JP4475829B2 - 半導体装置の実装構造、電気光学装置及び電子機器 - Google Patents

半導体装置の実装構造、電気光学装置及び電子機器 Download PDF

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Publication number
JP4475829B2
JP4475829B2 JP2001040701A JP2001040701A JP4475829B2 JP 4475829 B2 JP4475829 B2 JP 4475829B2 JP 2001040701 A JP2001040701 A JP 2001040701A JP 2001040701 A JP2001040701 A JP 2001040701A JP 4475829 B2 JP4475829 B2 JP 4475829B2
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Japan
Prior art keywords
wiring
substrate
terminals
semiconductor device
terminal
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Expired - Lifetime
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JP2001040701A
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Japanese (ja)
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JP2001313308A (ja
JP2001313308A5 (enExample
Inventor
武 萩原
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2001040701A priority Critical patent/JP4475829B2/ja
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Publication of JP2001313308A5 publication Critical patent/JP2001313308A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2001040701A 2000-02-24 2001-02-16 半導体装置の実装構造、電気光学装置及び電子機器 Expired - Lifetime JP4475829B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001040701A JP4475829B2 (ja) 2000-02-24 2001-02-16 半導体装置の実装構造、電気光学装置及び電子機器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000048041 2000-02-24
JP2000-48041 2000-02-24
JP2001040701A JP4475829B2 (ja) 2000-02-24 2001-02-16 半導体装置の実装構造、電気光学装置及び電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008059075A Division JP4697248B2 (ja) 2000-02-24 2008-03-10 フレキシブル基板の接続構造、電気光学装置及び電子機器

Publications (3)

Publication Number Publication Date
JP2001313308A JP2001313308A (ja) 2001-11-09
JP2001313308A5 JP2001313308A5 (enExample) 2006-06-01
JP4475829B2 true JP4475829B2 (ja) 2010-06-09

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JP2001040701A Expired - Lifetime JP4475829B2 (ja) 2000-02-24 2001-02-16 半導体装置の実装構造、電気光学装置及び電子機器

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JP (1) JP4475829B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5169737B2 (ja) * 2002-04-18 2013-03-27 セイコーエプソン株式会社 電気光学装置及び電子機器
JP4720069B2 (ja) * 2002-04-18 2011-07-13 セイコーエプソン株式会社 電気光学装置及び電子機器
KR100864501B1 (ko) * 2002-11-19 2008-10-20 삼성전자주식회사 액정 표시 장치
JP3965695B2 (ja) 2004-01-30 2007-08-29 船井電機株式会社 液晶表示装置
US7710739B2 (en) 2005-04-28 2010-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
JP2007025710A (ja) * 2006-08-28 2007-02-01 Seiko Epson Corp 電気光学装置及び電子機器
JP5353969B2 (ja) * 2011-07-28 2013-11-27 セイコーエプソン株式会社 有機ｅｌ装置及び電子機器
JP6055225B2 (ja) 2012-07-30 2016-12-27 株式会社ジャパンディスプレイ タッチパネル付表示装置
JP6562715B2 (ja) * 2015-05-27 2019-08-21 キヤノン株式会社 配線基板および液体吐出ヘッド

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Publication number Publication date
JP2001313308A (ja) 2001-11-09

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