JP6562715B2 - 配線基板および液体吐出ヘッド - Google Patents
配線基板および液体吐出ヘッド Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/1752—Mounting within the printer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
- B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17553—Outer structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09254—Branched layout
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09272—Layout details of angles or corners
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Description
本実施形態における配線基板は、インクジェット記録ヘッド(液体吐出ヘッド)10に備わるフレキシブル配線基板20としての適用例である。まず、図1から図3に基づいて、本実施形態の基本構成について説明する。
図1は、インク(液体)を吐出可能な液体吐出ヘッドとしてのインクジェット記録ヘッド10の分解斜視図であり、そのヘッド本体11には、不図示のインクタンクが着脱可能に装着される。ヘッド本体11には、配線基板20と記録素子基板30が取り付けられた支持部材40が組み付けられる。図2は、記録素子基板30の斜視図である。
図4は、本実施形態における特徴的な構成を説明するための要部の拡大図である。図4は、配線基板20における代表的な1つの接続端子26Aと、それに対応する配線パターン23Aを透視した図であり、配線パターン23は、実際には、配線基板20における同図中の紙面の裏側に形成されている。
本実施形態においては、第1の実施形態における配線パターン23Aの幅広の部分に、2つのスリットS1−1,S1−2が形成されている。すなわち、その幅広の部分において分割された部分23A−1,23A−2に、それらの部分を接続する接続部分23A−3が形成されることにより、第1の実施形態におけるスリットS1が2つに分けられている。スリットS1は、2以上に分けてもよい。
本実施形態においては、図9のように、記録素子基板30の一側縁に沿って複数の電極端子34が配列されている。図9は、記録素子基板30における代表的な3つの電極端子34に対応する配線パターン23A,23B,23Cを透視した図であり、それらの配線パターンは、実際には、配線基板20における同図中の紙面の裏側に形成されている。
図10は、本実施形態における代表的な配線パターンを透視した図であり、それらの配線パターンは、実際には、配線基板20における同図中の紙面の裏側に形成されている。
本実施形態においては、図11のように、接続範囲A内に位置する共通の幅広の配線パターン23(2)内に、スリットS3が形成されている。すなわち、配線パターン23(2)は、その幅方向において2つの部分に分割され、それらの部分の間にスリットS3が形成されている。つまりスリットS3は、配線パターン23A,23Bの接続部分Pと、配線パターン23(2)の2分割された部分と、の間に形成されている。このスリットS3により、配線パターンの幅が均一化される。この結果、前述した実施形態と同様に、接着剤を均一に広げることができる。
本発明は、記録ヘッド用の配線基板のみに限定されず、種々の電気部品に接続される配線基板として広く適用することができる。また記録ヘッドは、種々のインクの他、液体を吐出する液体吐出ヘッドを構成するものであってもよい。このような液体吐出ヘッドは、液体を吐出することに種々の処理を実行する液体吐出装置に備えることができる。
20 配線基板
23 配線パターン
30 記録素子基板(素子基板)
34 バンプ(電極端子)
40 支持部材
Claims (10)
- 第1の方向に沿って配列された複数の接続端子と、前記複数の接続端子のそれぞれに接続される複数の配線パターンと、前記複数の配線パターンを覆うカバーフィルムと、が形成され、前記配線パターンに応じた起伏形状を有する前記カバーフィルムの面が接着剤によって支持部材に接着される配線基板であって、
前記配線基板はフレキシブル配線基板であり、
前記複数の配線パターンのそれぞれは、前記接続端子から前記第1の方向と交差する第2の方向に延在する第1の部分と、前記第1の部分から屈曲して延在する第2の部分と、を含み、
前記複数の配線パターンの少なくとも1つにおける前記第2の部分は、その幅方向において複数に分割されていることを特徴とする配線基板。 - 前記複数の配線パターンは、前記第2の部分が所定幅の第1の配線パターンと、前記第2の部分が前記所定幅よりも大きい第2の配線パターンと、を含み、
前記第2の配線パターンの前記第2の部分が幅方向において複数に分割されていることを特徴とする請求項1に記載の配線基板。 - 前記複数に分割される第2の部分は、前記配線基板における接着面内に位置することを特徴とする請求項1または2に記載の配線基板。
- 前記複数に分割される第2の部分は、前記第1の方向における前記複数の接続端子の配列範囲内に位置することを特徴とする請求項1から3のいずれ1項に記載の配線基板。
- 前記複数に分割される第2の部分は、当該第2の部分の長さ方向に延在するスリットを有することを特徴とする請求項1から4のいずれか1項に記載の配線基板。
- 前記スリットは、前記第2の部分の長さ方向において複数に分離されていることを特徴とする請求項5に記載の配線基板。
- 前記スリットは、前記配線基板の外側にまでは延在せずに前記配線基板の内側に位置することを特徴とする請求項5または6に記載の配線基板。
- 前記第2の方向は、前記第1の方向と直交する方向であり、
前記第2の部分は、前記第1の部分から前記第1の方向に屈曲して延在することを特徴とする請求項1から7のいずれか1項に記載の配線基板。 - 前記複数の接続端子は、前記配線基板の縁部に沿って配列されることを特徴とする請求項1から8のいずれか1項に記載の配線基板。
- 液体を吐出可能な液体吐出素子を備えた液体吐出ヘッドであって、
請求項1から9のいずれかに記載の配線基板と、
前記配線基板の複数の接続端子に接続される複数の電極端子を含む素子基板と、
を含むことを特徴とする液体吐出ヘッド。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015107297A JP6562715B2 (ja) | 2015-05-27 | 2015-05-27 | 配線基板および液体吐出ヘッド |
KR1020160061370A KR102069408B1 (ko) | 2015-05-27 | 2016-05-19 | 회로 보드 및 액체 토출 헤드 |
US15/161,731 US9832864B2 (en) | 2015-05-27 | 2016-05-23 | Circuit board and liquid ejection head |
EP16001184.7A EP3099144B1 (en) | 2015-05-27 | 2016-05-24 | Circuit board and liquid ejection head |
CN201610363374.9A CN106211547B (zh) | 2015-05-27 | 2016-05-26 | 电路板和液体喷出头 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015107297A JP6562715B2 (ja) | 2015-05-27 | 2015-05-27 | 配線基板および液体吐出ヘッド |
Publications (2)
Publication Number | Publication Date |
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JP2016221693A JP2016221693A (ja) | 2016-12-28 |
JP6562715B2 true JP6562715B2 (ja) | 2019-08-21 |
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Application Number | Title | Priority Date | Filing Date |
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JP2015107297A Active JP6562715B2 (ja) | 2015-05-27 | 2015-05-27 | 配線基板および液体吐出ヘッド |
Country Status (5)
Country | Link |
---|---|
US (1) | US9832864B2 (ja) |
EP (1) | EP3099144B1 (ja) |
JP (1) | JP6562715B2 (ja) |
KR (1) | KR102069408B1 (ja) |
CN (1) | CN106211547B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10654269B2 (en) | 2017-06-28 | 2020-05-19 | Canon Kabushiki Kaisha | Liquid ejection head |
JP6932571B2 (ja) | 2017-07-05 | 2021-09-08 | キヤノン株式会社 | 液体吐出ヘッド |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2606177B2 (ja) * | 1995-04-26 | 1997-04-30 | 日本電気株式会社 | 印刷配線板 |
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JP5979959B2 (ja) | 2012-04-27 | 2016-08-31 | キヤノン株式会社 | インクジェット記録ヘッド、記録ヘッドの製造方法、および記録装置 |
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2015
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- 2016-05-24 EP EP16001184.7A patent/EP3099144B1/en active Active
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EP3099144A1 (en) | 2016-11-30 |
CN106211547B (zh) | 2020-02-18 |
US9832864B2 (en) | 2017-11-28 |
JP2016221693A (ja) | 2016-12-28 |
US20160353565A1 (en) | 2016-12-01 |
KR20160140397A (ko) | 2016-12-07 |
EP3099144B1 (en) | 2020-09-09 |
KR102069408B1 (ko) | 2020-01-22 |
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