WO2005087632A1 - Equipement de transfert de substrat et systeme de transfert de substrat dote de l’equipement de transfert de substrat - Google Patents

Equipement de transfert de substrat et systeme de transfert de substrat dote de l’equipement de transfert de substrat Download PDF

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Publication number
WO2005087632A1
WO2005087632A1 PCT/JP2005/003172 JP2005003172W WO2005087632A1 WO 2005087632 A1 WO2005087632 A1 WO 2005087632A1 JP 2005003172 W JP2005003172 W JP 2005003172W WO 2005087632 A1 WO2005087632 A1 WO 2005087632A1
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WO
WIPO (PCT)
Prior art keywords
substrate
cassette
valve
substrate transfer
opening
Prior art date
Application number
PCT/JP2005/003172
Other languages
English (en)
Japanese (ja)
Inventor
Hisato Tanaka
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Publication of WO2005087632A1 publication Critical patent/WO2005087632A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Definitions

  • Substrate transfer device and substrate transfer system provided with the same
  • the present invention relates to a substrate transfer device for loading or unloading a substrate to be processed, a mask substrate, or the like to or from a substrate processing device such as a vacuum chamber, and a substrate transfer system including the same.
  • an organic EL (Electro Luminescence) display device For example, in the manufacture of an organic EL (Electro Luminescence) display device, a process of forming three primary colors of red, green, and blue light-emitting layers on a first glass substrate, an electrode pattern, and the like. And a step of bonding the first glass substrate to a second glass substrate. Each of these steps is performed in a predetermined substrate processing apparatus such as a vacuum film forming chamber, and the glass substrate and the air (moisture in the air) are also loaded and unloaded from the substrate processing apparatus. In order to avoid contact with the substrate, a substrate transfer device having a closed structure has been conventionally used!
  • a substrate transfer device of this type includes a closed container that stores a glass substrate, and a valve that is formed in the closed container and that opens and closes an opening that transfers the glass substrate between the cassette and the substrate processing apparatus. These are installed, for example, on a trolley so that they can move between the substrate processing apparatuses. Then, the substrate transfer apparatus is connected to the substrate processing apparatus, the valve is opened and the glass substrate is carried into the substrate processing apparatus from the inside of the closed container through the opened opening.
  • a conventional substrate transfer device is provided with a pneumatic cylinder as a drive source for driving a valve. After being connected to a substrate processing apparatus, the pneumatic cylinder is connected to an external air tank or the like via a coupler hose. Connected to a power source.
  • a substrate transfer apparatus provided with a cassette capable of storing a plurality of glass substrates in a closed container has a motor as a drive source for driving the cassette up and down, and is connected to the substrate processing apparatus.
  • the motor was electrically connected to an external power supply system via a connector cable.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 7-169817
  • the pneumatic cylinder as a drive source for opening and closing the valve and the drive for raising and lowering the cassette are used for loading the glass substrate into the substrate processing apparatus.
  • the motor as the source has a pneumatic coupler! /, Has an external pressure source via a connector cable! / Requires the work to connect to the power supply! There was a problem.
  • the present invention has been made in view of the above problems, and has as its object to provide a substrate transfer device capable of improving workability and productivity, and a substrate transfer system including the same. Means for solving the problem
  • An object of the present invention is to provide a substrate transport apparatus for loading or unloading a substrate from or to a substrate processing apparatus, wherein the closed container has a cassette capable of storing a plurality of the substrates in a height direction.
  • a valve formed in the closed container for opening and closing the substrate for transferring the substrate between the cassette and the substrate processing apparatus.
  • the valve and the cassette are connected to an external drive source.
  • the present invention solves the above problem by providing a substrate transfer device in which a driving force transmission portion to which a driving force is transmitted is provided.
  • an object of the present invention is a substrate transport system for loading or unloading a substrate between a substrate transport apparatus and a substrate processing apparatus, wherein the substrate transport apparatus moves the substrate in a height direction.
  • the substrate processing apparatus includes a valve opening / closing mechanism including a drive source for opening / closing the valve, and a cassette lifting / lowering mechanism including a drive source for raising / lowering the cassette.
  • the substrate transfer device is connected to the substrate processing apparatus.
  • the substrate transport system is characterized in that the valve and the cassette are respectively driven via the valve opening / closing mechanism and the cassette elevating mechanism. It is determined.
  • each drive source of the valve and the cassette is not mounted on the substrate transfer device, but is provided outside, that is, on the substrate processing device side.
  • a valve opening / closing mechanism and a cassette elevating mechanism mounted on the substrate processing apparatus transmit a driving force to each of the valves and the cassette via the respective driving force transmitting portions of the valve and the cassette of the substrate processing apparatus.
  • Each of the driving force transmitted portions can be constituted by a shaft-like member that opens and closes a valve or moves the cassette up and down by being moved in the axial direction.
  • the magnetic attraction of the electromagnet can be used for coupling the shaft member to the valve opening / closing mechanism and the cassette elevating mechanism.
  • the drive sources of the valve and the cassette of the substrate transfer device are mounted outside, particularly on the substrate processing device side, after the substrate transfer device is connected to the substrate processing device, the troublesome work of connecting the transfer device to an external pressure source or a power system can be eliminated, and the valve opening / closing operation and the cassette raising / lowering operation can be performed quickly and accurately, thereby improving workability and productivity.
  • FIG. 1 is a schematic configuration diagram of a substrate transfer device 1 of the present invention.
  • FIG. 2 is a side cross-sectional view showing a connection state between the substrate transfer apparatus 1 and a substrate processing apparatus 15 connected thereto.
  • FIG. 3 is a side view showing a valve opening / closing mechanism 19 in the substrate processing apparatus 15.
  • FIG. 4 is a side view showing a cassette elevating mechanism 20 in the substrate processing apparatus 15. Explanation of reference numerals
  • FIG. 1 shows a schematic configuration of the substrate transfer device 1.
  • the substrate transfer device 1 includes a sealed container 3 having a cassette 2 in which a plurality of substrates can be stored in a height direction, and a cart 4 supporting the sealed container 3.
  • substrate here refers to a glass substrate or semiconductor substrate And the like, as well as mask substrates such as metal masks and reticles.
  • the bogie unit 4 may be a self-propelled type or a manual push type by an operator!
  • the closed container 3 has a structure in which the inside can be maintained at a vacuum or a high pressure equal to or higher than the atmospheric pressure.
  • An opening 5 having a rectangular cross section for transferring substrates between the cassette 2 and a substrate processing apparatus to be described later is formed on a part of the side wall of the closed container 3, and a valve for opening and closing the opening 5 is provided.
  • Unit 6 is provided.
  • the valve unit 6 has a built-in valve body 7 for opening or closing the opening 5 and an urging means (not shown) for urging the valve body 7 to a closed position shown in the figure.
  • a biasing means a mechanical panel, a gas spring using compressed gas, or the like can be applied.
  • a guide rod 8 extending outward from the valve unit 6 is fixed physically, and a flange-like end 8 A of the guide rod 8 is attached to the valve unit 6.
  • the illustrated closed position of the valve body 7 is positioned by contact with the casing.
  • the guide rod 8 corresponds to the “drive force receiving portion (shaft-shaped member)” of the present invention with respect to the valve body 7, and as described later, the first rod mounted on the substrate processing apparatus 15. It is connected to a valve opening / closing mechanism 19 including a driving source 21 for driving up and down.
  • the end 8A of the guide rod 8 is made of, for example, a magnetic material such as iron or magnetic stainless steel.
  • a similar guide rod 9 is also fixed to the upper end of the valve body 7 in a body, and the flange-shaped end 9A of the guide rod 9 is brought into contact with the casing of the valve unit 6 so that the guide rod 9 comes into contact with the casing.
  • the opening position of the valve body 7 is determined (FIG. 2).
  • the cassette 2 is configured to be able to move up and down inside the closed container 3 by a cassette support unit 10 provided below the closed container 3.
  • the cassette support unit 10 includes an elevating shaft 11 integrally fixed to a lower end of the cassette 2, a bellows 12 covering the periphery of the elevating shaft 11, a guide for elevating the elevating shaft 11, and a bellows. It is composed of a support member 13 and the like for keeping the space between the airtight container 12 and the closed container 3 airtight.
  • the elevating shaft 11 corresponds to the “driving force receiving portion (shaft-shaped member)” of the present invention for the cassette 2, and as will be described later, a second drive mounted on the substrate processing apparatus 15. It is connected to a force set elevating mechanism 20 including a source 22 so as to be driven up and down. End of lifting shaft 11 1 1A is made of a magnetic material such as iron or magnetic stainless steel.
  • FIG. 2 shows a connection state between the substrate transfer device 1 and the substrate processing device 15.
  • the substrate processing apparatus 15 is an intermediate chamber for taking out substrates one by one from the cassette 2 of the substrate transport apparatus 1 and transporting the substrates to a predetermined vacuum processing chamber such as a film forming chamber. And constitute a part of a vacuum processing apparatus such as a vacuum evaporation apparatus!
  • the substrate processing apparatus 15 is connected to the valve unit 6 of the vacuum transfer apparatus 1, and has a connection pipe 16 having therein a passage 16 for transferring a substrate taken out of the cassette 2 to a vacuum chamber (such as a film formation chamber). 17, a vacuum pump 18 for evacuating the passage 16, a valve opening / closing mechanism 19 including a first drive source 21 for opening and closing the valve unit 6, and a second drive source 22 for raising and lowering the cassette 2 A cassette lifting mechanism 20 is provided.
  • connection pipe 17 At an end of the connection pipe 17, a reference pin 17a that fits into a reference hole 6a (FIG. 1) formed on the front surface of the valve unit 6 of the substrate transfer device 1 is provided.
  • the connection position between the connection hole and the connection pipe 17 is based on the fitting position of the reference hole 6a and the reference pin 17a. It is assumed that a seal structure for keeping the space between the connection 17 and the valve unit 6 airtight is applied to the end of the connection 17.
  • valve opening / closing mechanism 19 and the cassette elevating mechanism 20 are both mounted on a base 30 that constitutes a part of the substrate processing apparatus 15.
  • a base 30 that constitutes a part of the substrate processing apparatus 15.
  • the knob opening / closing mechanism 19 includes a first drive source 21, a first electromagnet unit 31, and the like.
  • the first drive source 21 is located immediately below the valve unit 6 connected to the connection pipe 17 and is configured as a drive source for opening and closing the valve body 7 of the valve unit 6.
  • the first drive source 21 is a pneumatic cylinder, and the drive rod 23 is coaxially aligned with the guide rod 8 of the knob unit 6.
  • the first electromagnet unit 31 is installed at the upper end of the drive rod 23 of the pneumatic cylinder (first drive source) 21 and magnetically coupled to the end 8 A of the guide rod 8 made of a magnetic material. The unit 6 is driven to open and close.
  • the drive rod 23 of the pneumatic cylinder 21 is supported by the guide bush 25 attached to the base 30 via the bracket 24.
  • a stopper 26 is attached, which is engaged with the first electromagnet unit 31 and is locked to the guide rod end 8A lowered to the valve open position.
  • the stopper 26 is rotatably supported by a rotating shaft 27, and is configured to take a lock position indicated by a solid line in FIG. 3 and an unlock position indicated by a two-dot chain line. Being energized.
  • the structure for urging the stopper 26 to the unlocked position is not particularly limited. For example, a structure in which a spring plunger is interposed at the lower end of the stopper 26 or a torsion panel is provided around the rotation shaft can be applied.
  • the stopper 26 has an upper hook 26A that engages with the upper surface of the guide rod end 8A, and a lower hook that engages with the lower surface of the pedestal 23a at the upper end of the drive rod 23 that supports the first electromagnet unit 31.
  • the lower hook 26B engages with the pedestal 23a to rotate the stopper 26 around the rotation shaft 27, and the upper hook 26A It comes into engagement with the guide rod end 8A.
  • the cassette lifting / lowering mechanism 20 includes a linear guide actuator 29 including a second drive source 22, a second electromagnet unit 32, and the like.
  • the linear guide actuator 29 raises and lowers the guide block 34 along the guide rail 33 by driving an electric servomotor or a servo cylinder 22 as a second drive source, for example, and the final control position moves to the control valve.
  • It is configured as a precision feed mechanism that has a follow-up mechanism that functions as a function of the input signal.
  • the feed mechanism may be constituted by a ball screw unit or the like.
  • a bracket 35 that supports the second electromagnet unit 32 is attached to the guide block 34. Have been.
  • the second electromagnet unit 32 is coupled to the end 11A of the elevating shaft 11 of the cassette 2 by magnetic force. To raise and lower.
  • the second electromagnet unit 32 is connected to a power supply system (not shown) via the inside of a flexible outlet tube 36 supported by a bracket 35.
  • the substrate transfer system of the present invention is configured by the substrate transfer device 11 and the substrate processing device 15 configured as described above. Next, this operation will be described.
  • a plurality of substrates are housed in the cassette 2 arranged inside the closed container 3 of the substrate transfer device 1 in the height direction.
  • the valve unit 6 is located at a position that closes the opening 5, and the inside of the sealed container 3 is maintained at a nitrogen atmosphere or a predetermined vacuum pressure.
  • the substrate transfer device 1 is connected to the substrate processing device 15 by fitting the reference hole 6a of the valve unit 6 into the reference pin 17a provided at the end of the connection pipe 17 of the substrate processing device 15. Continued. Thereby, the opening 5 of the sealed container 3 and the passage 16 of the connection pipe 17 are aligned.
  • the first electromagnet unit 31 of the valve opening / closing mechanism 19 and the second electromagnet unit of the cassette elevating mechanism 20 provided in the substrate processing apparatus 15 32 faces the lower end 8A of the guide rod of the valve unit 6 and the lower end 11A of the elevating shaft of the cassette 2, respectively.
  • the first and second drive sources 21 and 22 are operated respectively, and the first and second electromagnet units 31 and 32 are brought into contact with the lower end 8A of the guide rod and the lower end 11A of the elevating shaft, respectively. , And are connected to each other by magnetic force.
  • the vacuum pump 18 is operated to evacuate the passage 16 to a predetermined pressure. Thereafter, the guide rod 8 is pulled down against the urging force by the operation of the valve opening / closing mechanism 19, the opening 5 is opened, and the inside of the sealed container 3 and the passage 16 are communicated with each other (FIG. 2).
  • the substrate is loaded from the cassette 2 into the vacuum chamber. Loading of the substrate is performed via a transfer robot (not shown) installed on the vacuum chamber side.
  • the substrate taken out of the cassette 2 is processed (for example, a film forming process), the processed substrate is stored in the original position of the cassette 2, and the next substrate is processed.
  • a method of taking out the substrate from the cassette 2 for processing, a method of sequentially taking out the substrates stored in the cassette 2 and carrying out the processed substrate to a separately prepared substrate transfer device having a similar configuration, etc. V, deviation method is also applicable.
  • the cassette elevating mechanism 20 is constituted by the linear guide actuator 29 capable of precision feeding, so that any substrate storage position of the cassette 2 can be accurately supplied to a predetermined take-out position. it can.
  • valve unit 6 After the processing for all the substrates stored in the cassette 2 is completed, the valve unit 6 is returned to the closed position by the operation of the valve opening / closing mechanism 19. At this time, the inside of the sealed container 3 is maintained at the same vacuum pressure as the passage 16. Then, the power supply to the first and second electromagnet units 31 and 32 is released, and accordingly, the connection between the guide rod 8 and the elevating shaft 11 is released.
  • the passage 16 inside the connection pipe 17 is released to the atmosphere, and the substrate transfer device 1 transfers the processed substrate or the empty cassette 2 to the next step with the power of the substrate processing device 15 also cut off. I do.
  • a substrate can be loaded or unloaded between the substrate transfer device 1 and the substrate processing device 15 without exposing the substrate to the atmosphere.
  • a substrate processing system that is effective for loading and unloading a substrate to be processed, which is not required to be exposed to the atmosphere, such as a glass substrate for an organic EL display device.
  • the substrate transfer device 1 since the respective drive sources for driving the valve unit 6 and the cassette 2 of the substrate transfer device 1 are provided on the substrate processing device 15 side, the substrate transfer device 1 can be connected to the substrate processing device. After connecting to No. 15, troublesome connection work using a pneumatic bra or a connector cable to drive the valve or cassette can be eliminated, so that the valve opening / closing operation and cassette elevating operation can be performed quickly and accurately. This makes it possible to improve workability and productivity.
  • the respective drive sources for driving the valve unit 6 and the cassette 2 of the substrate transfer device 1 are provided on the substrate processing device 15 side, the configuration of the substrate transfer device 1 is simplified. Therefore, it is possible to improve the handleability and maneuverability of the substrate transfer device 1.
  • connection between the guide rod of the valve unit 6 and the drive rod 23 of the valve opening / closing mechanism 19 and the linear guide actuation of the elevating shaft 11 of the cassette 2 and the cassette elevating mechanism 20 is performed by the first and second electromagnet units 31 and 32, respectively, but the present invention is not limited to this, and a connection form with a mechanical engagement action or the like is adopted. It is also possible.
  • valve unit 6 of the substrate transfer device 1 is moved to the open position by the lowering operation of the guide rod 8 .
  • the guide rod is lifted to move the valve unit 6 up.
  • the drive rod of the valve opening / closing mechanism may be configured such that the end only comes into contact with the end of the guide rod.
  • the opening / closing operation of the valve unit 6 may be a lateral or rotational movement that is not limited to the vertical movement of the guide rod.
  • a vacuum processing apparatus such as a film forming apparatus is described as an example in the above-described embodiment, but is not limited to this, and the substrate is transferred to the cassette 2 in the closed container 3.
  • a loading chamber for loading, a removal chamber for removing substrates from the cassette 2, and the like can also be configured as the substrate processing apparatus of the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Equipement de transfert de substrat et système de transfert de substrat doté de l’équipement, pour améliorer la manoeuvrabilité et la productivité. L’équipement de transfert de substrat (1) est doté d’une enceinte étanche à l’air (3) contenant une cassette (2) pour stocker une pluralité de substrats dans le sens de la hauteur, et une valve (6) qui ouvre et ferme une ouverture (5) pour transférer le substrat entre la cassette (2) formée dans l’enceinte étanche à l’air (3) et un équipement de traitement de substrat (15). L’équipement de traitement de substrat (15) est pourvu d’un mécanisme d’ouverture et de fermeture de valve (19) comportant une source d’entraînement (21) pour ouvrir et fermer la valve (6) et d’un mécanisme de levage de cassette (20) comportant une source d’entraînement pour faire monter et descendre la cassette (2). La valve (6) et la cassette (2) sont entraînées à travers le mécanisme d’ouverture et de fermeture de valve (19) et le mécanisme de levage de cassette (20) en reliant l’équipement de transfert de substrat (1) à l’équipement de traitement de substrat (15).
PCT/JP2005/003172 2004-03-11 2005-02-25 Equipement de transfert de substrat et systeme de transfert de substrat dote de l’equipement de transfert de substrat WO2005087632A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-068845 2004-03-11
JP2004068845A JP4494831B2 (ja) 2004-03-11 2004-03-11 基板搬送装置及びこれを備えた基板搬送システム

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WO2005087632A1 true WO2005087632A1 (fr) 2005-09-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007142315A1 (fr) * 2006-06-07 2007-12-13 Tokyo Electron Limited Appareil de fabrication d'un élément émetteur de lumière et procédé de fabrication d'un élément émetteur de lumière

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8097084B2 (en) * 2006-01-24 2012-01-17 Vat Holding Ag Vacuum chamber system for semiconductor processing
CN101593716B (zh) * 2009-05-12 2011-06-29 上海微电子装备有限公司 器件传输方法及其装置
KR101293025B1 (ko) 2011-12-22 2013-08-05 에스엔유 프리시젼 주식회사 마스크 적재 및 기판 반송 챔버와, 마스크 적재 및 기판 반송 챔버의 운용방법
CN104465448B (zh) * 2013-09-18 2017-06-06 北京北方微电子基地设备工艺研究中心有限责任公司 一种片盒升降装置、传输系统及半导体加工设备

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JPH053240A (ja) * 1991-06-24 1993-01-08 Tdk Corp クリーン搬送方法及び装置
JPH0637175A (ja) * 1992-05-19 1994-02-10 Ebara Corp 保管箱のキャップ開閉装置
JPH07183354A (ja) * 1993-12-24 1995-07-21 Tokyo Electron Ltd 基板の搬送システム及び基板の搬送方法
JP2001093957A (ja) * 1999-09-21 2001-04-06 Sharp Corp 電子部品の製造装置および電子部品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053240A (ja) * 1991-06-24 1993-01-08 Tdk Corp クリーン搬送方法及び装置
JPH0637175A (ja) * 1992-05-19 1994-02-10 Ebara Corp 保管箱のキャップ開閉装置
JPH07183354A (ja) * 1993-12-24 1995-07-21 Tokyo Electron Ltd 基板の搬送システム及び基板の搬送方法
JP2001093957A (ja) * 1999-09-21 2001-04-06 Sharp Corp 電子部品の製造装置および電子部品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007142315A1 (fr) * 2006-06-07 2007-12-13 Tokyo Electron Limited Appareil de fabrication d'un élément émetteur de lumière et procédé de fabrication d'un élément émetteur de lumière

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JP2005259947A (ja) 2005-09-22

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