WO2005087632A1 - Substrate transfer equipment and substrate transfer system provided with the substrate transfer equipment - Google Patents

Substrate transfer equipment and substrate transfer system provided with the substrate transfer equipment Download PDF

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Publication number
WO2005087632A1
WO2005087632A1 PCT/JP2005/003172 JP2005003172W WO2005087632A1 WO 2005087632 A1 WO2005087632 A1 WO 2005087632A1 JP 2005003172 W JP2005003172 W JP 2005003172W WO 2005087632 A1 WO2005087632 A1 WO 2005087632A1
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WO
WIPO (PCT)
Prior art keywords
substrate
cassette
valve
substrate transfer
opening
Prior art date
Application number
PCT/JP2005/003172
Other languages
French (fr)
Japanese (ja)
Inventor
Hisato Tanaka
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Publication of WO2005087632A1 publication Critical patent/WO2005087632A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements

Definitions

  • Substrate transfer device and substrate transfer system provided with the same
  • the present invention relates to a substrate transfer device for loading or unloading a substrate to be processed, a mask substrate, or the like to or from a substrate processing device such as a vacuum chamber, and a substrate transfer system including the same.
  • an organic EL (Electro Luminescence) display device For example, in the manufacture of an organic EL (Electro Luminescence) display device, a process of forming three primary colors of red, green, and blue light-emitting layers on a first glass substrate, an electrode pattern, and the like. And a step of bonding the first glass substrate to a second glass substrate. Each of these steps is performed in a predetermined substrate processing apparatus such as a vacuum film forming chamber, and the glass substrate and the air (moisture in the air) are also loaded and unloaded from the substrate processing apparatus. In order to avoid contact with the substrate, a substrate transfer device having a closed structure has been conventionally used!
  • a substrate transfer device of this type includes a closed container that stores a glass substrate, and a valve that is formed in the closed container and that opens and closes an opening that transfers the glass substrate between the cassette and the substrate processing apparatus. These are installed, for example, on a trolley so that they can move between the substrate processing apparatuses. Then, the substrate transfer apparatus is connected to the substrate processing apparatus, the valve is opened and the glass substrate is carried into the substrate processing apparatus from the inside of the closed container through the opened opening.
  • a conventional substrate transfer device is provided with a pneumatic cylinder as a drive source for driving a valve. After being connected to a substrate processing apparatus, the pneumatic cylinder is connected to an external air tank or the like via a coupler hose. Connected to a power source.
  • a substrate transfer apparatus provided with a cassette capable of storing a plurality of glass substrates in a closed container has a motor as a drive source for driving the cassette up and down, and is connected to the substrate processing apparatus.
  • the motor was electrically connected to an external power supply system via a connector cable.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 7-169817
  • the pneumatic cylinder as a drive source for opening and closing the valve and the drive for raising and lowering the cassette are used for loading the glass substrate into the substrate processing apparatus.
  • the motor as the source has a pneumatic coupler! /, Has an external pressure source via a connector cable! / Requires the work to connect to the power supply! There was a problem.
  • the present invention has been made in view of the above problems, and has as its object to provide a substrate transfer device capable of improving workability and productivity, and a substrate transfer system including the same. Means for solving the problem
  • An object of the present invention is to provide a substrate transport apparatus for loading or unloading a substrate from or to a substrate processing apparatus, wherein the closed container has a cassette capable of storing a plurality of the substrates in a height direction.
  • a valve formed in the closed container for opening and closing the substrate for transferring the substrate between the cassette and the substrate processing apparatus.
  • the valve and the cassette are connected to an external drive source.
  • the present invention solves the above problem by providing a substrate transfer device in which a driving force transmission portion to which a driving force is transmitted is provided.
  • an object of the present invention is a substrate transport system for loading or unloading a substrate between a substrate transport apparatus and a substrate processing apparatus, wherein the substrate transport apparatus moves the substrate in a height direction.
  • the substrate processing apparatus includes a valve opening / closing mechanism including a drive source for opening / closing the valve, and a cassette lifting / lowering mechanism including a drive source for raising / lowering the cassette.
  • the substrate transfer device is connected to the substrate processing apparatus.
  • the substrate transport system is characterized in that the valve and the cassette are respectively driven via the valve opening / closing mechanism and the cassette elevating mechanism. It is determined.
  • each drive source of the valve and the cassette is not mounted on the substrate transfer device, but is provided outside, that is, on the substrate processing device side.
  • a valve opening / closing mechanism and a cassette elevating mechanism mounted on the substrate processing apparatus transmit a driving force to each of the valves and the cassette via the respective driving force transmitting portions of the valve and the cassette of the substrate processing apparatus.
  • Each of the driving force transmitted portions can be constituted by a shaft-like member that opens and closes a valve or moves the cassette up and down by being moved in the axial direction.
  • the magnetic attraction of the electromagnet can be used for coupling the shaft member to the valve opening / closing mechanism and the cassette elevating mechanism.
  • the drive sources of the valve and the cassette of the substrate transfer device are mounted outside, particularly on the substrate processing device side, after the substrate transfer device is connected to the substrate processing device, the troublesome work of connecting the transfer device to an external pressure source or a power system can be eliminated, and the valve opening / closing operation and the cassette raising / lowering operation can be performed quickly and accurately, thereby improving workability and productivity.
  • FIG. 1 is a schematic configuration diagram of a substrate transfer device 1 of the present invention.
  • FIG. 2 is a side cross-sectional view showing a connection state between the substrate transfer apparatus 1 and a substrate processing apparatus 15 connected thereto.
  • FIG. 3 is a side view showing a valve opening / closing mechanism 19 in the substrate processing apparatus 15.
  • FIG. 4 is a side view showing a cassette elevating mechanism 20 in the substrate processing apparatus 15. Explanation of reference numerals
  • FIG. 1 shows a schematic configuration of the substrate transfer device 1.
  • the substrate transfer device 1 includes a sealed container 3 having a cassette 2 in which a plurality of substrates can be stored in a height direction, and a cart 4 supporting the sealed container 3.
  • substrate here refers to a glass substrate or semiconductor substrate And the like, as well as mask substrates such as metal masks and reticles.
  • the bogie unit 4 may be a self-propelled type or a manual push type by an operator!
  • the closed container 3 has a structure in which the inside can be maintained at a vacuum or a high pressure equal to or higher than the atmospheric pressure.
  • An opening 5 having a rectangular cross section for transferring substrates between the cassette 2 and a substrate processing apparatus to be described later is formed on a part of the side wall of the closed container 3, and a valve for opening and closing the opening 5 is provided.
  • Unit 6 is provided.
  • the valve unit 6 has a built-in valve body 7 for opening or closing the opening 5 and an urging means (not shown) for urging the valve body 7 to a closed position shown in the figure.
  • a biasing means a mechanical panel, a gas spring using compressed gas, or the like can be applied.
  • a guide rod 8 extending outward from the valve unit 6 is fixed physically, and a flange-like end 8 A of the guide rod 8 is attached to the valve unit 6.
  • the illustrated closed position of the valve body 7 is positioned by contact with the casing.
  • the guide rod 8 corresponds to the “drive force receiving portion (shaft-shaped member)” of the present invention with respect to the valve body 7, and as described later, the first rod mounted on the substrate processing apparatus 15. It is connected to a valve opening / closing mechanism 19 including a driving source 21 for driving up and down.
  • the end 8A of the guide rod 8 is made of, for example, a magnetic material such as iron or magnetic stainless steel.
  • a similar guide rod 9 is also fixed to the upper end of the valve body 7 in a body, and the flange-shaped end 9A of the guide rod 9 is brought into contact with the casing of the valve unit 6 so that the guide rod 9 comes into contact with the casing.
  • the opening position of the valve body 7 is determined (FIG. 2).
  • the cassette 2 is configured to be able to move up and down inside the closed container 3 by a cassette support unit 10 provided below the closed container 3.
  • the cassette support unit 10 includes an elevating shaft 11 integrally fixed to a lower end of the cassette 2, a bellows 12 covering the periphery of the elevating shaft 11, a guide for elevating the elevating shaft 11, and a bellows. It is composed of a support member 13 and the like for keeping the space between the airtight container 12 and the closed container 3 airtight.
  • the elevating shaft 11 corresponds to the “driving force receiving portion (shaft-shaped member)” of the present invention for the cassette 2, and as will be described later, a second drive mounted on the substrate processing apparatus 15. It is connected to a force set elevating mechanism 20 including a source 22 so as to be driven up and down. End of lifting shaft 11 1 1A is made of a magnetic material such as iron or magnetic stainless steel.
  • FIG. 2 shows a connection state between the substrate transfer device 1 and the substrate processing device 15.
  • the substrate processing apparatus 15 is an intermediate chamber for taking out substrates one by one from the cassette 2 of the substrate transport apparatus 1 and transporting the substrates to a predetermined vacuum processing chamber such as a film forming chamber. And constitute a part of a vacuum processing apparatus such as a vacuum evaporation apparatus!
  • the substrate processing apparatus 15 is connected to the valve unit 6 of the vacuum transfer apparatus 1, and has a connection pipe 16 having therein a passage 16 for transferring a substrate taken out of the cassette 2 to a vacuum chamber (such as a film formation chamber). 17, a vacuum pump 18 for evacuating the passage 16, a valve opening / closing mechanism 19 including a first drive source 21 for opening and closing the valve unit 6, and a second drive source 22 for raising and lowering the cassette 2 A cassette lifting mechanism 20 is provided.
  • connection pipe 17 At an end of the connection pipe 17, a reference pin 17a that fits into a reference hole 6a (FIG. 1) formed on the front surface of the valve unit 6 of the substrate transfer device 1 is provided.
  • the connection position between the connection hole and the connection pipe 17 is based on the fitting position of the reference hole 6a and the reference pin 17a. It is assumed that a seal structure for keeping the space between the connection 17 and the valve unit 6 airtight is applied to the end of the connection 17.
  • valve opening / closing mechanism 19 and the cassette elevating mechanism 20 are both mounted on a base 30 that constitutes a part of the substrate processing apparatus 15.
  • a base 30 that constitutes a part of the substrate processing apparatus 15.
  • the knob opening / closing mechanism 19 includes a first drive source 21, a first electromagnet unit 31, and the like.
  • the first drive source 21 is located immediately below the valve unit 6 connected to the connection pipe 17 and is configured as a drive source for opening and closing the valve body 7 of the valve unit 6.
  • the first drive source 21 is a pneumatic cylinder, and the drive rod 23 is coaxially aligned with the guide rod 8 of the knob unit 6.
  • the first electromagnet unit 31 is installed at the upper end of the drive rod 23 of the pneumatic cylinder (first drive source) 21 and magnetically coupled to the end 8 A of the guide rod 8 made of a magnetic material. The unit 6 is driven to open and close.
  • the drive rod 23 of the pneumatic cylinder 21 is supported by the guide bush 25 attached to the base 30 via the bracket 24.
  • a stopper 26 is attached, which is engaged with the first electromagnet unit 31 and is locked to the guide rod end 8A lowered to the valve open position.
  • the stopper 26 is rotatably supported by a rotating shaft 27, and is configured to take a lock position indicated by a solid line in FIG. 3 and an unlock position indicated by a two-dot chain line. Being energized.
  • the structure for urging the stopper 26 to the unlocked position is not particularly limited. For example, a structure in which a spring plunger is interposed at the lower end of the stopper 26 or a torsion panel is provided around the rotation shaft can be applied.
  • the stopper 26 has an upper hook 26A that engages with the upper surface of the guide rod end 8A, and a lower hook that engages with the lower surface of the pedestal 23a at the upper end of the drive rod 23 that supports the first electromagnet unit 31.
  • the lower hook 26B engages with the pedestal 23a to rotate the stopper 26 around the rotation shaft 27, and the upper hook 26A It comes into engagement with the guide rod end 8A.
  • the cassette lifting / lowering mechanism 20 includes a linear guide actuator 29 including a second drive source 22, a second electromagnet unit 32, and the like.
  • the linear guide actuator 29 raises and lowers the guide block 34 along the guide rail 33 by driving an electric servomotor or a servo cylinder 22 as a second drive source, for example, and the final control position moves to the control valve.
  • It is configured as a precision feed mechanism that has a follow-up mechanism that functions as a function of the input signal.
  • the feed mechanism may be constituted by a ball screw unit or the like.
  • a bracket 35 that supports the second electromagnet unit 32 is attached to the guide block 34. Have been.
  • the second electromagnet unit 32 is coupled to the end 11A of the elevating shaft 11 of the cassette 2 by magnetic force. To raise and lower.
  • the second electromagnet unit 32 is connected to a power supply system (not shown) via the inside of a flexible outlet tube 36 supported by a bracket 35.
  • the substrate transfer system of the present invention is configured by the substrate transfer device 11 and the substrate processing device 15 configured as described above. Next, this operation will be described.
  • a plurality of substrates are housed in the cassette 2 arranged inside the closed container 3 of the substrate transfer device 1 in the height direction.
  • the valve unit 6 is located at a position that closes the opening 5, and the inside of the sealed container 3 is maintained at a nitrogen atmosphere or a predetermined vacuum pressure.
  • the substrate transfer device 1 is connected to the substrate processing device 15 by fitting the reference hole 6a of the valve unit 6 into the reference pin 17a provided at the end of the connection pipe 17 of the substrate processing device 15. Continued. Thereby, the opening 5 of the sealed container 3 and the passage 16 of the connection pipe 17 are aligned.
  • the first electromagnet unit 31 of the valve opening / closing mechanism 19 and the second electromagnet unit of the cassette elevating mechanism 20 provided in the substrate processing apparatus 15 32 faces the lower end 8A of the guide rod of the valve unit 6 and the lower end 11A of the elevating shaft of the cassette 2, respectively.
  • the first and second drive sources 21 and 22 are operated respectively, and the first and second electromagnet units 31 and 32 are brought into contact with the lower end 8A of the guide rod and the lower end 11A of the elevating shaft, respectively. , And are connected to each other by magnetic force.
  • the vacuum pump 18 is operated to evacuate the passage 16 to a predetermined pressure. Thereafter, the guide rod 8 is pulled down against the urging force by the operation of the valve opening / closing mechanism 19, the opening 5 is opened, and the inside of the sealed container 3 and the passage 16 are communicated with each other (FIG. 2).
  • the substrate is loaded from the cassette 2 into the vacuum chamber. Loading of the substrate is performed via a transfer robot (not shown) installed on the vacuum chamber side.
  • the substrate taken out of the cassette 2 is processed (for example, a film forming process), the processed substrate is stored in the original position of the cassette 2, and the next substrate is processed.
  • a method of taking out the substrate from the cassette 2 for processing, a method of sequentially taking out the substrates stored in the cassette 2 and carrying out the processed substrate to a separately prepared substrate transfer device having a similar configuration, etc. V, deviation method is also applicable.
  • the cassette elevating mechanism 20 is constituted by the linear guide actuator 29 capable of precision feeding, so that any substrate storage position of the cassette 2 can be accurately supplied to a predetermined take-out position. it can.
  • valve unit 6 After the processing for all the substrates stored in the cassette 2 is completed, the valve unit 6 is returned to the closed position by the operation of the valve opening / closing mechanism 19. At this time, the inside of the sealed container 3 is maintained at the same vacuum pressure as the passage 16. Then, the power supply to the first and second electromagnet units 31 and 32 is released, and accordingly, the connection between the guide rod 8 and the elevating shaft 11 is released.
  • the passage 16 inside the connection pipe 17 is released to the atmosphere, and the substrate transfer device 1 transfers the processed substrate or the empty cassette 2 to the next step with the power of the substrate processing device 15 also cut off. I do.
  • a substrate can be loaded or unloaded between the substrate transfer device 1 and the substrate processing device 15 without exposing the substrate to the atmosphere.
  • a substrate processing system that is effective for loading and unloading a substrate to be processed, which is not required to be exposed to the atmosphere, such as a glass substrate for an organic EL display device.
  • the substrate transfer device 1 since the respective drive sources for driving the valve unit 6 and the cassette 2 of the substrate transfer device 1 are provided on the substrate processing device 15 side, the substrate transfer device 1 can be connected to the substrate processing device. After connecting to No. 15, troublesome connection work using a pneumatic bra or a connector cable to drive the valve or cassette can be eliminated, so that the valve opening / closing operation and cassette elevating operation can be performed quickly and accurately. This makes it possible to improve workability and productivity.
  • the respective drive sources for driving the valve unit 6 and the cassette 2 of the substrate transfer device 1 are provided on the substrate processing device 15 side, the configuration of the substrate transfer device 1 is simplified. Therefore, it is possible to improve the handleability and maneuverability of the substrate transfer device 1.
  • connection between the guide rod of the valve unit 6 and the drive rod 23 of the valve opening / closing mechanism 19 and the linear guide actuation of the elevating shaft 11 of the cassette 2 and the cassette elevating mechanism 20 is performed by the first and second electromagnet units 31 and 32, respectively, but the present invention is not limited to this, and a connection form with a mechanical engagement action or the like is adopted. It is also possible.
  • valve unit 6 of the substrate transfer device 1 is moved to the open position by the lowering operation of the guide rod 8 .
  • the guide rod is lifted to move the valve unit 6 up.
  • the drive rod of the valve opening / closing mechanism may be configured such that the end only comes into contact with the end of the guide rod.
  • the opening / closing operation of the valve unit 6 may be a lateral or rotational movement that is not limited to the vertical movement of the guide rod.
  • a vacuum processing apparatus such as a film forming apparatus is described as an example in the above-described embodiment, but is not limited to this, and the substrate is transferred to the cassette 2 in the closed container 3.
  • a loading chamber for loading, a removal chamber for removing substrates from the cassette 2, and the like can also be configured as the substrate processing apparatus of the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Substrate transfer equipment and a substrate transfer system provided with the equipment, for improving workability and productivity. The substrate transfer equipment (1) is provided with an airtight container (3) which has a cassette (2) inside for storing a plurality of substrates in a height direction, and a valve (6), which opens and closes an opening (5) for transferring the substrate between the cassette (2) formed in the airtight container (3) and substrate processing equipment (15). The substrate processing equipment (15) is provided with a valve opening and closing mechanism (19) including a drive source (21) for opening and closing the valve (6), and a cassette lifting mechanism (20) including a drive source (22) for moving up and down the cassette (2). The valve (6) and the cassette (2) are driven through the valve opening and closing mechanism (19) and the cassette lifting mechanism (20) by connecting the substrate transfer equipment (1) with the substrate processing equipment (15).

Description

基板搬送装置及びこれを備えた基板搬送システム  Substrate transfer device and substrate transfer system provided with the same
技術分野  Technical field
[0001] 本発明は、例えば真空チャンバ等の基板処理装置に対して被処理基板やマスク基 板等の搬入又は搬出を行うための基板搬送装置及びこれを備えた基板搬送システ ムに関する。  The present invention relates to a substrate transfer device for loading or unloading a substrate to be processed, a mask substrate, or the like to or from a substrate processing device such as a vacuum chamber, and a substrate transfer system including the same.
背景技術  Background art
[0002] 例えば、有機 EL (Electro Luminescence)表示装置の製造にお!、ては、第 1のガラ ス基板に赤、緑及び青の三原色の発光層等を成膜する工程と、電極パターン等を成 膜する工程と、この第 1のガラス基板を第 2のガラス基板と貼り合わせる工程等を有し ている。これらの各工程は、真空成膜室等の所定の基板処理装置においてそれぞれ 行われると共に、これら各基板処理装置に対するガラス基板の搬入及び搬出に対し ても、ガラス基板と空気 (空気中の水分)との接触を回避するために、従来より、密閉 構造の基板搬送装置が用いられて!/、る。  [0002] For example, in the manufacture of an organic EL (Electro Luminescence) display device, a process of forming three primary colors of red, green, and blue light-emitting layers on a first glass substrate, an electrode pattern, and the like. And a step of bonding the first glass substrate to a second glass substrate. Each of these steps is performed in a predetermined substrate processing apparatus such as a vacuum film forming chamber, and the glass substrate and the air (moisture in the air) are also loaded and unloaded from the substrate processing apparatus. In order to avoid contact with the substrate, a substrate transfer device having a closed structure has been conventionally used!
[0003] この種の基板搬送装置は、ガラス基板を収容する密閉容器と、この密閉容器に形 成されカセットと基板処理装置との間でガラス基板の受け渡しを行う開口を開閉する バルブとを備え、これらは基板処理装置間を移動できるように例えば台車上に設置さ れている。そして、この基板搬送装置を基板処理装置へ接続しバルブを開放駆動さ せ、開放された開口を介してガラス基板を密閉容器内から基板処理装置へ搬入する ようにしている。  [0003] A substrate transfer device of this type includes a closed container that stores a glass substrate, and a valve that is formed in the closed container and that opens and closes an opening that transfers the glass substrate between the cassette and the substrate processing apparatus. These are installed, for example, on a trolley so that they can move between the substrate processing apparatuses. Then, the substrate transfer apparatus is connected to the substrate processing apparatus, the valve is opened and the glass substrate is carried into the substrate processing apparatus from the inside of the closed container through the opened opening.
[0004] 従来の基板搬送装置は、バルブを駆動するための駆動源として空気圧シリンダを 備えており、基板処理装置へ接続した後、当該空気圧シリンダをカプラーホースを介 して外部のエアタンク等の圧力源に接続して ヽた。  [0004] A conventional substrate transfer device is provided with a pneumatic cylinder as a drive source for driving a valve. After being connected to a substrate processing apparatus, the pneumatic cylinder is connected to an external air tank or the like via a coupler hose. Connected to a power source.
[0005] また、密閉容器内に複数枚のガラス基板を収納できるカセットを具備する基板搬送 装置においては、カセットを昇降駆動するための駆動源としてモータを備えており、 基板処理装置へ接続した後、当該モータをコネクターケーブルを介して外部の電源 システムへ電気的に接続するようにして 、た。 [0006] なお、この出願の発明に関連する先行技術文献として、以下のものがある。下記特 許文献 1には、半導体ゥ ーハ製造装置間で、キャリア等の搬送介在物を使用せず に直接、半導体ゥエーハを搬送できる基板搬送装置及び基板搬送システムが開示さ れている。 [0005] Further, a substrate transfer apparatus provided with a cassette capable of storing a plurality of glass substrates in a closed container has a motor as a drive source for driving the cassette up and down, and is connected to the substrate processing apparatus. The motor was electrically connected to an external power supply system via a connector cable. [0006] Note that there are the following prior art documents related to the invention of this application. Patent Document 1 below discloses a substrate transfer apparatus and a substrate transfer system that can transfer a semiconductor wafer directly between semiconductor wafer manufacturing apparatuses without using a carrier or other intervening carrier.
[0007] 特許文献 1 :特開平 7— 169817号公報  Patent Document 1: Japanese Patent Application Laid-Open No. 7-169817
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0008] 上述したように、従来の基板搬送装置にお!ヽては、基板処理装置へのガラス基板 の搬入作業に、バルブを開閉駆動する駆動源としての空気圧シリンダと、カセットを 昇降させる駆動源としてのモータとを、それぞれ圧空カプラーある!/、はコネクターケ 一ブルを介して外部の圧力源ある!/、は電源に連結する作業を必要として!、たので、 作業性が非常に悪 、と 、う問題があった。  [0008] As described above, in the conventional substrate transfer apparatus, the pneumatic cylinder as a drive source for opening and closing the valve and the drive for raising and lowering the cassette are used for loading the glass substrate into the substrate processing apparatus. The motor as the source has a pneumatic coupler! /, Has an external pressure source via a connector cable! / Requires the work to connect to the power supply! There was a problem.
[0009] また、これらバルブあるいはカセットの各駆動源と圧空カプラーあるいはコネクター ケーブルへの接続作業ミス等によってプロセスエラーが生じるという問題もあった。更 に、電気ケーブルのコネクタ部の劣化対策も必要となり、そのメンテナンスの実施によ る生産性の低下も懸念されて 、る。  [0009] Furthermore, there is a problem that a process error occurs due to a mistake in connection work between each drive source of the valve or the cassette and the pneumatic coupler or the connector cable, or the like. In addition, it is necessary to take measures against deterioration of the connector part of the electric cable, and there is a concern that productivity may be reduced due to the maintenance.
[0010] 更に、従来の基板搬送装置においては、ノ レブ及びカセットの各駆動源を搭載し ているので、基板搬送装置の構成を複雑化し、また、基板搬送装置の高重量化によ り取り回し性を損ねて 、ると 、う問題もある。  [0010] Furthermore, in the conventional substrate transfer device, since the driving sources of the knob and the cassette are mounted, the configuration of the substrate transfer device is complicated, and the weight of the substrate transfer device is increased. There is also the problem of impairing the sex.
[0011] 本発明は上述の問題に鑑みてなされ、作業性及び生産性の向上を図ることができ る基板搬送装置及びこれを備えた基板搬送システムを提供することを課題とする。 課題を解決するための手段  [0011] The present invention has been made in view of the above problems, and has as its object to provide a substrate transfer device capable of improving workability and productivity, and a substrate transfer system including the same. Means for solving the problem
[0012] 以上の課題は、基板処理装置に対して基板の搬入又は搬出を行うための基板搬 送装置であって、前記基板を高さ方向に複数収納できるカセットを内部に有する密 閉容器と、この密閉容器に形成され前記カセットと前記基板処理装置との間で前記 基板の受け渡しを行う開口を開閉するバルブとを備え、前記バルブ及び前記カセット には、外部の駆動源に結合されることにより駆動力が伝達される駆動力被伝達部が それぞれ設けられて ヽることを特徴とする基板搬送装置、によって解決される。 [0013] また、以上の課題は、基板搬送装置と基板処理装置との間で基板の搬入又は搬出 を行うための基板搬送システムであって、前記基板搬送装置は、前記基板を高さ方 向に複数収納できるカセットを内部に有する密閉容器と、この密閉容器に形成され前 記カセットと基板処理装置との間で前記基板の受け渡しを行う開口を開閉するバル ブとを備えていると共に、前記基板処理装置は、前記バルブを開閉する駆動源を含 むバルブ開閉機構と、前記カセットを昇降させる駆動源を含むカセット昇降機構とを 備えており、前記基板搬送装置は、前記基板処理装置に接続されることにより、前記 バルブ開閉機構及び前記カセット昇降機構を介して前記バルブ及び前記カセットが それぞれ駆動されることを特徴とする基板搬送システム、によって解決される。 An object of the present invention is to provide a substrate transport apparatus for loading or unloading a substrate from or to a substrate processing apparatus, wherein the closed container has a cassette capable of storing a plurality of the substrates in a height direction. A valve formed in the closed container for opening and closing the substrate for transferring the substrate between the cassette and the substrate processing apparatus. The valve and the cassette are connected to an external drive source. Thus, the present invention solves the above problem by providing a substrate transfer device in which a driving force transmission portion to which a driving force is transmitted is provided. [0013] Further, an object of the present invention is a substrate transport system for loading or unloading a substrate between a substrate transport apparatus and a substrate processing apparatus, wherein the substrate transport apparatus moves the substrate in a height direction. A closed container having therein a cassette capable of accommodating a plurality of cassettes, and a valve formed in the closed container for opening and closing an opening for transferring the substrate between the cassette and the substrate processing apparatus. The substrate processing apparatus includes a valve opening / closing mechanism including a drive source for opening / closing the valve, and a cassette lifting / lowering mechanism including a drive source for raising / lowering the cassette. The substrate transfer device is connected to the substrate processing apparatus. The substrate transport system is characterized in that the valve and the cassette are respectively driven via the valve opening / closing mechanism and the cassette elevating mechanism. It is determined.
[0014] 本発明では、バルブ及びカセットの各々の駆動源を基板搬送装置に搭載せず、外 部、即ち基板処理装置側に具備させている。基板処理装置に搭載されたバルブ開 閉機構及びカセット昇降機構は、基板処理装置のバルブ及びカセットの各駆動力被 伝達部を介して、これらバルブ及びカセットへ駆動力を各々伝達する。  [0014] In the present invention, each drive source of the valve and the cassette is not mounted on the substrate transfer device, but is provided outside, that is, on the substrate processing device side. A valve opening / closing mechanism and a cassette elevating mechanism mounted on the substrate processing apparatus transmit a driving force to each of the valves and the cassette via the respective driving force transmitting portions of the valve and the cassette of the substrate processing apparatus.
[0015] 各駆動力被伝達部は、軸方向へ移動されることによりバルブを開閉し又はカセット を昇降させる軸状部材で構成することができる。この軸状部材とバルブ開閉機構及 びカセット昇降機構との結合には、電磁石の磁気吸着力を利用することができる。 発明の効果  [0015] Each of the driving force transmitted portions can be constituted by a shaft-like member that opens and closes a valve or moves the cassette up and down by being moved in the axial direction. The magnetic attraction of the electromagnet can be used for coupling the shaft member to the valve opening / closing mechanism and the cassette elevating mechanism. The invention's effect
[0016] 本発明によれば、基板搬送装置のバルブ及びカセットの各駆動源を外部、特に、 基板処理装置側に搭載させるようにしたので、基板搬送装置を基板処理装置へ接続 した後、基板搬送装置に対する外部圧力源や電力システム等との面倒な接続作業 を廃止でき、速やかに且つ的確にバルブ開閉動作及びカセット昇降動作を行うことを 可能として、作業性及び生産性を高めることができる。  According to the present invention, since the drive sources of the valve and the cassette of the substrate transfer device are mounted outside, particularly on the substrate processing device side, after the substrate transfer device is connected to the substrate processing device, The troublesome work of connecting the transfer device to an external pressure source or a power system can be eliminated, and the valve opening / closing operation and the cassette raising / lowering operation can be performed quickly and accurately, thereby improving workability and productivity.
図面の簡単な説明  Brief Description of Drawings
[0017] [図 1]本発明の基板搬送装置 1の概略構成図である。 FIG. 1 is a schematic configuration diagram of a substrate transfer device 1 of the present invention.
[図 2]基板搬送装置 1とこれに接続される基板処理装置 15の接続状態を示す側断面 図である。  FIG. 2 is a side cross-sectional view showing a connection state between the substrate transfer apparatus 1 and a substrate processing apparatus 15 connected thereto.
[図 3]基板処理装置 15におけるバルブ開閉機構 19を示す側面図である。  FIG. 3 is a side view showing a valve opening / closing mechanism 19 in the substrate processing apparatus 15.
[図 4]基板処理装置 15におけるカセット昇降機構 20を示す側面図である。 符号の説明 FIG. 4 is a side view showing a cassette elevating mechanism 20 in the substrate processing apparatus 15. Explanation of reference numerals
1 基板搬送装置  1 Board transfer device
2 カセット  2 cassettes
3 密閉容器  3 Closed container
4 台車部  4 bogie section
5 開口  5 opening
6 ノ ノレブユニット  6 Nolev unit
7 バルブ本体  7 Valve body
8 ガイドロッド (駆動力被伝達部、軸状部材)  8 Guide rod (Driving force transmission part, shaft-shaped member)
11 昇降軸 (駆動力被伝達部、軸状部材)  11 Elevating shaft (Driving force transmission part, shaft member)
15 基板処理装置  15 Substrate processing equipment
16 通路  16 passages
17 fe 管  17 fe tube
18 真空ポンプ  18 Vacuum pump
19 バルブ開閉機構  19 Valve opening and closing mechanism
20 カセット昇降機構  20 Cassette lifting mechanism
21 第 1の駆動源  21 First drive source
22 第 2の駆動源  22 Second drive source
23 駆動ロッド  23 Drive rod
26 ストッパ  26 Stopper
29 リニアガイドアクチユエータ  29 Linear Guide Actuator
31 第 1の電磁石ユニット  31 1st electromagnet unit
32 第 2の電磁石ユニット  32 Second electromagnet unit
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0019] 以下、本発明の実施の形態について図面を参照して説明する。  Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0020] 図 1は基板搬送装置 1の概略構成を示している。基板搬送装置 1は、複数枚の基 板を高さ方向へ収納できるカセット 2を内部に有する密閉容器 3と、この密閉容器 3を 支持する台車部 4とを備えている。ここでいう「基板」には、ガラス基板や半導体基板 等の被処理基板は勿論、メタルマスクゃレチクル等のマスク基板等も含まれる。また、 台車部 4は自走式でもよ ヽし、作業者による手押し方式でもよ!/ヽ。 FIG. 1 shows a schematic configuration of the substrate transfer device 1. The substrate transfer device 1 includes a sealed container 3 having a cassette 2 in which a plurality of substrates can be stored in a height direction, and a cart 4 supporting the sealed container 3. The term “substrate” here refers to a glass substrate or semiconductor substrate And the like, as well as mask substrates such as metal masks and reticles. The bogie unit 4 may be a self-propelled type or a manual push type by an operator!
[0021] 密閉容器 3は、内部が真空又は大気圧以上の高圧に保持できる構造を有している 。密閉容器 3の一部側壁には、カセット 2と後述する基板処理装置との間で基板の受 け渡しを行う断面矩形状の開口 5が形成されていると共に、この開口 5を開閉するバ ルブユニット 6が設けられて 、る。 The closed container 3 has a structure in which the inside can be maintained at a vacuum or a high pressure equal to or higher than the atmospheric pressure. An opening 5 having a rectangular cross section for transferring substrates between the cassette 2 and a substrate processing apparatus to be described later is formed on a part of the side wall of the closed container 3, and a valve for opening and closing the opening 5 is provided. Unit 6 is provided.
[0022] バルブユニット 6は、開口 5を開放又は閉塞するバルブ本体 7と、このバルブ本体 7 を図示する閉塞位置へ付勢する付勢手段(図示略)が内蔵されている。この付勢手 段としては、機械式パネや、圧縮ガスを利用したガススプリング等が適用可能である。 The valve unit 6 has a built-in valve body 7 for opening or closing the opening 5 and an urging means (not shown) for urging the valve body 7 to a closed position shown in the figure. As the biasing means, a mechanical panel, a gas spring using compressed gas, or the like can be applied.
[0023] バルブ本体 7の下端部には、バルブユニット 6の外方へ延在するガイドロッド 8がー 体的に固定されており、このガイドロッド 8のフランジ状の端部 8Aがバルブユニット 6 のケーシングに当接することにより、バルブ本体 7の図示する閉塞位置が位置決めさ れている。 At the lower end of the valve body 7, a guide rod 8 extending outward from the valve unit 6 is fixed physically, and a flange-like end 8 A of the guide rod 8 is attached to the valve unit 6. The illustrated closed position of the valve body 7 is positioned by contact with the casing.
[0024] ここで、ガイドロッド 8は、バルブ本体 7に対する本発明の「駆動力被伝達部(軸状部 材)」に相当し、後述するように、基板処理装置 15に搭載された第 1の駆動源 21を含 むバルブ開閉機構 19に連結され、昇降駆動されるようになっている。ガイドロッド 8の 端部 8Aは、例えば鉄、磁性ステンレス鋼等の磁性材料で構成されている。  Here, the guide rod 8 corresponds to the “drive force receiving portion (shaft-shaped member)” of the present invention with respect to the valve body 7, and as described later, the first rod mounted on the substrate processing apparatus 15. It is connected to a valve opening / closing mechanism 19 including a driving source 21 for driving up and down. The end 8A of the guide rod 8 is made of, for example, a magnetic material such as iron or magnetic stainless steel.
[0025] なお、バルブ本体 7の上端部にも同様なガイドロッド 9がー体的に固定されており、 このガイドロッド 9のフランジ状の端部 9Aがバルブユニット 6のケーシングに当接する ことにより、バルブ本体 7の開放位置が位置決めされるようになっている(図 2)。  [0025] A similar guide rod 9 is also fixed to the upper end of the valve body 7 in a body, and the flange-shaped end 9A of the guide rod 9 is brought into contact with the casing of the valve unit 6 so that the guide rod 9 comes into contact with the casing. The opening position of the valve body 7 is determined (FIG. 2).
[0026] カセット 2は、密閉容器 3の下部に設けられたカセット支持ユニット 10により、密閉容 器 3の内部において昇降自在に構成されている。カセット支持ユニット 10は、カセット 2の下端に一体的に固定された昇降軸 11と、この昇降軸 11の周囲を被覆するべ口 ーズ 12と、昇降軸 11の昇降移動をガイドすると共にべローズ 12と密閉容器 3との間 を気密に保持する支持部材 13等により構成されている。  The cassette 2 is configured to be able to move up and down inside the closed container 3 by a cassette support unit 10 provided below the closed container 3. The cassette support unit 10 includes an elevating shaft 11 integrally fixed to a lower end of the cassette 2, a bellows 12 covering the periphery of the elevating shaft 11, a guide for elevating the elevating shaft 11, and a bellows. It is composed of a support member 13 and the like for keeping the space between the airtight container 12 and the closed container 3 airtight.
[0027] ここで、昇降軸 11は、カセット 2に対する本発明の「駆動力被伝達部 (軸状部材)」 に相当し、後述するように、基板処理装置 15に搭載された第 2の駆動源 22を含む力 セット昇降機構 20に連結され、昇降駆動されるようになっている。昇降軸 11の端部 1 1Aは、例えば鉄、磁性ステンレス鋼等の磁性材料で構成されている。 Here, the elevating shaft 11 corresponds to the “driving force receiving portion (shaft-shaped member)” of the present invention for the cassette 2, and as will be described later, a second drive mounted on the substrate processing apparatus 15. It is connected to a force set elevating mechanism 20 including a source 22 so as to be driven up and down. End of lifting shaft 11 1 1A is made of a magnetic material such as iron or magnetic stainless steel.
[0028] 次に、図 2を参照して、基板搬送装置 1が接続される基板処理装置 15の構成につ いて説明する。図 2は、基板搬送装置 1と基板処理装置 15との接続状態を示してい る。 Next, the configuration of the substrate processing apparatus 15 to which the substrate transport apparatus 1 is connected will be described with reference to FIG. FIG. 2 shows a connection state between the substrate transfer device 1 and the substrate processing device 15.
[0029] 基板処理装置 15は、基板搬送装置 1のカセット 2から基板を一枚ずつ取り出し、成 膜室等の所定の真空処理室へ基板を搬送する中間室ある!/、は予備室に相当し、真 空蒸着装置等の真空処理装置の一部を構成して!/、る。  [0029] The substrate processing apparatus 15 is an intermediate chamber for taking out substrates one by one from the cassette 2 of the substrate transport apparatus 1 and transporting the substrates to a predetermined vacuum processing chamber such as a film forming chamber. And constitute a part of a vacuum processing apparatus such as a vacuum evaporation apparatus!
[0030] この基板処理装置 15は、真空搬送装置 1のバルブユニット 6と接続し、カセット 2か ら取り出した基板を真空チャンバ (成膜室等)に搬送する通路 16を内部に有する接 続管 17と、通路 16を真空排気する真空ポンプ 18と、バルブユニット 6を開閉駆動す る第 1の駆動源 21を含むバルブ開閉機構 19と、カセット 2を昇降駆動する第 2の駆動 源 22を含むカセット昇降機構 20等を備えて 、る。  [0030] The substrate processing apparatus 15 is connected to the valve unit 6 of the vacuum transfer apparatus 1, and has a connection pipe 16 having therein a passage 16 for transferring a substrate taken out of the cassette 2 to a vacuum chamber (such as a film formation chamber). 17, a vacuum pump 18 for evacuating the passage 16, a valve opening / closing mechanism 19 including a first drive source 21 for opening and closing the valve unit 6, and a second drive source 22 for raising and lowering the cassette 2 A cassette lifting mechanism 20 is provided.
[0031] 接続管 17の端部には、基板搬送装置 1のバルブユニット 6の前面部に形成された 基準孔 6a (図 1)に嵌合する基準ピン 17aが設けられており、バルブユニット 6と接続 管 17との接続位置は、これら基準孔 6a及び基準ピン 17aの嵌合位置を基準としてい る。なお、接続間 17の端部には、バルブユニット 6との間を気密に保持するシール構 造が適用されているものとする。  [0031] At an end of the connection pipe 17, a reference pin 17a that fits into a reference hole 6a (FIG. 1) formed on the front surface of the valve unit 6 of the substrate transfer device 1 is provided. The connection position between the connection hole and the connection pipe 17 is based on the fitting position of the reference hole 6a and the reference pin 17a. It is assumed that a seal structure for keeping the space between the connection 17 and the valve unit 6 airtight is applied to the end of the connection 17.
[0032] バルブ開閉機構 19及びカセット昇降機構 20は、共に、基板処理装置 15の一部を 構成する基台 30上に取り付けられている。以下、バルブ開閉機構 19及びカセット昇 降機構 20の構成について、それぞれ図 3及び図 4を参照して説明する。  The valve opening / closing mechanism 19 and the cassette elevating mechanism 20 are both mounted on a base 30 that constitutes a part of the substrate processing apparatus 15. Hereinafter, the configurations of the valve opening / closing mechanism 19 and the cassette elevating mechanism 20 will be described with reference to FIGS. 3 and 4, respectively.
[0033] ノ レブ開閉機構 19は、第 1の駆動源 21と、第 1の電磁石ユニット 31等を備えてい る。  The knob opening / closing mechanism 19 includes a first drive source 21, a first electromagnet unit 31, and the like.
[0034] 第 1の駆動源 21は、接続管 17に接続されたバルブユニット 6の直下方に位置し、バ ルブユニット 6のバルブ本体 7を開閉する駆動源として構成されている。本実施の形 態では、第 1の駆動源 21は空圧シリンダでなり、その駆動ロッド 23は、ノ レブユニット 6のガイドロッド 8と同軸上に整列している。  The first drive source 21 is located immediately below the valve unit 6 connected to the connection pipe 17 and is configured as a drive source for opening and closing the valve body 7 of the valve unit 6. In the present embodiment, the first drive source 21 is a pneumatic cylinder, and the drive rod 23 is coaxially aligned with the guide rod 8 of the knob unit 6.
[0035] 次に、バルブユニット 6のバルブ本体 7は、開口 5を閉塞する位置へ常時付勢され ているので、開口 5を開放するためには、ガイドロッド 8を引き下げて、バルブ本体 7を 下方へ移動させる必要がある。そこで、空圧シリンダ (第 1の駆動源) 21の駆動ロッド 23の上端に第 1の電磁石ユニット 31を設置し、磁性材料でなるガイドロッド 8の端部 8 Aに磁力により結合させて、バルブユニット 6を開閉駆動するようにしている。 Next, since the valve body 7 of the valve unit 6 is constantly urged to the position where the opening 5 is closed, the guide rod 8 is pulled down to open the opening 5 and the valve body 7 is It needs to be moved down. Therefore, the first electromagnet unit 31 is installed at the upper end of the drive rod 23 of the pneumatic cylinder (first drive source) 21 and magnetically coupled to the end 8 A of the guide rod 8 made of a magnetic material. The unit 6 is driven to open and close.
[0036] 更に、空圧シリンダ 21の駆動ロッド 23は、基台 30に対し、ブラケット 24を介して取り 付けられたガイドブッシュ 25により支持されている。ブラケット 24の上端には、第 1の 電磁石ユニット 31に結合されバルブ開放位置へ引き下げられたガイドロッド端部 8A に係止するストッパ 26が取り付けられて!/、る。  Further, the drive rod 23 of the pneumatic cylinder 21 is supported by the guide bush 25 attached to the base 30 via the bracket 24. At the upper end of the bracket 24, a stopper 26 is attached, which is engaged with the first electromagnet unit 31 and is locked to the guide rod end 8A lowered to the valve open position.
[0037] このストッパ 26は回動軸 27に軸支され、図 3において実線で示すロック位置と、二 点鎖線で示すロック解除位置をとり得るように構成されており、常時、ロック解除位置 へ付勢されている。ストツバ 26をロック解除位置へ付勢する構造は特に限定されない 力 例えば、ストッパ 26の下端にスプリングプランジャを介装させたり、回動軸のまわ りにトーシヨンパネを設ける等の構成が適用可能である。  [0037] The stopper 26 is rotatably supported by a rotating shaft 27, and is configured to take a lock position indicated by a solid line in FIG. 3 and an unlock position indicated by a two-dot chain line. Being energized. The structure for urging the stopper 26 to the unlocked position is not particularly limited. For example, a structure in which a spring plunger is interposed at the lower end of the stopper 26 or a torsion panel is provided around the rotation shaft can be applied.
[0038] そして、ストッパ 26は、ガイドロッド端部 8Aの上面に係合する上フック部 26Aと、第 1の電磁石ユニット 31を支持する駆動ロッド 23上端の台座 23aの下面に係合する下 フック部 26Bとを有しており、駆動ロッド 23の下降の際、台座 23a力下フック部 26Bに 係合して、ストッパ 26を回動軸 27のまわりに回動させると共に、上フック部 26Aがガ イドロッド端部 8Aに係合するようになって 、る。  The stopper 26 has an upper hook 26A that engages with the upper surface of the guide rod end 8A, and a lower hook that engages with the lower surface of the pedestal 23a at the upper end of the drive rod 23 that supports the first electromagnet unit 31. When the drive rod 23 is lowered, the lower hook 26B engages with the pedestal 23a to rotate the stopper 26 around the rotation shaft 27, and the upper hook 26A It comes into engagement with the guide rod end 8A.
[0039] この構成により、不測の事態で第 1の電磁石ユニット 31に対する電源供給が絶たれ たとしても、スプリングバックによるバルブユニット 6の閉塞動作を禁止でき、開口 5の 開放状態を維持することができる。  With this configuration, even if the power supply to the first electromagnet unit 31 is interrupted due to an unexpected situation, the closing operation of the valve unit 6 due to springback can be prohibited, and the open state of the opening 5 can be maintained. it can.
[0040] 一方、カセット昇降機構 20は、第 2の駆動源 22を含むリニアガイドアクチユエータ 2 9と、第 2の電磁石ユニット 32等を備えている。  On the other hand, the cassette lifting / lowering mechanism 20 includes a linear guide actuator 29 including a second drive source 22, a second electromagnet unit 32, and the like.
[0041] リニアガイドアクチユエータ 29は、例えば、第 2の駆動源としての電動サーボモータ あるいはサーボシリンダ 22の駆動によりガイドブロック 34をガイドレール 33に沿って 昇降させ、最終制御位置が制御弁への入力信号の関数をなすような追従機構を一 体として備えた精密送り機構として構成されている。なお、当該送り機構をボールネ ジユニット等で構成してもよ 、。  The linear guide actuator 29 raises and lowers the guide block 34 along the guide rail 33 by driving an electric servomotor or a servo cylinder 22 as a second drive source, for example, and the final control position moves to the control valve. It is configured as a precision feed mechanism that has a follow-up mechanism that functions as a function of the input signal. Note that the feed mechanism may be constituted by a ball screw unit or the like.
[0042] ガイドブロック 34には、第 2の電磁石ユニット 32を支持するブラケット 35が取り付け られている。第 2の電磁石ユニット 32は、カセット 2の昇降軸 11の端部 11Aに磁力に より結合し、リニアガイドアクチユエータ 29の駆動により、ベローズ 12の伸縮を伴って 、カセット 2を密閉容器 3内で昇降させる。 [0042] A bracket 35 that supports the second electromagnet unit 32 is attached to the guide block 34. Have been. The second electromagnet unit 32 is coupled to the end 11A of the elevating shaft 11 of the cassette 2 by magnetic force. To raise and lower.
[0043] なお、第 2の電磁石ユニット 32には、ブラケット 35に支持されている可撓性導出管 3 6の内部を介して、図示しな!、電力供給システムに接続されて 、る。  The second electromagnet unit 32 is connected to a power supply system (not shown) via the inside of a flexible outlet tube 36 supported by a bracket 35.
[0044] 以上のように構成される基板搬送装置 11及び基板処理装置 15により、本発明の 基板搬送システムが構成される。次に、この作用について説明する。  The substrate transfer system of the present invention is configured by the substrate transfer device 11 and the substrate processing device 15 configured as described above. Next, this operation will be described.
[0045] 基板搬送装置 1の密閉容器 3の内部に配置されたカセット 2には、高さ方向に複数 枚の基板が収納されている。バルブユニット 6は開口 5を閉塞する位置にあり、密閉 容器 3の内部は、窒素雰囲気又は所定の真空圧に保持されている。  [0045] A plurality of substrates are housed in the cassette 2 arranged inside the closed container 3 of the substrate transfer device 1 in the height direction. The valve unit 6 is located at a position that closes the opening 5, and the inside of the sealed container 3 is maintained at a nitrogen atmosphere or a predetermined vacuum pressure.
[0046] 基板搬送装置 1は、基板処理装置 15の接続管 17の端部に設けられた基準ピン 17 aにバルブユニット 6の基準孔 6aを嵌合させることによって、基板処理装置 15との接 続が図られる。これにより、密閉容器 3の開口 5と接続管 17の通路 16とが整列する。  The substrate transfer device 1 is connected to the substrate processing device 15 by fitting the reference hole 6a of the valve unit 6 into the reference pin 17a provided at the end of the connection pipe 17 of the substrate processing device 15. Continued. Thereby, the opening 5 of the sealed container 3 and the passage 16 of the connection pipe 17 are aligned.
[0047] 基板搬送装置 1と基板処理装置 15との接続が完了すると、基板処理装置 15に設 けられたバルブ開閉機構 19の第 1の電磁石ユニット 31及びカセット昇降機構 20の 第 2の電磁石ユニット 32は、バルブユニット 6のガイドロッド下端 8A及びカセット 2の 昇降軸下端 11 Aにそれぞれ対向する。そこで、第 1,第 2の駆動源 21, 22をそれぞ れ作動させ、第 1,第 2の電磁石ユニット 31, 32をガイドロッド下端 8A及び昇降軸下 端 11 Aにそれぞれ当接させた後、電力を供給して磁力により互いに連結する。  When the connection between the substrate transfer apparatus 1 and the substrate processing apparatus 15 is completed, the first electromagnet unit 31 of the valve opening / closing mechanism 19 and the second electromagnet unit of the cassette elevating mechanism 20 provided in the substrate processing apparatus 15 32 faces the lower end 8A of the guide rod of the valve unit 6 and the lower end 11A of the elevating shaft of the cassette 2, respectively. Then, the first and second drive sources 21 and 22 are operated respectively, and the first and second electromagnet units 31 and 32 are brought into contact with the lower end 8A of the guide rod and the lower end 11A of the elevating shaft, respectively. , And are connected to each other by magnetic force.
[0048] 次に、真空ポンプ 18を作動させて、通路 16を所定の圧力にまで真空排気する。そ の後、バルブ開閉機構 19の作動により、ガイドロッド 8を付勢力に抗して引き下げ、開 口 5を開放し、密閉容器 3の内部と通路 16とを互いに連通させる(図 2)。  Next, the vacuum pump 18 is operated to evacuate the passage 16 to a predetermined pressure. Thereafter, the guide rod 8 is pulled down against the urging force by the operation of the valve opening / closing mechanism 19, the opening 5 is opened, and the inside of the sealed container 3 and the passage 16 are communicated with each other (FIG. 2).
[0049] この状態で、カセット 2から基板が真空チャンバへ搬入される。基板の搬入は、真空 チャンバ側に設置された図示しない搬送ロボットを介して行われる。基板処理装置 1 5における基板の処理は、カセット 2から取り出した基板を処理 (例えば成膜処理)し た後、当該処理済の基板をカセット 2の元の位置へ収納し、そして次なる基板をカセ ット 2から取り出して処理する方式や、カセット 2に収納された基板を順次取り出し、処 理済の基板を別途用意されている同様な構成の基板搬送装置へ搬出する方式等、 V、ずれの方式も適用できる。 In this state, the substrate is loaded from the cassette 2 into the vacuum chamber. Loading of the substrate is performed via a transfer robot (not shown) installed on the vacuum chamber side. In the processing of the substrate in the substrate processing apparatus 15, the substrate taken out of the cassette 2 is processed (for example, a film forming process), the processed substrate is stored in the original position of the cassette 2, and the next substrate is processed. For example, a method of taking out the substrate from the cassette 2 for processing, a method of sequentially taking out the substrates stored in the cassette 2 and carrying out the processed substrate to a separately prepared substrate transfer device having a similar configuration, etc. V, deviation method is also applicable.
[0050] このとき、カセット 2は、カセット昇降機構 20の駆動により昇降し、基板の取り出し位 置が調整される。本実施の形態では、精密送り可能なリニアガイドアクチユエータ 29 でカセット昇降機構 20が構成されて 、るので、カセット 2の任意の基板収納位置を所 定の取り出し位置へ精度良く供給することができる。  At this time, the cassette 2 is moved up and down by driving the cassette elevating mechanism 20, and the position for taking out the substrate is adjusted. In this embodiment, the cassette elevating mechanism 20 is constituted by the linear guide actuator 29 capable of precision feeding, so that any substrate storage position of the cassette 2 can be accurately supplied to a predetermined take-out position. it can.
[0051] さて、カセット 2に収納されている全ての基板に対する処理が完了した後、バルブ開 閉機構 19の作動によりバルブユニット 6は閉位置へ復帰される。このとき、密閉容器 3 の内部は、通路 16と同等の真空圧に保持される。そして、第 1,第 2の電磁石ユニット 31, 32に対する通電が解除され、これに伴って、ガイドロッド 8及び昇降軸 11との連 結が解除される。  After the processing for all the substrates stored in the cassette 2 is completed, the valve unit 6 is returned to the closed position by the operation of the valve opening / closing mechanism 19. At this time, the inside of the sealed container 3 is maintained at the same vacuum pressure as the passage 16. Then, the power supply to the first and second electromagnet units 31 and 32 is released, and accordingly, the connection between the guide rod 8 and the elevating shaft 11 is released.
[0052] その後、接続管 17の内部の通路 16は大気に解放され、基板搬送装置 1は、基板 処理装置 15力も切り離されて、処理済の基板あるいは空のカセット 2を次工程へ向け て搬送する。  [0052] Thereafter, the passage 16 inside the connection pipe 17 is released to the atmosphere, and the substrate transfer device 1 transfers the processed substrate or the empty cassette 2 to the next step with the power of the substrate processing device 15 also cut off. I do.
[0053] 以上のように、本実施の形態の基板搬送システムによれば、基板搬送装置 1と基板 処理装置 15との間で、基板を大気に曝すことなく搬入又は搬出することができ、例え ば有機 EL表示装置用ガラス基板等のように、大気に曝さないことが条件とされる被 処理基板の搬入出に対して効果的な基板処理システムを構築することができる。  As described above, according to the substrate transfer system of the present embodiment, a substrate can be loaded or unloaded between the substrate transfer device 1 and the substrate processing device 15 without exposing the substrate to the atmosphere. For example, it is possible to construct a substrate processing system that is effective for loading and unloading a substrate to be processed, which is not required to be exposed to the atmosphere, such as a glass substrate for an organic EL display device.
[0054] そして、本実施の形態によれば、基板搬送装置 1のバルブユニット 6及びカセット 2 を駆動する各駆動源を基板処理装置 15側に設けたので、基板搬送装置 1を基板処 理装置 15へ接続した後、バルブやカセットを駆動させるために圧空力ブラやコネクタ 一ケーブル等を用いた面倒な連結作業を廃止できるので、速やかに且つ的確にバ ルブの開閉動作及びカセットの昇降動作を行うことが可能となり、これにより作業性及 び生産性の向上を図ることができる。  According to the present embodiment, since the respective drive sources for driving the valve unit 6 and the cassette 2 of the substrate transfer device 1 are provided on the substrate processing device 15 side, the substrate transfer device 1 can be connected to the substrate processing device. After connecting to No. 15, troublesome connection work using a pneumatic bra or a connector cable to drive the valve or cassette can be eliminated, so that the valve opening / closing operation and cassette elevating operation can be performed quickly and accurately. This makes it possible to improve workability and productivity.
[0055] また、本実施の形態によれば、基板搬送装置 1のバルブユニット 6及びカセット 2を 駆動する各駆動源を基板処理装置 15側に設けたので、基板搬送装置 1の構成を簡 素化及び軽量ィ匕を図ることができ、これにより基板搬送装置 1の取り扱い性及び取り 回し性を高めることができる。  Further, according to the present embodiment, since the respective drive sources for driving the valve unit 6 and the cassette 2 of the substrate transfer device 1 are provided on the substrate processing device 15 side, the configuration of the substrate transfer device 1 is simplified. Therefore, it is possible to improve the handleability and maneuverability of the substrate transfer device 1.
[0056] 以上、本発明の実施の形態について説明した力 勿論、本発明はこれに限定され ることなく、本発明の技術的思想に基づいて種々の変形が可能である。 As described above, the power described in the embodiment of the present invention is, of course, limited to this. Without departing from the invention, various modifications are possible based on the technical concept of the present invention.
[0057] 例えば以上の実施の形態では、バルブユニット 6のガイドロッドとバルブ開閉機構 1 9の駆動ロッド 23との間の連結、及び、カセット 2の昇降軸 11とカセット昇降機構 20の リニアガイドアクチユエータ 29との間の連結を、それぞれ第 1,第 2の電磁石ユニット 3 1, 32で行うようにしたが、これに限らず、例えば機械的な係合作用等を伴った連結 形態を採用することも可能である。  For example, in the above embodiment, the connection between the guide rod of the valve unit 6 and the drive rod 23 of the valve opening / closing mechanism 19 and the linear guide actuation of the elevating shaft 11 of the cassette 2 and the cassette elevating mechanism 20 The connection with the writer 29 is performed by the first and second electromagnet units 31 and 32, respectively, but the present invention is not limited to this, and a connection form with a mechanical engagement action or the like is adopted. It is also possible.
[0058] また、基板搬送装置 1のバルブユニット 6を、ガイドロッド 8の引き下げ動作によって バルブ本体 7を開放位置へ移動させる構成を説明したが、逆に、ガイドロッドを上昇さ せてノ レブ本体を開放位置へ移動させる構成も適用可能である。この場合、バルブ 開閉機構の駆動ロッドは、端に、ガイドロッド端部と当接させるだけの構成とすること ができる。  Further, the configuration in which the valve unit 6 of the substrate transfer device 1 is moved to the open position by the lowering operation of the guide rod 8 has been described. Conversely, the guide rod is lifted to move the valve unit 6 up. Is also applicable to move the to the open position. In this case, the drive rod of the valve opening / closing mechanism may be configured such that the end only comes into contact with the end of the guide rod.
なお、バルブユニット 6の開閉動作は、ガイドロッドの上下方向の移動だけでなぐ横 方向又は回転方向の移動としてもよい。  The opening / closing operation of the valve unit 6 may be a lateral or rotational movement that is not limited to the vertical movement of the guide rod.
[0059] 更に、基板処理装置 15として、上述の実施形態では成膜装置等の真空処理装置 を例に挙げたが、勿論これに限られず、密閉容器 3内のカセット 2に対して基板を搬 入する仕込み室や、カセット 2から基板を取り出す取出し室等も、本発明の基板処理 装置として構成することができる。 Further, as the substrate processing apparatus 15, a vacuum processing apparatus such as a film forming apparatus is described as an example in the above-described embodiment, but is not limited to this, and the substrate is transferred to the cassette 2 in the closed container 3. A loading chamber for loading, a removal chamber for removing substrates from the cassette 2, and the like can also be configured as the substrate processing apparatus of the present invention.

Claims

請求の範囲 The scope of the claims
[1] 基板処理装置に対して基板の搬入又は搬出を行うための基板搬送装置であって 前記基板を高さ方向に複数収納できるカセットを内部に有する密閉容器と、この密 閉容器に形成され前記カセットと前記基板処理装置との間で前記基板の受け渡しを 行う開口を開閉するバルブとを備え、  [1] A substrate transfer device for loading or unloading a substrate from or to a substrate processing apparatus, the sealed container having a cassette capable of accommodating a plurality of the substrates in a height direction therein, and formed in the closed container. A valve for opening and closing an opening for transferring the substrate between the cassette and the substrate processing apparatus;
前記バルブ及び前記カセットには、外部の駆動源に結合されることにより駆動力が 伝達される駆動力被伝達部がそれぞれ設けられていることを特徴とする基板搬送装 置。  A substrate transfer device, wherein the valve and the cassette are provided with a driving force transmitting portion to which a driving force is transmitted by being coupled to an external driving source.
[2] 前記駆動力被伝達部は、それぞれ、軸方向へ移動されることにより前記バルブを開 閉し又は前記カセットを昇降させる軸状部材でなる請求の範囲第 1項に記載の基板 搬送装置。  2. The substrate transfer apparatus according to claim 1, wherein each of the driving force transmission portions is a shaft-shaped member that opens and closes the valve or moves the cassette up and down by being moved in an axial direction. .
[3] 前記軸状部材の端部は、前記外部の駆動源に対し、電磁石の磁気吸着力を介し て結合される請求の範囲第 2項に記載の基板搬送装置。  3. The substrate transfer device according to claim 2, wherein an end of the shaft-shaped member is coupled to the external drive source via a magnetic attraction force of an electromagnet.
[4] 前記バルブは、前記開口を閉塞する方向に常時付勢されて!、る記載の請求の範 囲第 1項に記載の基板搬送装置。 [4] The substrate transfer apparatus according to claim 1, wherein the valve is constantly urged in a direction to close the opening.
[5] 前記密閉容器を支持する台車部を備えた請求の範囲第 1項に記載の基板搬送装 置。 5. The substrate transfer device according to claim 1, further comprising a cart supporting the closed container.
[6] 基板搬送装置と基板処理装置との間で基板の搬入又は搬出を行うための基板搬 送システムであって、  [6] A substrate transport system for loading or unloading a substrate between a substrate transport device and a substrate processing device,
前記基板搬送装置は、前記基板を高さ方向に複数収納できるカセットを内部に有 する密閉容器と、この密閉容器に形成され前記カセットと基板処理装置との間で前 記基板の受け渡しを行う開口を開閉するノ レブとを備えていると共に、  The substrate transfer device includes an airtight container having therein a cassette capable of storing a plurality of the substrates in a height direction, and an opening formed in the airtight container for transferring the substrate between the cassette and the substrate processing apparatus. And a knob that opens and closes the
前記基板処理装置は、前記バルブを開閉する駆動源を含むバルブ開閉機構と、 前記カセットを昇降させる駆動源を含むカセット昇降機構とを備えており、  The substrate processing apparatus includes a valve opening / closing mechanism including a drive source for opening and closing the valve, and a cassette lifting mechanism including a drive source for lifting and lowering the cassette,
前記基板搬送装置は、前記基板処理装置に接続されることにより、前記バルブ開 閉機構及び前記カセット昇降機構を介して前記バルブ及び前記カセットがそれぞれ 駆動されることを特徴とする基板搬送システム。 The substrate transfer system, wherein the valve and the cassette are driven via the valve opening / closing mechanism and the cassette elevating mechanism, respectively, by being connected to the substrate processing apparatus.
[7] 前記バルブ及び前記カセットには、前記バルブ開閉機構及び前記カセット昇降機 構に結合されることにより駆動力が伝達される駆動力被伝達部がそれぞれ設けられ ている請求の範囲第 6項に記載の基板搬送システム。 7. The valve according to claim 6, wherein the valve and the cassette are provided with a driving force transmitting portion to which a driving force is transmitted by being coupled to the valve opening / closing mechanism and the cassette lifting mechanism. The substrate transfer system according to any one of the preceding claims.
[8] 前記駆動力被伝達部は、それぞれ、軸方向へ移動されることにより前記バルブを開 閉し又は前記カセットを昇降させる軸状部材でなる請求の範囲第 7項に記載の基板 搬送システム。 [8] The substrate transfer system according to claim 7, wherein each of the drive power transmission portions is a shaft-shaped member which is moved in an axial direction to open and close the valve or move the cassette up and down. .
[9] 前記軸状部材の端部は、前記バルブ開閉機構及び前記カセット昇降機構に対し、 電磁石の磁気吸着力を介して結合される請求の範囲第 8項に記載の基板搬送シス テム。  9. The substrate transfer system according to claim 8, wherein an end of the shaft-shaped member is coupled to the valve opening / closing mechanism and the cassette elevating mechanism via a magnetic attraction force of an electromagnet.
[10] 前記バルブは、前記開口を閉塞する方向に常時付勢されて 、る請求の範囲第 6項 に記載の基板搬送システム。  10. The substrate transport system according to claim 6, wherein the valve is constantly urged in a direction to close the opening.
[11] 前記基板搬送装置は、前記密閉容器を支持する台車部を備えている請求の範囲 第 6項に記載の基板搬送システム。 11. The substrate transfer system according to claim 6, wherein the substrate transfer device includes a carriage supporting the closed container.
PCT/JP2005/003172 2004-03-11 2005-02-25 Substrate transfer equipment and substrate transfer system provided with the substrate transfer equipment WO2005087632A1 (en)

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KR101293025B1 (en) * 2011-12-22 2013-08-05 에스엔유 프리시젼 주식회사 Mask Stock and Panel Passage Chamber, Method for Operating the same
CN104465448B (en) * 2013-09-18 2017-06-06 北京北方微电子基地设备工艺研究中心有限责任公司 A kind of piece box lifting device, Transmission system and semiconductor processing equipment

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JP4494831B2 (en) 2010-06-30

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