult for a rapid change in the force required when the ceramic green sheet 12 is peeled from the carrier film, and it is easier to apply a uniform pressure in the temporary press-bonding or the pressing process described later. This is advantageous.
[0055]
Next, by stacking a plurality of ceramic green sheets 12 including the plurality of ceramic green sheets 12 shown in FIG. 1, the mother laminate 11 shown in FIG. 2 is produced.
[0056]
More specifically, as shown in FIG. 2, after an appropriate number of ceramic green sheets 12 on which the internal electrode 13 or the like is not formed are laminated, the internal electrode 13 and the dummy electrode 17 shown in FIG. 1 are formed. An appropriate number of ceramic green sheets 12 are laminated, and an appropriate number of ceramic green sheets 12 without the internal electrodes 13 and the like are further laminated thereon. In such a lamination process, every time the ceramic green sheets 12 are laminated, a process of temporarily pressing the ceramic green sheets 12 to be laminated on the ceramic green sheets already laminated is performed.
[0057]
In such a temporary press-bonding step, since the dummy electrode 27 is formed, it is possible to apply a uniform pressure over the entire surface of the ceramic green sheet 12, and thus it is possible to make it difficult for misalignment to occur.
[0058]
In the pre-bonding process, a plurality of ceramic green sheets 12 are placed in a mold and pressed with a rigid body from above and below, or a plurality of ceramic green sheets 12 are placed in a mold, and an upper mold Alternatively, it is possible to apply a rigid rubber pressing method in which a rigid press is performed with a rubber attached to the lower mold, or a rigid press is performed with a rubber attached to both the upper and lower molds.
[0059]
Further, the ceramic green sheets 12 laminated to produce the mother laminate 11 are punched along the cutting lines 16a, 17a, 18 and 19 shown in FIG. 1 and the cutting lines 16b, 17b, 18 and Those punched along the line 19 are used, and these are alternately laminated. As a result, as shown in FIG. 2, the plurality of internal electrodes 13 are arranged in a zigzag shape in the stacking direction.
[0060]
On the other hand, the dummy electrode 27 is arranged so that two dummy electrodes 27 are aligned with respect to one internal electrode 13 in the direction of the cutting lines 18 and 19. Therefore, as described above, even if the internal electrodes 13 are arranged in a zigzag shape in the stacking direction, the plurality of dummy electrodes 27 exposed on the end faces extending along the cutting lines 18 and 19 of the mother stacked body 11 are As shown in FIG. 3, they are aligned in the stacking direction. Further, as shown in FIG. 3, the plurality of dummy electrodes 27 exposed on the end faces extending along the cutting lines 16a or 16b and 17a or 17b of the mother laminated body 11 are also aligned in the stacking direction. Become.
[0061]
At this stage, if the alignment state of the dummy electrodes 27 exposed on the end face of the mother laminate 11 is checked, it can be confirmed whether or not the ceramic green sheets 12 are properly laminated.
[0062]
The primary dividing lines 20a and 20b shown in FIG. 1 are positioned on the same line when the ceramic green sheets 12 are laminated such that the internal electrodes 13 are arranged in a zigzag manner as described above. . Therefore, in the mother laminated body 11 shown in FIG. 2, one primary dividing line 20 is shown as corresponding to the primary dividing lines 20a and 20b.
[0063]
As another embodiment, in order to produce the mother laminate 11 shown in FIG. 2, the ceramic green sheet 12 shown in FIG. 1 may be laminated as it is. In this case, in stacking, the positions at which the ceramic green sheets 12 are stacked are alternately shifted so that the internal electrodes 13 are arranged in a zigzag shape in the stacking direction. And in order to expose the dummy electrode 27, after obtaining the mother laminated body 11, the peripheral part is cut | disconnected.
[0064]
Next, the mother laminate 11 shown in FIG. 2 is divided along each of the primary dividing lines 20 and 21, thereby obtaining a plurality of, in this embodiment, four intermediate laminates 14. It is done. In this division, for example, pressing or dicing with a cutting blade is applied.
[0065]
Since the dummy electrode 27 is formed in the belt-like region 25 through which the primary dividing lines 20 and 21 through which the division for obtaining the intermediate laminate 14 is performed, the belt-like region is performed in the above-described temporary crimping step. Sufficient pressure can also be applied to 25. Therefore, even if the mother laminate 11 is divided along the primary dividing lines 20 and 21 in order to obtain the intermediate laminate 14, scraps of the ceramic green sheet 12 are hardly generated.
[0066]
Further, in the step of dividing the mother laminate 11 along the primary dividing lines 20 and 21, as shown in FIG. 3, the dummy electrodes 27 or the dummy electrodes 27 exposed on the end face of the mother laminate 11 are separated. Preferably, the position of the interval portion is sensed, and the position of the sensed dummy electrode 27 or the interval portion between the dummy electrodes 27 is used as a reference for the position to be divided along the primary dividing lines 20 and 21. . In this case, as indicated by a thick frame in FIG. 3, the distance between the dummy electrodes 27 is selected as the sensing region 28 because the dimension is shorter than the size of the dummy electrode 27 itself, so that sensing with higher accuracy is possible.
[0067]
Next, the intermediate laminate 14 is subjected to a main press at a pressure higher than the pressure in the temporary press-bonding step described above. Can be applied.
[0068]
Also in this pressing process, since the dummy electrode 27 is formed in the margin region 24 of the intermediate laminate 14, a uniform pressure can be applied over the entire area of the intermediate laminate 14. Misalignment is unlikely to occur, and press distortion is unlikely to occur. Therefore, deformation and misalignment of the internal electrode 13 are unlikely to occur.
[0069]
In addition, this press process mentioned above may be implemented in the step of the mother laminated body 11. In this case, after performing this press process, the division | segmentation process for obtaining the intermediate | middle laminated body 14 is implemented.
[0070]
Next, each of the intermediate laminates 14 is divided along a plurality of first secondary dividing lines 22 and second secondary dividing lines 23, respectively, so that a plurality of the multilayer laminated capacitors 14 for the individual multilayer ceramic capacitors are obtained. A step of obtaining the laminated chip 18 is performed. In this division, for example, press cutting with a cutting blade or dicing is applied.
[0071]
Further, also in the division for obtaining the laminated chip 15, the dummy electrode 27 or the dummy electrode 27 exposed on the end face of the intermediate laminated body 14 is the same as the exposed state of the dummy electrode 27 shown in FIG. 3. A step of sensing the position of the gap portion between the dummy electrodes 27 or the position of the gap portion between the dummy electrodes 27 to be divided along each of the secondary dividing lines 22 and 23. It is preferably used as a reference for Even in this case, it is more preferable to sense the space between the dummy electrodes 27 as in the sensing region 28 shown in FIG.
[0072]
Next, the laminate chip 15 obtained as described above is fired. As a result, the sintered multilayer chip 4 for the multilayer ceramic capacitor 1 shown in FIG. 9 is obtained. Next, when the external electrode 5 is formed on the multilayer chip 4, a desired multilayer ceramic capacitor 1 is obtained.
[0073]
4 to 6 are for explaining a second embodiment of the present invention. 4 to 6, elements corresponding to those shown in FIGS. 1 to 3 described above are denoted by the same reference numerals, and redundant description is omitted. 4 is a view corresponding to FIG. 1, FIG. 5 is a front view of the mother laminate 11, and FIG. 6 is a right side view of the mother laminate 11.
[0074]
In the second embodiment, the dimensions of the dummy electrode 27 are different from those of the first embodiment.
[0075]
That is, dummy electrode 27 arranged along cutting lines 18 and 19 and primary dividing line 21 includes dummy electrode 27 having a size larger than that of internal electrode 13, and dummy electrode 27. The interval portion between them is offset toward the end of the corresponding end face of the intermediate laminate 14.
[0076]
Further, the dummy electrode 27 arranged along the cutting lines 16a, 16b, 17a and 17b is also made larger than the dimension of the internal electrode 13.
[0077]
In the second embodiment, when the mother laminated body 11 is divided into the intermediate laminated bodies 14 or when the intermediate laminated body 14 is divided into the laminated body chips 15, as a reference of the positions to be divided, FIG. 5 and FIG. As shown by the broken lines, positions 29 and 30 at which the gaps between the dummy electrodes 27 are aligned in the stacking direction are preferably used as sensing positions.
[0078]
As described above, by selecting the sensing positions 29 and 30, the distance between the sensing positions 29 and the distance between the sensing positions 30 are larger than the dimensions of the single laminate chip 15, so that the sensing region shown in FIG. Even if the dimension of 28 becomes larger than the dimension of one laminate chip 15, sensing of sensing positions 29 and 30 can be prevented.
[0079]
7 and 8 are views corresponding to FIG. 1 for explaining the third and fourth embodiments of the present invention, respectively. 7 and 8, elements corresponding to those shown in FIG. 1 are denoted by the same reference numerals, and redundant description is omitted.
[0080]
In the third and fourth embodiments, the dimensions of the dummy electrode 27 are different from those in the first embodiment. In the third and fourth embodiments, the dummy electrode 27 is not particularly intended to be used as a reference for the position to be divided.
[0081]
In the third embodiment shown in FIG. 7, the longitudinal dimension of the dummy electrode 27 arranged along the cutting lines 18 and 19 and the primary dividing line 21 is the same as the longitudinal dimension of the internal electrode 13. is there. The dummy electrode 27 arranged along the cutting lines 16 a, 16 b, 17 a and 17 b and the primary dividing lines 20 a and 20 b has the same width direction dimension as the width direction dimension of the internal electrode 13.
[0082]
In the fourth embodiment shown in FIG. 8, all the dummy electrodes 27 are formed with the same dimensions and the same arrangement as the internal electrodes 13.
[0083]
While the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.
[0084]
For example, in the illustrated embodiment, the mother laminated body 11 is equally divided into four equal parts to obtain the intermediate laminated body 14, but the mother laminated body for obtaining the intermediate laminated body may be divided evenly. Good.
[0085]
Further, the division of the mother laminate for obtaining the intermediate laminate is not limited to four divisions, and may be, for example, two to three divisions or five divisions or more.
[0086]
In the illustrated embodiment, the dummy electrode 27 is formed not only in the belt-like region 25 of the mother laminated body 11 but also in the peripheral portion 26, but may be formed only in the belt-like region 25.
[0087]
The illustrated embodiment has been described in relation to a method for manufacturing a multilayer ceramic capacitor. However, the present invention is not limited to a multilayer ceramic capacitor, and functions as, for example, a resistor, an inductor, a varistor, a filter, a composite module, or the like. The present invention can also be applied to a method for manufacturing a multilayer ceramic electronic component.
[0088]
【The invention's effect】
As described above, according to the present invention, a mother laminated body is first manufactured, and then the mother laminated body is divided along a primary dividing line to obtain a plurality of intermediate laminated bodies, In the method for manufacturing a multilayer ceramic electronic component, a plurality of multilayer chips for individual multilayer ceramic electronic components are obtained by dividing the multilayer body along a secondary dividing line. Is provided with a margin region where the internal electrode is not formed at the peripheral portion of the ceramic green sheet provided therein, and accordingly, the mother laminated body should become a part of the margin region at the position where the primary dividing line passes. A band-like region is provided.
[0089]
Therefore, even if the mother laminate is increased in size, it is possible to apply a manufacturing facility designed to handle a conventional mother laminate having a relatively small size for the intermediate laminate. Therefore, the mother laminate can be enlarged without changing the conventional manufacturing equipment, so the number of laminate chips that can be taken out from the mother laminate can be increased, and as a result, the multilayer ceramic electronic component The production efficiency can be improved.
[0090]
Further, according to the present invention, a plurality of dummy electrodes having a distribution density substantially equal to the distribution density of the internal electrodes is provided on a region corresponding to the band-shaped region of the mother laminate in a specific ceramic green sheet. On the end face of the intermediate laminated body that is formed so as to straddle the primary dividing line and to be distributed at a plurality of locations along the primary dividing line, and appears by dividing the mother laminated body along the primary dividing line A plurality of dummy electrodes are exposed.
[0091]
Therefore, when producing the mother laminate, when the ceramic green sheets to be laminated are temporarily press-bonded, a uniform pressure can be applied over the entire surface of the ceramic green sheets. Can do.
[0092]
Moreover, since sufficient pressure is applied also in the belt-like region when dividing along the primary dividing line in order to obtain an intermediate laminate after the above-described temporary pressing step, ceramic green sheet scraps are generated. Therefore, the possibility of structural defects of the multilayer ceramic electronic component due to the scraps is reduced.
[0093]
Further, when the main laminate is pressed at a pressure higher than the pressure in the temporary press-bonding step, a uniform pressure can be applied over the entire area of the intermediate laminate or the mother laminate. Even if the number of laminated ceramic green sheets increases, press distortion is less likely to occur, and undesired deformation and misalignment of the internal electrodes are less likely to occur. It is possible to make it difficult for a level difference to occur between these portions.
[0094]
In the present invention, when the dummy electrodes are formed on all the ceramic green sheets on which the internal electrodes are formed, the above-described effects can be achieved more reliably.
[0095]
The dummy electrode includes one that is the same as the internal electrode in at least one of the longitudinal dimension and the width dimension, the interval between the plurality of dummy electrodes, the interval between the plurality of internal electrodes, and the dummy electrode When the distance between the electrode and the internal electrode is the same when viewed in the same direction, the above-described effects can be achieved more reliably and the carrier film used for forming the ceramic green sheet The ceramic green sheet can be smoothly peeled from the substrate, and therefore it is difficult to cause inconveniences such as wrinkles on the ceramic green sheet or tearing of the ceramic green sheet during such peeling.
[0096]
Even if the dummy electrodes are formed with the same dimensions and the same arrangement as the internal electrodes, not only the above-described effects are achieved, but also the dummy electrodes can be formed in the same manner as the internal electrodes. For example, the process of printing the internal electrode can be efficiently performed, and it is not necessary to make a special design change in order to form the dummy electrode in the equipment for printing.
[0097]
In the step of dividing the intermediate laminated body along the secondary dividing line, the step of sensing the position of the dummy electrode exposed on the end surface of the intermediate laminated body or the space between the dummy electrodes was performed and sensed If the position of the dummy electrode or the space between the dummy electrodes is used as a reference for the position to be divided, the position accuracy of the division can be improved, and the reference for the position to be divided can be set with respect to the dummy electrode. The function to give can be added.
[0098]
When the dummy electrode is formed also on the ceramic green sheet on the region corresponding to the peripheral portion of the mother laminated body to be a part of the margin region of the intermediate laminated body, the above-described effect can be achieved more reliably. The
[0099]
In the above case, in the step of producing the mother laminate, before the step of laminating the ceramic green sheets, the ceramic green is separated so that the dummy electrode formed on the region corresponding to the peripheral portion of the mother laminate is divided. In the step of cutting the peripheral portion of the sheet, or in the step of obtaining the intermediate laminated body, the mother laminated body so that the dummy electrode formed on the region corresponding to the peripheral portion of the mother laminated body is divided When the step of cutting the peripheral portion of the mother laminated body is performed, the dummy electrode formed on the region corresponding to the peripheral portion of the mother laminated body can also be used as a reference for the position to be divided.
[Brief description of the drawings]
FIG. 1 is a plan view showing a ceramic green sheet 12 for explaining a first embodiment of the present invention.
2 is a cross-sectional view showing a mother laminate 11 obtained by laminating ceramic green sheets 12 shown in FIG. 1. FIG.
FIG. 3 is an end view showing a part of the mother laminate 11 shown in FIG.
FIG. 4 is a plan view showing a ceramic green sheet 12 for explaining a second embodiment of the present invention.
5 is a front view showing a mother laminate 11 obtained by laminating ceramic green sheets 12 shown in FIG. 4. FIG.
6 is a right side view showing a mother laminate 11 obtained by laminating ceramic green sheets 12 shown in FIG. 4. FIG.
FIG. 7 is a plan view showing a ceramic green sheet 12 for explaining a third embodiment of the present invention.
FIG. 8 is a plan view showing a ceramic green sheet 12 for explaining a fourth embodiment of the present invention.
FIG. 9 is a cross-sectional view showing a multilayer ceramic capacitor 1 as an example of a multilayer ceramic electronic component of interest to the present invention.
10A and 10B are views for explaining the background of the present invention, in which FIG. 10A is a plan view showing a mother laminated body 6 and FIG. 10B is a plan view showing an intermediate laminated body 7;
[Explanation of symbols]
11 Mother laminate
12 Ceramic green sheet
13 Internal electrodes
14 Intermediate laminate
15 Laminated chip
16a, 16b, 17a, 17b, 18, 19 Cutting line
20, 20a, 20b, 21 Primary dividing line
22 First secondary dividing line
23 Second secondary dividing line
24 Margin area
25 Banded area
26 Perimeter
27 Dummy electrode
28 Sensing area
29, 30 Sensing position

Claims (12)

A step of producing a mother laminate by laminating a plurality of ceramic green sheets including a plurality of ceramic green sheets in which a plurality of internal electrodes are formed so as to be distributed in a plurality of locations;
Dividing the mother laminate along at least one primary dividing line to obtain a plurality of intermediate laminates;
By dividing the intermediate laminate along a plurality of first secondary dividing lines parallel to each other and a plurality of second secondary dividing lines orthogonal to the first secondary dividing lines, respectively. Obtaining a plurality of multilayer chips for individual multilayer ceramic electronic components,
Each of the intermediate laminates is provided with a margin region where the internal electrodes are not formed at the peripheral edge of the ceramic green sheet provided therein, and accordingly, the mother laminate is provided with a position through which the primary dividing line passes. Is provided with a band-shaped region to be a part of the margin region,
In the specific ceramic green sheet, a plurality of dummy electrodes having a distribution density substantially equivalent to the distribution density of the internal electrodes is provided on the region corresponding to the band-shaped region of the mother laminate. It is formed so as to straddle the dividing line and be distributed at a plurality of locations along the primary dividing line, and as a result, the plurality of dummy electrodes are located in the band-like region in the mother laminate,
In the step of obtaining said plurality of intermediate laminate when the mother laminate is divided along the primary division lines, a plurality of the dummy electrodes on the end face of the intermediate laminate in the divided result appears To be exposed,
Manufacturing method of multilayer ceramic electronic component. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein the dummy electrode is formed on all the ceramic green sheets on which the internal electrodes are formed. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the dummy electrode includes one that is the same as the internal electrode in at least one of a longitudinal dimension and a width dimension. The spacing between the plurality of dummy electrodes, the spacing between the plurality of internal electrodes, and the spacing between the dummy electrodes and the internal electrodes are the same when viewed in the same direction. A method for producing a multilayer ceramic electronic component according to any one of 1 to 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the dummy electrodes are formed with the same dimensions and the same arrangement as the internal electrodes. 6. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the belt-shaped region has a shape extending in a cross shape so as to divide the mother multilayer body into four parts. 7. In the step of dividing the intermediate laminated body along at least one of the first secondary dividing line and the second secondary dividing line, the dummy electrode exposed on the end surface of the intermediate laminated body or The step of sensing the position of the interval between the dummy electrodes is performed, and the position of the sensed dummy electrode or the interval between the dummy electrodes is determined based on the first secondary dividing line and the second secondary. The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 6, wherein the method is used as a reference for a position to be divided along at least one of the dividing lines. The dummy electrode is also formed on a region of the specific ceramic green sheet corresponding to a peripheral portion of the mother stacked body to be a part of the margin region of the intermediate stacked body. The manufacturing method of the multilayer ceramic electronic component in any one of. In the step of manufacturing the mother laminate, the ceramic electrode is formed so that the dummy electrode formed on a region corresponding to a peripheral portion of the mother laminate is divided before the step of laminating the ceramic green sheets. The manufacturing method of the multilayer ceramic electronic component of Claim 8 with which the process of cut | disconnecting the peripheral part of a green sheet is implemented. In the step of obtaining the intermediate laminate, a step of cutting the peripheral portion of the mother laminate is performed such that the dummy electrode formed on a region corresponding to the peripheral portion of the mother laminate is divided. A method for producing a multilayer ceramic electronic component according to claim 8 or 9. In the step of producing the mother laminate, each time the ceramic green sheets are laminated, a step of temporarily pressing the ceramic green sheets to be laminated on the ceramic green sheets already laminated is performed, The multilayer ceramic electronic according to any one of claims 1 to 10, further comprising, after the step of obtaining an intermediate laminate, a step of subjecting the intermediate laminate to a main press at a pressure higher than the pressure in the temporary press-bonding step. A manufacturing method for parts. In the step of producing the mother laminate, each time the ceramic green sheets are laminated, the ceramic green sheets to be laminated are temporarily bonded onto the already laminated ceramic green sheets, and the ceramic green The multilayer ceramic electronic component according to any one of claims 1 to 10, wherein a step of subjecting the mother laminate to a main press at a pressure higher than a pressure in the temporary press-bonding step is further performed after the step of laminating sheets. Manufacturing method.

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