JP2000100655A - Manufacture of laminated ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the deformation or positional deviations of the internal circuit elements of a mother laminated body when the laminated body is pressed. SOLUTION: The deformation or positional deviations of the internal circuit elements of a mother laminated body is suppressed by suppressing the flow of a raw ceramic without performing any pressing process on the mother laminated body, and pressing the laminated body divided into a plurality of intermediate laminated bodies 15. After pressing, a plurality of laminated body chips are obtained by further dividing each intermediate laminated body 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to a multilayer ceramic electronic component in which multilayer chips for a plurality of multilayer ceramic electronic components are taken out of a mother multilayer. And a method for producing the same.

[0002]

2. Description of the Related Art FIGS. 5 and 6 show a laminated chip 1 provided in a laminated ceramic capacitor as an example of a laminated ceramic electronic component which is of interest to the present invention, in a longitudinal sectional view and a transverse sectional view, respectively. I have.

The multilayer chip 1 is composed of a plurality of ceramic layers 3 stacked with an internal electrode 2 interposed. As shown by imaginary lines in FIG. 5, external electrodes 4 are formed at both ends of the multilayer chip 1,
A multilayer ceramic capacitor is formed. Each external electrode 4
Are electrically connected to a specific internal electrode 2.

When manufacturing the multilayer chip 1 for such a multilayer ceramic capacitor on a factory scale, a mother multilayer body from which a plurality of multilayer chips 1 can be taken out by division is prepared. Although not shown, the mother laminate includes a plurality of stacked ceramic green sheets and internal electrodes 2 formed at a plurality of locations on a specific ceramic green sheet.

In order to obtain a mother laminate as described above, a plurality of ceramic green sheets are prepared, and an internal electrode 2 is placed on a specific one of these ceramic green sheets.
Is formed, for example, by printing a conductive paste. Next, a plurality of ceramic green sheets are laminated and pressed in the laminating direction.

The mother laminate thus pressed is
For example, a plurality of first dividing lines and a first
Are divided along a plurality of second dividing lines orthogonal to the dividing line, whereby a plurality of stacked chips 1 are taken out.

[0007] These laminated chips 1 are then fired, and then external electrodes 4 are formed to obtain a desired laminated ceramic capacitor.

[0008]

In such a method for manufacturing a multilayer ceramic capacitor, after the mother laminate is obtained and before the mother laminate is divided into a plurality of laminate chips, the mother laminate is pressed as described above. It is attached to the process.

Due to this pressing step, the raw ceramic contained therein flows more or less in the mother laminate, and the flow of such ceramics increases as the ceramic is closer to the periphery of the mother laminate. Tend. Therefore, there is a possibility that an undesired displacement or an undesired deformation occurs in the internal electrode 2.

On the other hand, in order to improve the production efficiency of the multilayer ceramic capacitor, the mother laminate is made to have a larger area, so that a larger number of laminate chips 1 can be taken out from one mother laminate. Is desirable.

However, when the area of the mother laminate is increased, the above-described flow of the ceramic is more likely to occur in the pressing step, and therefore, the displacement and deformation of the internal electrodes 2 in the mother laminate are increased. Is more likely to occur.

As a result, in the laminated chip 1 obtained by dividing the mother laminated body, for example, in FIG.
The specific internal electrode 2 and the external electrode 4 which should not be connected thereto are undesirably connected, or the specific internal electrode 2 is exposed on the side surface of the multilayer chip 1 in FIG. Failure may be caused.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a multilayer ceramic electronic component which can make it difficult to encounter the above-mentioned problems even if the mother laminate has a larger area. It is.

[0014]

According to the present invention, simply, the pressing step is not performed at the stage of the mother laminate, but is performed after the mother laminate is divided into appropriate sizes. Thus, the technical problem as described above is to be solved.

More specifically, in the method for manufacturing a multilayer ceramic electronic component according to the present invention, when divided along a plurality of predetermined dividing lines, a multilayer chip for each multilayer ceramic electronic component is provided. A mother laminate comprising a plurality of stacked ceramic green sheets and internal circuit elements distributed and formed at a plurality of locations on a specific ceramic green sheet, and a mother laminate is prepared. First splitting along a particular one of the plurality of dividing lines, thereby first obtaining a plurality of intermediate laminates of intermediate dimensions, and then pressing the intermediate laminate in the stacking direction. It is characterized by doing. The intermediate laminated body thus pressed is divided along the remaining ones of the plurality of division lines, so that a plurality of laminated chips are finally obtained.

In the present invention, as described above, instead of performing the pressing step on the intermediate laminated body, the pressing step may be performed on the finally obtained laminated body chip. In this case, when dividing the mother laminated body, a two-stage dividing step of first dividing the intermediate laminated body into intermediate laminated bodies having intermediate dimensions, and then dividing the intermediate laminated body to obtain a laminated chip is adopted. Alternatively, a plurality of stacked chips may be directly obtained from the mother stacked body.

Further, the present invention is characterized in that pressing is not performed in the state of the mother laminate,
In the subsequent handling of the mother laminate, the mother laminate is temporarily pressed in the laminating direction at a pressure smaller than the pressure applied in the pressing step so that the plurality of ceramic green sheets provided therein do not peel off from each other. It does not prevent the process from being performed.

[0018]

1 to 4 illustrate a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention. In this embodiment, a multilayer ceramic capacitor including the multilayer chip 1 as shown in FIGS. 5 and 6 is manufactured as a multilayer ceramic electronic component.

As shown in FIG. 1, a ceramic green sheet 11 is prepared. Ceramic green sheet 11
On the upper part, the internal electrodes 2 as internal circuit elements are formed at a plurality of locations, for example, by printing a conductive paste.

By laminating a plurality of ceramic green sheets including the above-described ceramic green sheet 11, a mother laminate 12 as shown in FIG. 2 is obtained. When the mother laminate 12 is divided along a plurality of first dividing lines 13 parallel to each other and a plurality of second dividing lines 14 orthogonal to the first dividing lines 13,
This provides a multilayer chip 1 for individual multilayer ceramic capacitors as shown in FIGS. In FIG. 1, a region to be a ceramic layer 3 for one laminated chip 1 is shown surrounded by a dashed line.

For such a mother laminate 12,
Do not perform the pressing process. In the subsequent handling of the mother laminate 12, a pressure applied in a later-described pressing step is performed in order to prevent the plurality of ceramic green sheets including the ceramic green sheet 11 from peeling off from each other. This does not prevent the mother laminated body 12 from being temporarily pressed in the laminating direction with a smaller pressure. In this temporary pressing step, undesired deformation and displacement of the internal electrodes 2 are substantially prevented from occurring.

In this embodiment, the mother laminate 12 is
For example, a specific first dividing line 13a passing through the center thereof
And along each of the specific second dividing lines 14a, whereby four intermediate laminates 15 having intermediate dimensions as shown in FIG. 3 are taken out.

Next, as shown by an arrow 16 in FIG. 3, each intermediate laminated body 15 is pressed in the laminating direction.

As described above, the pressing process is performed not on the mother laminate 12 but on the intermediate laminate 15 having a smaller size, thereby providing a plurality of ceramic green sheets including the ceramic green sheets 11. The flow and distortion of the raw ceramic can be suppressed to a smaller extent, and the occurrence of inconvenience such as undesired deformation and displacement of the internal electrode 12 can be suppressed. In addition, by performing the pressing step in the state of the intermediate laminate 15 having a smaller dimension, the efficiency of degassing (removing air interposed between the green sheets) during pressing can be improved.

In the embodiment shown in FIG. 3, four intermediate laminates 15 are obtained from the mother laminate 12, but the number of intermediate laminates 15 obtained by dividing the mother laminate 12, that is, The size of the intermediate laminate 15 may be determined in consideration of the size of the mother laminate 12 so as to avoid inconveniences that may occur in the above-described pressing process as much as possible.

Next, as shown in FIG. 4, each of the intermediate laminates 15 includes the remaining first dividing lines 13 and second dividing lines 14.
, Whereby a plurality of stacked chips 1 are obtained.

Thereafter, as is well known, each laminated chip 1 is fired, and then, when the external electrodes 4 are formed as shown in FIG. 5, a desired laminated ceramic capacitor is obtained.

Although the present invention has been described with reference to the manufacturing method of the multilayer ceramic capacitor according to the illustrated embodiment, the present invention is not limited to the multilayer ceramic capacitor, but the multilayer ceramic capacitor functioning as a resistor, an inductor, a varistor and the like. The present invention can be applied to an electronic component or a multilayer ceramic electronic component in which these functional elements are combined.

In the above-described embodiment, the internal circuit element formed inside the multilayer chip is an internal electrode. However, as described above, the present invention is applicable to various multilayer ceramic electronic devices having arbitrary functions. Since the present invention is applicable to components, various modes can be considered as internal circuit elements. For example, the internal circuit element may be, for example, a circuit element having relatively high electrical resistance or other electrical characteristics in addition to a circuit element having good conductivity such as an internal electrode.

In the above-described embodiment, when dividing the mother laminate, first, division is performed to obtain an intermediate laminate having an intermediate size, and then division is performed to obtain a laminate chip. As described above, the pressing process was applied to the intermediate laminate while performing the two-stage division. However, depending on the size of the prepared mother laminate or the size of the laminate chip to be obtained, the mother laminate may be used. The body may be divided directly so as to obtain a laminated chip, and the laminated chip may be subjected to a pressing step. That is, with reference to the drawings, the element indicated by reference numeral “15” in FIG. 3 may be a final laminated chip, not an intermediate laminated body.

Alternatively, as in the above-described embodiment, in dividing the mother laminated body, a pressing step is performed on the finally obtained laminated chip while performing two-stage division. You may. That is, as described with reference to the drawings, the pressing step may not be performed on the intermediate laminated body 15 illustrated in FIG. 3, and the pressing step may be performed on the laminated chip 1 illustrated in FIG. 4. That's what it means.

[0032]

As described above, according to the present invention, the intermediate laminated body or laminated chip obtained by appropriately dividing the mother laminated body, instead of performing the pressing step at the stage of the mother laminated body. Since the pressing step is carried out at the stage, the flow of the raw ceramic in the pressing step can be suppressed smaller than in the case where the mother laminate is pressed, so that the internal circuit such as the internal electrode Undesirable deformation and displacement of the element can be suppressed.

Further, since the pressing step is performed at the stage of the intermediate laminated body or the laminated chip having a smaller size than the mother laminated body, the degassing efficiency can be improved as compared with the case where the mother laminated body is pressed. it can.

From these facts, according to the present invention, it is possible to increase the size of the mother laminated body without being constrained by the inconvenience that may occur in the pressing step. Can be manufactured.

In the present invention, in order to obtain a plurality of laminated chips from the mother laminated body, the mother laminated body is divided into two stages, and the intermediate laminated body having an intermediate size obtained in the first stage is pressed. If compared to the case where the pressing step is performed on each of the stacked chips,
The pressing process can proceed efficiently.

In the present invention, if the mother laminate is temporarily pressed in the laminating direction at a pressure lower than the pressure applied in the pressing step, the subsequent processing of the mother laminate will result in a gap between the ceramic green sheets. Of the mother laminate and the intermediate laminate or the laminated chip before the pressing step can be easily handled.

[Brief description of the drawings]

FIG. 1 shows a part of a ceramic green sheet 11 prepared for manufacturing a multilayer ceramic capacitor as a multilayer ceramic electronic component according to an embodiment of the present invention;
FIG. 5 is an enlarged perspective view of FIG. 2 to FIG. 4.

FIG. 2 is a perspective view showing a mother laminate 12 obtained by laminating a plurality of ceramic green sheets including the ceramic green sheet 11 shown in FIG.

3 is an intermediate laminate 15 obtained by dividing the mother laminate 12 shown in FIG. 2 along a specific first dividing line 13a and a specific second dividing line 14a, respectively.
FIG.

FIG. 4 is a perspective view showing a process for further dividing the intermediate laminated body 15 shown in FIG. 3 to obtain a plurality of laminated chips 1;

FIG. 5 is a longitudinal sectional view showing a multilayer chip 1 provided in a multilayer ceramic capacitor of interest to the present invention.

FIG. 6 is a transverse sectional view showing the laminated body chip 1 shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Laminated chip 2 Internal electrode 11 Ceramic green sheet 12 Mother laminated body 13 1st division line 13a Specific 1st division line 14 2nd division line 14a Specific 2nd division line 15 Intermediate laminated body 16 Press Arrow showing

Claims (3)

[Claims] The present invention provides a multilayer chip for an individual multilayer ceramic electronic component when divided along a plurality of predetermined dividing lines, wherein a plurality of laminated ceramic green sheets and a specific ceramic green sheet are provided. A step of preparing a mother laminate, comprising internal circuit elements distributed and formed at a plurality of locations on the ceramic green sheet, and applying the mother laminate along a specific one of the plurality of dividing lines. Dividing, thereby obtaining a plurality of intermediate laminates having intermediate dimensions; pressing the intermediate laminate in a stacking direction; and pressing the pressed intermediate laminate to the remaining of the plurality of dividing lines. And a step of obtaining a plurality of multilayer chips by dividing the multilayer ceramic electronic component along the object. 2. When divided along a predetermined dividing line,
A multilayer chip for each multilayer ceramic electronic component is provided, wherein a plurality of stacked ceramic green sheets, and internal circuit elements distributed and formed at a plurality of locations on the specific ceramic green sheet. A step of preparing a mother laminate, a step of dividing the mother laminate along the dividing line, thereby obtaining a plurality of laminated chips, and a step of pressing the laminated chips in a laminating direction. A method for manufacturing a multilayer ceramic electronic component, comprising: 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, further comprising a step of temporarily pressing the mother laminate in a laminating direction at a pressure smaller than a pressure applied in the pressing step.