JP4475785B2 - 樹脂封止型半導体装置の製造方法 - Google Patents

樹脂封止型半導体装置の製造方法 Download PDF

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Publication number
JP4475785B2
JP4475785B2 JP2000292331A JP2000292331A JP4475785B2 JP 4475785 B2 JP4475785 B2 JP 4475785B2 JP 2000292331 A JP2000292331 A JP 2000292331A JP 2000292331 A JP2000292331 A JP 2000292331A JP 4475785 B2 JP4475785 B2 JP 4475785B2
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Japan
Prior art keywords
semiconductor element
lead frame
lead
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2000292331A
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English (en)
Japanese (ja)
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JP2002110879A5 (https=
JP2002110879A (ja
Inventor
知加雄 池永
幸治 冨田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2000292331A priority Critical patent/JP4475785B2/ja
Publication of JP2002110879A publication Critical patent/JP2002110879A/ja
Publication of JP2002110879A5 publication Critical patent/JP2002110879A5/ja
Application granted granted Critical
Publication of JP4475785B2 publication Critical patent/JP4475785B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2000292331A 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法 Expired - Lifetime JP4475785B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000292331A JP4475785B2 (ja) 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000292331A JP4475785B2 (ja) 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2002110879A JP2002110879A (ja) 2002-04-12
JP2002110879A5 JP2002110879A5 (https=) 2007-09-20
JP4475785B2 true JP4475785B2 (ja) 2010-06-09

Family

ID=18775288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000292331A Expired - Lifetime JP4475785B2 (ja) 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法

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JP (1) JP4475785B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523138B2 (ja) 2000-10-06 2010-08-11 ローム株式会社 半導体装置およびそれに用いるリードフレーム
CN1198331C (zh) 2001-12-27 2005-04-20 松下电器产业株式会社 布线结构的形成方法
WO2003090289A1 (fr) * 2002-04-19 2003-10-30 Asahi Kasei Electronics Co., Ltd. Transducteur magnetoelectrique et son procede de fabrication
US6667073B1 (en) * 2002-05-07 2003-12-23 Quality Platers Limited Leadframe for enhanced downbond registration during automatic wire bond process

Also Published As

Publication number Publication date
JP2002110879A (ja) 2002-04-12

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