JP4496229B2 - 減圧乾燥装置及び塗布膜形成方法 - Google Patents

減圧乾燥装置及び塗布膜形成方法 Download PDF

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Publication number
JP4496229B2
JP4496229B2 JP2007001664A JP2007001664A JP4496229B2 JP 4496229 B2 JP4496229 B2 JP 4496229B2 JP 2007001664 A JP2007001664 A JP 2007001664A JP 2007001664 A JP2007001664 A JP 2007001664A JP 4496229 B2 JP4496229 B2 JP 4496229B2
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substrate
wafer
sealed container
solvent
coating film
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Japanese (ja)
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JP2007118007A5 (enExample
JP2007118007A (ja
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高広 北野
伸一 杉本
尚也 平川
学 濱
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2007001664A 2001-09-19 2007-01-09 減圧乾燥装置及び塗布膜形成方法 Expired - Fee Related JP4496229B2 (ja)

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JP2007001664A JP4496229B2 (ja) 2001-09-19 2007-01-09 減圧乾燥装置及び塗布膜形成方法

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JP2001285481 2001-09-19
JP2007001664A JP4496229B2 (ja) 2001-09-19 2007-01-09 減圧乾燥装置及び塗布膜形成方法

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JP2002128781A Division JP3920699B2 (ja) 2001-09-19 2002-04-30 減圧乾燥装置及び塗布膜形成方法

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JP2007118007A JP2007118007A (ja) 2007-05-17
JP2007118007A5 JP2007118007A5 (enExample) 2007-12-06
JP4496229B2 true JP4496229B2 (ja) 2010-07-07

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6391362B2 (ja) * 2014-08-25 2018-09-19 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置、基板処理装置および減圧乾燥方法
JP6400771B1 (ja) * 2017-04-11 2018-10-03 株式会社石井表記 ヒータ付き減圧ユニット及び電池製造用装置
JP7702320B2 (ja) * 2021-09-22 2025-07-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7612648B2 (ja) * 2022-12-21 2025-01-14 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3631847B2 (ja) * 1996-05-28 2005-03-23 大日本印刷株式会社 真空乾燥装置
JPH10303099A (ja) * 1997-04-24 1998-11-13 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000056474A (ja) * 1998-08-05 2000-02-25 Tokyo Electron Ltd 基板処理方法
JP2000182932A (ja) * 1998-12-16 2000-06-30 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP4267809B2 (ja) * 1999-11-16 2009-05-27 東京エレクトロン株式会社 基板の処理装置及び処理方法

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