JP6926518B2 - Manufacturing method of electronic parts - Google Patents

Description

The present invention relates to a method for manufacturing an electronic component.

Electronic components are known that include a chip and an external electrode provided on the surface of the chip. In this electronic component, since the external electrode is formed on the outer surface of the chip, it is necessary to make the size of the chip one size smaller than the predetermined size of the electronic component. Therefore, it may not be possible to secure a sufficient volume of the chip.

Patent Document 1 discloses an electronic component including a body and an external electrode arranged in a recess provided in the body. In this electronic component, since the external electrode is arranged in the recess, the volume of the element body can be secured. In this method of manufacturing electronic components, a plurality of electronic components are manufactured by forming a laminate in which an insulating layer, an external electrode pattern, and the like are laminated, and then cutting and heat-treating the laminate.

Japanese Patent No. 4816971

In the method for manufacturing an electronic component described in Patent Document 1, the insulating layer and the external electrode pattern are cut at the same time in the step of cutting the laminate. Therefore, it is difficult to optimize the cutting conditions for each insulating layer and external electrode pattern. For this reason, the laminated body is distorted due to cutting deviation and stress at the time of cutting, and the yield may be lowered.

An object of the present invention is to provide a method for manufacturing an electronic component capable of improving the yield.

The method for manufacturing an electronic component according to the present invention is a method for manufacturing an electronic component including a body and a conductor, and includes a plurality of component regions to be electronic components and a planned cutting region arranged between the plurality of component regions. A step of forming a laminate comprising, a step of cutting the laminate in a planned cutting region, and a step of heat-treating a plurality of laminate pieces separated by the cutting step. In the forming step, the first step of forming the element body forming layer containing the element body constituent material on the support and the pair of conductor patterns including the conductor constituent material are opposed to each other with the planned cutting region interposed therebetween. , The second step of forming on the element body forming layer so as to extend along the planned cutting region, and the element body pattern including the constituent materials of the element body, which corresponds to the shape of the pair of conductor patterns. Includes a shape corresponding to the shape of the portion of the planned cutting region sandwiched between the pair of conductor patterns, and a third step of forming the element body pattern from which the element body pattern is removed on the element body forming layer.

In this method of manufacturing an electronic component, a pair of conductor patterns are formed so as to face each other with a planned cutting region in between and extend along the planned cutting region. Therefore, the cutting conditions can be optimized according to the cambium and the body pattern. As a result, the distortion of the laminated body due to the cutting deviation and the stress at the time of cutting is suppressed, and the yield can be improved.

In the method for manufacturing an electronic component according to the present invention, the second step and the third step may be repeated. Even in this case, the distortion of the laminated body due to the cutting deviation and the stress at the time of cutting is suppressed, and the yield can be improved.

In the method for manufacturing an electronic component according to the present invention, the second step is a step of forming a pair of conductor patterns on the first substrate by a photolithography method and a step of transferring the pair of conductor patterns onto the element body forming layer. The third step may include a step of forming the element body pattern on the second base material by a photolithography method and a step of transferring the element body pattern onto the element body forming layer. In this case, both the conductor pattern and the element body pattern are formed by a photolithography method. Therefore, the conductor pattern and the element body pattern can be formed more accurately than those formed by the printing method.

The method for manufacturing an electronic component according to the present invention may further include a step of pressing the laminated body in the laminating direction before the step of cutting. In this case, for example, adjacent conductor patterns and element body patterns can be brought into close contact with each other.

According to the method for manufacturing an electronic component according to the present invention, it is possible to improve the yield.

It is a perspective view of the laminated coil component manufactured by the manufacturing method of the laminated coil component which concerns on embodiment. It is an exploded perspective view of the laminated coil component shown in FIG. It is sectional drawing of the laminated coil component along the line III-III of FIG. It is a flowchart which shows the manufacturing method of the laminated coil component which concerns on embodiment. It is a perspective view of the laminated body. It is a top view of the layer provided in the laminated body. It is a top view of the layer provided in the laminated body. It is a top view of the layer provided in the laminated body. It is a top view of the layer provided in the laminated body. It is a top view of the layer provided in the laminated body. It is a top view of the layer provided in the laminated body. It is sectional drawing which conceptually shows the manufacturing method of the laminated coil component which concerns on embodiment. It is sectional drawing which conceptually shows the manufacturing method of the laminated coil component which concerns on embodiment. It is sectional drawing which conceptually shows the manufacturing method of the laminated coil component which concerns on embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same code will be used for the same element or the element having the same function, and duplicate description will be omitted.

[Multilayer coil parts]
The laminated coil parts according to the embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a perspective view of a laminated coil component according to an embodiment. FIG. 2 is an exploded perspective view of the laminated coil component shown in FIG. FIG. 3 is a cross-sectional view of the laminated coil component along the line III-III of FIG.

As shown in FIGS. 1 to 3, the laminated coil component 1 according to the embodiment includes a body 2, mounting conductors 3 and 4, a plurality of coil conductors 5c, 5d, 5e, 5f, and a connecting conductor 6. , 7 and.

The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which the corners and ridges are chamfered, and a rectangular parallelepiped in which the corners and ridges are rounded. The element body 2 has end faces 2a and 2b and side surfaces 2c, 2d, 2e and 2f. The end faces 2a and 2b face each other. The side surfaces 2c and 2d face each other. The side surfaces 2e and 2f face each other. In the following, the opposite directions of the end faces 2a and 2b are referred to as the direction D1, the facing directions of the side surfaces 2c and 2d are referred to as the direction D2, and the facing directions of the side surfaces 2e and 2f are referred to as the direction D3. Direction D1, direction D2, and direction D3 are substantially orthogonal to each other.

The end faces 2a and 2b extend in the direction D2 so as to connect the side surfaces 2c and 2d. The end faces 2a and 2b extend in the direction D3 so as to connect the side surfaces 2e and 2f. The side surfaces 2c and 2d extend in the direction D1 so as to connect the end faces 2a and 2b. The side surfaces 2c and 2d extend in the direction D3 so as to connect the side surfaces 2e and 2f. The side surfaces 2e and 2f extend in the direction D2 so as to connect the side surfaces 2c and 2d. The side surfaces 2e and 2f extend in the direction D1 so as to connect the end faces 2a and 2b.

The side surface 2c is a mounting surface, and is a surface facing the other electronic device when, for example, the laminated coil component 1 is mounted on another electronic device (for example, a circuit base material or an electronic component) (not shown). The end faces 2a and 2b are planes continuous from the mounting surface (that is, the side surface 2c).

The length of the element body 2 in the direction D1 is longer than the length of the element body 2 in the direction D2 and the length of the element body 2 in the direction D3. The length of the element body 2 in the direction D2 and the length of the element body 2 in the direction D3 are equivalent to each other. That is, in the present embodiment, the end faces 2a and 2b have a square shape, and the side surfaces 2c, 2d, 2e and 2f have a rectangular shape. The length of the element body 2 in the direction D1 may be equal to or shorter than the length of the element body 2 in the direction D2 and the length of the element body 2 in the direction D3. The length of the element body 2 in the direction D2 and the length of the element body 2 in the direction D3 may be different from each other.

In the present embodiment, "equivalent" may mean "equivalent", and in addition, a value including a slight difference or a manufacturing error in a preset range may be equivalent. For example, if a plurality of values are included within the range of ± 5% of the average value of the plurality of values, it is defined that the plurality of values are equivalent.

The element body 2 is provided with recesses 21, 22, 23, 24. The recesses 21 and 22 are integrally provided and correspond to the mounting conductor 3. The recesses 23 and 24 are integrally provided and correspond to the mounting conductor 4.

The recess 21 is provided on the end surface 2a side of the side surface 2c, and is recessed toward the side surface 2d. The recess 22 is provided on the side surface 2c side of the end surface 2a and is recessed toward the end surface 2b. The recess 23 is provided on the end surface 2b side of the side surface 2c, and is recessed toward the side surface 2d. The recess 24 is provided on the side surface 2c side of the end surface 2b and is recessed toward the end surface 2a.

The recesses 21, 22, 23, 24 have, for example, the same shape. The recesses 21, 22, 23, 24 are provided apart from the side surfaces 2d, 2e, and 2f. The recess 21 and the recess 23 are provided apart from each other in the direction D1.

The element body 2 is formed by laminating a plurality of element body layers 12a to 12f in the direction D3. The specific laminated structure will be described later. In the actual body 2, the plurality of body layers 12a to 12f are integrated to the extent that the boundary between the layers cannot be visually recognized. The element layers 12a to 12f are made of, for example, a magnetic material (Ni-Cu-Zn-based ferrite material, Ni-Cu-Zn-Mg-based ferrite material, Ni-Cu-based ferrite material, or the like). The magnetic material constituting the element layers 12a to 12f may contain an Fe alloy or the like. The element layers 12a to 12f may be made of a non-magnetic material (glass-ceramic material, dielectric material, etc.).

The mounting conductor 3 is arranged in the recesses 21 and 22. The mounting conductor 4 is arranged in the recesses 23 and 24. The mounting conductors 3 and 4 are separated from each other in the direction D1. The mounting conductors 3 and 4 have, for example, the same shape. The mounting conductors 3 and 4 have, for example, an L-shaped cross section. It can be said that the mounting conductors 3 and 4 have an L shape when viewed from the direction D3, for example. The mounting conductors 3 and 4 may be subjected to electrolytic plating or electroless plating to form a plating layer on the outer surface thereof. The plating layer contains, for example, Ni, Sn, Au and the like.

The mounting conductor 3 is formed by laminating a plurality of mounting conductor layers 13 having an L shape when viewed from the direction D3 in the direction D3. In the actual mounting conductor 3, the plurality of mounting conductor layers 13 are integrated to the extent that the boundary between the layers cannot be visually recognized. The mounting conductor 3 has conductor portions 31, 32 that are integrally formed. The conductor portions 31 and 32 have a substantially rectangular plate shape. The conductor portions 31 and 32 have the same shape, for example. The conductor portion 31 is arranged in the recess 21. The conductor portion 32 is arranged in the recess 22.

The mounting conductor 4 is formed by laminating a plurality of mounting conductor layers 14 having an L shape when viewed from the direction D3 in the direction D3. In the actual mounting conductor 4, the plurality of mounting conductor layers 14 are integrated to the extent that the boundary between the layers cannot be visually recognized. The mounting conductor 4 has conductor portions 41 and 42 integrally formed. The conductor portions 41 and 42 have a substantially rectangular plate shape. The conductor portions 41 and 42 have the same shape, for example. The conductor portion 41 is arranged in the recess 23. The conductor portion 42 is arranged in the recess 24.

The plurality of coil conductors 5c, 5d, 5e, and 5f are connected to each other to form the coil 10 in the element body 2. The coil conductors 5c, 5d, 5e, and 5f are arranged so that at least a part thereof overlaps with each other when viewed from the direction D3. The coil conductors 5c, 5d, 5e, 5f are arranged apart from the end faces 2a, 2b and the side surfaces 2c, 2d, 2e, 2f.

The coil conductor 5c constitutes one end of the coil 10. One end of the coil conductor 5c and the connecting conductor 6 are adjacent to each other in the direction D1 and are connected to each other. The other end of the coil conductor 5c and the one end of the coil conductor 5d are adjacent to each other in the direction D3 and are connected to each other. The other end of the coil conductor 5d and the one end of the coil conductor 5e are adjacent to each other in the direction D3 and are connected to each other. The other end of the coil conductor 5e and one end of the coil conductor 5f are adjacent to each other in the direction D3 and are connected to each other. The other end of the coil conductor 5f and the connecting conductor 7 are adjacent to each other in the direction D1 and are connected to each other.

The coil conductors 5c, 5d, 5e, 5f are configured by laminating a plurality of coil conductor layers 15c, 15d, 15e, 15f in the direction D3. That is, the plurality of coil conductor layers 15c, 15d, 15e, and 15f are arranged so that they all overlap each other when viewed from the direction D3. The coil conductors 5c, 5d, 5e, 5f may be composed of one coil conductor layer 15c, 15d, 15e, 15f. Note that FIG. 2 shows only one coil conductor layer 15c, 15d, 15e, 15f. In the actual coil conductors 5c, 5d, 5e, 5f, the plurality of coil conductor layers 15c, 15d, 15e, 15f are integrated to the extent that the boundary between the layers cannot be visually recognized.

The connecting conductor 6 extends in the direction D1 and is connected to the coil conductor 5c of the coil 10 and the conductor portion 42. The connecting conductor 7 extends in the direction D1 and is connected to the coil conductor 5f and the conductor portion 32. The connecting conductors 6 and 7 are formed by laminating a plurality of connecting conductor layers 16 and 17 in the direction D3. Note that FIG. 2 shows only one connecting conductor layer 16 and 17. In the actual connecting conductors 6 and 7, the plurality of connecting conductor layers 16 and 17 are integrated to the extent that the boundary between the layers cannot be visually recognized.

The mounting conductor layers 13 and 14, the coil conductor layers 15c, 15d, 15e and 15f, and the connecting conductor layers 16 and 17 are made of a conductive material (for example, Ag or Pd). Each of these layers may be made of the same material or may be made of different materials. Each of these layers has a substantially rectangular cross section.

The laminated coil component 1 includes a plurality of layers La, Lb, Lc, Ld, Le, and Lf. The laminated coil component 1 includes, for example, two layers La, one layer Lb, three layers Lc, three layers Ld, three layers Le, three layers Lf, one layer Lb, and so on, in order from the side surface 2f side. It is configured by laminating two layers La. In FIG. 2, one of each of the three layers Lc, the three layers Ld, the three layers Le, and the three layers Lf is illustrated, and the other two illustrations are omitted.

The layer La is composed of the element layer 12a.

The layer Lb is formed by combining the element body layer 12b and the mounting conductor layers 13 and 14 with each other. The element layer 12b has a shape corresponding to the shapes of the mounting conductor layers 13 and 14, and is provided with a defective portion Rb into which the mounting conductor layers 13 and 14 are fitted. The element layer 12b and the entire mounting conductor layers 13 and 14 have a complementary relationship with each other.

The layer Lc is formed by combining the element layer 12c, the mounting conductor layers 13 and 14, and the coil conductor layer 15c with each other. The element layer 12c has a shape corresponding to the shapes of the mounting conductor layers 13 and 14 and the coil conductor layer 15c, and the mounting conductor layers 13 and 14, the coil conductor layer 15c and the connecting conductor layer 16 are fitted into the defect. A portion Rc is provided. The element layer 12c, the mounting conductor layers 13 and 14, the coil conductor layer 15c, and the connecting conductor layer 16 as a whole have a complementary relationship with each other.

The layer Ld is formed by combining the element body layer 12d, the mounting conductor layers 13 and 14, and the coil conductor layer 15d with each other. The element layer 12d has a shape corresponding to the shapes of the mounting conductor layers 13 and 14 and the coil conductor layer 15d, and is provided with a defective portion Rd into which the mounting conductor layers 13 and 14 and the coil conductor layer 15d are fitted. ing. The element layer 12d and the mounting conductor layers 13 and 14 and the coil conductor layer 15d as a whole have a complementary relationship with each other.

The layer Le is formed by combining the element layer 12e, the mounting conductor layers 13 and 14, and the coil conductor layer 15e with each other. The element layer 12e has a shape corresponding to the shapes of the mounting conductor layers 13 and 14 and the coil conductor layer 15e, and is provided with a defect portion Re into which the mounting conductor layers 13 and 14 and the coil conductor layer 15e are fitted. ing. The element layer 12e and the entire mounting conductor layers 13 and 14 and the coil conductor layer 15e have a complementary relationship with each other.

The layer Lf is formed by combining the element body layer 12f, the mounting conductor layers 13 and 14, the coil conductor layer 15f, and the connecting conductor layer 17 with each other. The element layer 12f has a shape corresponding to the shapes of the mounting conductor layers 13 and 14, the coil conductor layer 15f and the connecting conductor layer 17, and the mounting conductor layers 13 and 14, the coil conductor layer 15f and the connecting conductor layer A defective portion Rf into which 17 is fitted is provided. The element layer 12f, the mounting conductor layers 13 and 14, the coil conductor layer 15f, and the connecting conductor layer 17 as a whole have a complementary relationship with each other.

The defective portions Rb, Rc, Rd, Re, and Rf are integrated to form the above-mentioned recesses 21, 22, 23, and 24. The widths of the defective portions Rb, Rc, Rd, Re, and Rf (hereinafter, the widths of the defective portions) are basically the mounting conductor layers 13, 14, the coil conductor layers 15c, 15d, 15e, 15f, and the connecting conductor layer. It is set to be wider than the widths of 16 and 17 (hereinafter, the width of the conductor portion). Defects to improve the adhesiveness between the element layers 12b, 12c, 12d, 12e, 12f and the mounting conductor layers 13, 14, the coil conductor layers 15c, 15d, 15e, 15f, and the connecting conductor layers 16, 17 The width of the portion may be intentionally set to be narrower than the width of the conductor portion. The value obtained by subtracting the width of the conductor portion from the width of the defective portion is, for example, preferably -3 μm or more and 10 μm or less, and more preferably 0 μm or more and 10 μm or less.

[Manufacturing method of laminated coil parts]
A method of manufacturing the laminated coil component 1 according to the embodiment will be described with reference to FIGS. 4 to 14. FIG. 4 is a flowchart showing a method of manufacturing the laminated coil component according to the embodiment. FIG. 5 is a perspective view of the laminated body. 6 to 11 are plan views of the layers included in the laminated body. 12 to 14 are cross-sectional views conceptually showing a method of manufacturing a laminated coil component according to an embodiment. The cross-sectional views of FIGS. 12 to 14 are conceptually shown and do not necessarily match the actual cross-sectional views of the laminated coil component 1.

In the method for manufacturing the laminated coil component 1 according to the embodiment, first, the laminated body 50 shown in FIG. 5 is formed on the support 40 (step S10). The laminated body 50 includes a plurality of (here, 8) component regions R0, one or a plurality (here, 1) planned cutting regions R1, and one or a plurality (here, 3) planned cutting regions R2. There is. The component region R0 is a region that becomes the laminated coil component 1 (see FIG. 1) through the steps described later. The planned cutting regions R1 and R2 are regions scheduled to be cut in the cutting step described later. Specifically, the planned cutting regions R1 and R2 are, for example, regions through which a cutting machine dicing saw such as a dicing saw, a dicing blade, or a laser beam used in the cutting process passes, and like the portion Ra described later, It includes a part that is not actually cut.

The planned cutting regions R1 and R2 are arranged between the plurality of component regions R0. Specifically, the planned cutting region R1 is arranged between two component regions R0 adjacent to each other in the direction D1. The planned cutting region R2 is arranged between two component regions R0 adjacent to each other in the direction D2. The planned cutting region R1 is a rectangular plate-shaped region, and is arranged so that the direction D1 is the thickness direction. The planned cutting region R2 is a rectangular plate-shaped region, and is arranged so that the direction D2 is the thickness direction. The planned cutting regions R1 and R2 are orthogonal to each other. The thickness of the planned cutting region R1 (length in the direction D1) and the thickness of the planned cutting region R2 (length in the direction D2) are, for example, the thickness of the dicing saw or dicing blade used in the cutting step, or the laser. It corresponds to the beam diameter of light.

The laminate 50 includes layers LA, LB, LC, LD, LE, and LF shown in FIGS. 6 to 11. The layers LA, LB, LC, LD, LE, and LF have a plurality of partial LA1, LB1, LC1, LD1, LE1, LF1 which become layers La, Lb, Lc, Ld, Le, and Lf through the steps described later. doing. That is, each component region R0 includes the laminated portions LA1, LB1, LC1, LD1, LE1, LF1.

As shown in FIG. 6, the layer LA is composed of a body forming layer 61, which will be described later. As shown in FIGS. 7 to 11, the layers LB, LC, LD, LE, and LF are composed of a body pattern 62 and a conductor pattern 72, which will be described later. As will be described later, the conductor pattern 72 has portions that serve as mounting conductor layers 13 and 14. In the laminated body 50, the portions of the conductor pattern 72 that are the mounting conductor layers 13 and 14 face each other with the planned cutting regions R1 and R2 in between, and extend along the planned cutting regions R1 and R2. , A plurality of component areas R0 are arranged. The element body pattern 62 has a shape obtained by removing a shape corresponding to the conductor pattern 72 and a shape corresponding to the shape of a portion Ra sandwiched between two adjacent conductor patterns 72 in the planned cutting regions R1 and R2. Is presenting.

Specifically, the laminated body 50 is formed as follows. First, as shown in FIG. 12A, the element body forming layer 61 is formed on the base material 60 (step S1). The base material 60 is, for example, a PET film. The element body forming layer 61 is formed, for example, by applying an element body paste containing the above-mentioned constituent materials of the element body layers 12a to 12f and a photosensitive material onto the base material 60. The photosensitive material contained in the element paste may be either a negative type or a positive type, and known materials can be used.

Subsequently, as shown in FIG. 12 (b), the element body forming layer 61 is exposed and developed by, for example, a photolithography method using a Cr mask, and the shape of the conductor pattern 72 (see FIG. 12 (d)) described later. The element body pattern 62 from which the shape corresponding to the above and the shape corresponding to the shape of the partial Ra (see FIG. 14A) is removed is formed on the base material 60 (step S2). That is, in step S2, the element body pattern 62 provided with the defective portion Rc, Rd, Re, Rf and the defective portion 63 serving as the partial Ra is formed. The element body pattern 62 is a layer that becomes a plurality of element body layers 12b to 12f through the steps described later. The "photolithography method" of the present embodiment may be any one that is processed into a desired pattern by exposing and developing a layer to be processed containing a photosensitive material, and is not limited to the type of mask or the like. ..

On the other hand, as shown in FIG. 12 (c), the conductor forming layer 71 is formed on the base material 70 (step S3). The base material 70 is, for example, a PET film. The conductor forming layer 71 includes, for example, the above-mentioned mounting conductor layers 13 and 14, the constituent materials of the coil conductor layers 15c, 15d, 15e and 15f, and the connecting conductor layers 16 and 17 (see FIG. 2), and a photosensitive material. It is formed by applying a conductor paste onto the base material 70. The photosensitive material contained in the conductor paste may be either a negative type or a positive type, and known materials can be used.

Subsequently, as shown in FIG. 12D, the conductor forming layer 71 is exposed and developed by, for example, a photolithography method using a Cr mask, and the conductor pattern 72 is formed on the base material 70 (step S4). The conductor pattern 72 is a layer that becomes the mounting conductor layers 13, 14, the coil conductor layers 15c, 15d, 15e, 15f, and the connecting conductor layers 16, 17 (see FIG. 2) through the steps described later.

Subsequently, as shown in FIG. 12E, the element body forming layer 61 formed in the above step S1 is transferred from the base material 60 onto the support 40 (step S5). By repeating step S5 a plurality of times, a plurality of element body forming layers 61 may be laminated on the support 40. In the present embodiment, the element body forming layer 61 is laminated on the support 40 by repeating the step S5 twice. These element-forming layers 61 form a layer LA (see FIG. 6).

Subsequently, as shown in FIG. 12 (f), the conductor pattern 72 is formed on the element body forming layer 61 (step S6). Specifically, the conductor pattern 72 formed in the above step S4 is transferred from the base material 70 onto the element body forming layer 61 transferred in the above step S5. On the body forming layer 61, the portions of the conductor pattern 72 that are the mounting conductor layers 13 and 14 (see FIG. 2) face each other with the planned cutting regions R1 and R2 in between, and the planned cutting regions R1 and R2. It is formed so as to extend along the above, and is not formed in the planned cutting regions R1 and R2. On the element forming layer 61, the portions of the conductor pattern 72 that become the coil conductor layers 15c, 15d, 15e, 15f and the connecting conductor layers 16 and 17 (see FIG. 2) are not formed in the planned cutting regions R1 and R2. ..

Next, as shown in FIG. 12 (g), the element body pattern 62 is formed on the element body forming layer 61 (step S7). Specifically, the element body pattern 62 formed in the above step S2 is transferred from the base material 60 onto the element body forming layer 61 transferred in the above step S5. The missing portion 63 of the element body pattern 62 is combined with the conductor pattern 72 transferred onto the element body forming layer 61 in the above step S6, and the element body pattern 62 and the conductor pattern 72 become the same layer.

Further, as shown in FIG. 13A, the above steps S6 and S7 are repeatedly carried out, and the element body pattern 62 and the conductor pattern 72 are laminated in a state of being combined with each other (step S8). As a result, the layers LB, LC, LD, LE, and LF (see FIGS. 7 to 11) are laminated. In the step S8, it is not always necessary to repeat the step S6 and the step S7 on a one-to-one basis. For example, the step S6 may be repeated more than the step S7. Thereby, for example, the conductor pattern 72 corresponding only to the mounting conductor layers 13 and 14 (see FIG. 2) may be extra-transferred to the element body pattern 62.

Subsequently, as shown in FIG. 13B, the element body forming layer 61 formed in the step S1 is transferred from the base material 60 onto the layer laminated in the step S8 (step S9). By repeating step S9 a plurality of times, a plurality of element forming layers 61 may be laminated on the layer. In the present embodiment, two layers of the element forming layer 61 are laminated on the base material 60 on the layer by repeating the process twice. These element-forming layers 61 form a layer LA (see FIG. 6).

As described above, the laminated body 50 having the element body forming layer 61, the conductor pattern 72, and the element body pattern 62 laminated on the support 40 is formed. In addition, for example, a layer provided with a cutting mark or a mark indicating the directionality of the chip (laminated coil component 1) or a colored layer may be further laminated as necessary to form a laminated body 50.

Subsequently, the laminated body 50 is pressed in the direction D3 (step S20). As the pressing method, for example, an isotropic pressure press such as a warm isotropic pressure press (WIP) or a uniaxial press is used. Thereby, for example, the adjacent conductor pattern 72 and the element body pattern 62 can be brought into close contact with each other. Further, for example, the generation of voids in the laminated body 50 due to the step between the conductor pattern 72 and the element body pattern 62, which are the same layer, is suppressed.

Subsequently, the laminated body 50 is cut in the planned cutting regions R1 and R2 (step S30). Specifically, first, the laminated body 50 is peeled off from the support 40 and brought into close contact with the cutting substrate 40a as shown in FIG. 14A. Next, the laminate 50 is cut to obtain a plurality of individual laminates 51 as shown in FIG. 14 (b). The laminated body piece 51 corresponds to the component region R0 and becomes the laminated coil component 1 (see FIG. 1) through a process described later. The laminate 50 is cut using, for example, a dicing saw. In step S30, cutting is actually performed in a portion of the planned cutting regions R1 and R2 in which the element body forming layer 61 and the element body pattern 62 are formed, that is, a portion other than the portion Ra.

Subsequently, the plurality of laminated individual pieces 51 that have been individualized in step S30 are subjected to a binder removal treatment and then a heat treatment (step S40). The heat treatment temperature is, for example, about 850 to 900 ° C. Subsequently, if necessary, the mounting conductors 3 and 4 are subjected to electrolytic plating or electroless plating to form a plating layer on the outer surface of the mounting conductors 3 and 4. As a result, the laminated coil component 1 is obtained.

As described above, in the present embodiment, the portions of the conductor pattern 72 that are the mounting conductor layers 13 and 14 face each other with the planned cutting regions R1 and R2 in between, and are along the planned cutting regions R1 and R2. It is formed so as to extend, and is not formed in the planned cutting regions R1 and R2. The portions of the conductor pattern 72 that become the coil conductor layers 15c, 15d, 15e, 15f and the connecting conductor layers 16 and 17 are also not formed in the planned cutting regions R1 and R2. That is, only the element body forming layer 61 and the element body pattern 62 are formed in the planned cutting regions R1 and R2. Therefore, the cutting conditions can be optimized according to the body forming layer 61 and the body pattern 62. As a result, the distortion of the laminated body 50 due to the cutting deviation and the stress at the time of cutting is suppressed, and the yield can be improved. Further, for example, even when a dicing saw or a dicing blade is used in the cutting step, clogging and wear of the blade are suppressed by not cutting the conductor pattern 72. Therefore, the life of the blade can be extended.

Both the element body pattern 62 and the conductor pattern 72 are formed by a photolithography method. Therefore, the conductor pattern 72 and the element body pattern 62 can be formed more accurately than those formed by the printing method.

The present invention is not limited to the above-described embodiment, and various modifications are possible.

The element pattern 62 and the conductor pattern 72 may be formed by, for example, a printing method, not by a photolithography method. The element body pattern 62 and the conductor pattern 72 do not necessarily have to be formed on different base materials 60 and 70, and are formed on a common base material as long as the element body pattern 62 and the conductor pattern 72 are separated from each other. May be done.

In the above-described embodiment, the laminated coil component 1 has been described as an example of the electronic component, but the present invention is not limited to this, and the present invention is not limited to this, such as a laminated ceramic capacitor, a laminated varistor, a laminated piezoelectric actuator, a laminated thermistor, or a laminated composite component. It can also be applied to other methods of manufacturing electronic components.

1 ... Laminated coil parts, 2 ... Elementary bodies, 3, 4 ... Mounting conductors, 5c, 5d, 5e, 5f ... Coil conductors, 6, 7 ... Connecting conductors, 40 ... Supports, 50 ... Laminated bodies, 51 ... Laminated Body piece, 60 ... base material, 61 ... element forming layer, 62 ... element pattern, 70 ... base material, 72 ... conductor pattern, R0 ... component area, R1, R2 ... planned cutting area, Ra ... part.

Claims (4)

A method for manufacturing electronic components including a body and a conductor.
A step of forming a laminate including a plurality of component regions to be electronic components and a planned cutting region arranged between the plurality of component regions.
The step of cutting the laminated body in the planned cutting region and
Including a step of heat-treating a plurality of laminated individual pieces separated by the cutting step.
The step of forming the laminate is
The first step of forming the cambium containing the constituent material of the body on the support, and
A second step of forming a pair of conductor patterns containing the constituent materials of the conductor on the element body forming layer so as to face each other with the planned cutting region interposed therebetween and to extend along the planned cutting region. ,
It is a body pattern including the constituent material of the body, and corresponds to the shape corresponding to the shape of the pair of conductor patterns and the shape of the portion of the planned cutting region sandwiched between the pair of conductor patterns. A method for manufacturing an electronic component, which comprises a third step of forming a shape and a body pattern from which is removed on the body forming layer. The method for manufacturing an electronic component according to claim 1, wherein the second step and the third step are repeatedly performed. The second step includes a step of forming the pair of conductor patterns on the first substrate by a photolithography method and a step of transferring the pair of conductor patterns onto the element body forming layer.
The first step or the third step includes a step of forming the element body pattern on the second base material by a photolithography method and a step of transferring the element body pattern onto the element body forming layer. 2. The method for manufacturing an electronic component according to 2. The method for manufacturing an electronic component according to any one of claims 1 to 3, further comprising a step of pressing the laminated body in the laminating direction before the cutting step.

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