JP4494831B2 - 基板搬送装置及びこれを備えた基板搬送システム - Google Patents

基板搬送装置及びこれを備えた基板搬送システム Download PDF

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Publication number
JP4494831B2
JP4494831B2 JP2004068845A JP2004068845A JP4494831B2 JP 4494831 B2 JP4494831 B2 JP 4494831B2 JP 2004068845 A JP2004068845 A JP 2004068845A JP 2004068845 A JP2004068845 A JP 2004068845A JP 4494831 B2 JP4494831 B2 JP 4494831B2
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JP
Japan
Prior art keywords
substrate
cassette
valve
substrate transfer
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004068845A
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English (en)
Japanese (ja)
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JP2005259947A (ja
Inventor
寿人 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2004068845A priority Critical patent/JP4494831B2/ja
Priority to PCT/JP2005/003172 priority patent/WO2005087632A1/fr
Publication of JP2005259947A publication Critical patent/JP2005259947A/ja
Application granted granted Critical
Publication of JP4494831B2 publication Critical patent/JP4494831B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004068845A 2004-03-11 2004-03-11 基板搬送装置及びこれを備えた基板搬送システム Expired - Lifetime JP4494831B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004068845A JP4494831B2 (ja) 2004-03-11 2004-03-11 基板搬送装置及びこれを備えた基板搬送システム
PCT/JP2005/003172 WO2005087632A1 (fr) 2004-03-11 2005-02-25 Equipement de transfert de substrat et systeme de transfert de substrat dote de l’equipement de transfert de substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004068845A JP4494831B2 (ja) 2004-03-11 2004-03-11 基板搬送装置及びこれを備えた基板搬送システム

Publications (2)

Publication Number Publication Date
JP2005259947A JP2005259947A (ja) 2005-09-22
JP4494831B2 true JP4494831B2 (ja) 2010-06-30

Family

ID=34975464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004068845A Expired - Lifetime JP4494831B2 (ja) 2004-03-11 2004-03-11 基板搬送装置及びこれを備えた基板搬送システム

Country Status (2)

Country Link
JP (1) JP4494831B2 (fr)
WO (1) WO2005087632A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8097084B2 (en) * 2006-01-24 2012-01-17 Vat Holding Ag Vacuum chamber system for semiconductor processing
JP2007328999A (ja) * 2006-06-07 2007-12-20 Tokyo Electron Ltd 発光素子の製造装置および発光素子の製造方法
CN101593716B (zh) * 2009-05-12 2011-06-29 上海微电子装备有限公司 器件传输方法及其装置
KR101293025B1 (ko) * 2011-12-22 2013-08-05 에스엔유 프리시젼 주식회사 마스크 적재 및 기판 반송 챔버와, 마스크 적재 및 기판 반송 챔버의 운용방법
CN104465448B (zh) * 2013-09-18 2017-06-06 北京北方微电子基地设备工艺研究中心有限责任公司 一种片盒升降装置、传输系统及半导体加工设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053240A (ja) * 1991-06-24 1993-01-08 Tdk Corp クリーン搬送方法及び装置
JPH0637175A (ja) * 1992-05-19 1994-02-10 Ebara Corp 保管箱のキャップ開閉装置
JP2001093957A (ja) * 1999-09-21 2001-04-06 Sharp Corp 電子部品の製造装置および電子部品の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183354A (ja) * 1993-12-24 1995-07-21 Tokyo Electron Ltd 基板の搬送システム及び基板の搬送方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053240A (ja) * 1991-06-24 1993-01-08 Tdk Corp クリーン搬送方法及び装置
JPH0637175A (ja) * 1992-05-19 1994-02-10 Ebara Corp 保管箱のキャップ開閉装置
JP2001093957A (ja) * 1999-09-21 2001-04-06 Sharp Corp 電子部品の製造装置および電子部品の製造方法

Also Published As

Publication number Publication date
WO2005087632A1 (fr) 2005-09-22
JP2005259947A (ja) 2005-09-22

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