JP4473592B2 - Dlcコーティング膜 - Google Patents
Dlcコーティング膜 Download PDFInfo
- Publication number
- JP4473592B2 JP4473592B2 JP2004026553A JP2004026553A JP4473592B2 JP 4473592 B2 JP4473592 B2 JP 4473592B2 JP 2004026553 A JP2004026553 A JP 2004026553A JP 2004026553 A JP2004026553 A JP 2004026553A JP 4473592 B2 JP4473592 B2 JP 4473592B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- coating film
- overlay layer
- layer
- dlc coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011248 coating agent Substances 0.000 title claims description 37
- 238000000576 coating method Methods 0.000 title claims description 37
- 238000005498 polishing Methods 0.000 claims description 61
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 12
- 229910003460 diamond Inorganic materials 0.000 claims description 9
- 239000010432 diamond Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000006061 abrasive grain Substances 0.000 claims description 5
- 239000000470 constituent Substances 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 27
- 238000004544 sputter deposition Methods 0.000 description 24
- 230000008020 evaporation Effects 0.000 description 17
- 238000001704 evaporation Methods 0.000 description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 14
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000000523 sample Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000011651 chromium Substances 0.000 description 9
- 229910002804 graphite Inorganic materials 0.000 description 9
- 239000010439 graphite Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 230000003247 decreasing effect Effects 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 238000005461 lubrication Methods 0.000 description 6
- 230000013011 mating Effects 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000000089 atomic force micrograph Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Physical Vapour Deposition (AREA)
Description
第1の発明により作製されたDLCコーティング膜は、低硬度材料(銅合金、アルミニウム合金、マグネシウム合金等)が相手材である場合には、相手材との摩擦によりなじみ面が迅速に得られるため、使用前の研磨処理を行うことなく好適に摺動部材として使用可能である。さらに、高硬度材料(鋼等)が相手材である場合には、低荷重下でも相手材との摩擦により迅速になじみ面が得られ、使用前の研磨処理を行うことなく好適に摺動部材として使用可能である。
2 ボンド層
3 中間層
4 トップ層
5 オーバレイ層
9 DLCコーティング膜
10a〜10d スパッタ蒸発源
20 UBMスパッタ装置
Claims (5)
- アンバランスマグネトロンスパッタ法を用いた、DLCコーティング膜の作製方法であって、
金属製ワークに印加するバイアス電圧を一定に保って、硬度が厚み方向に略一定であるトップ層を形成する工程と、
バイアス電圧を前記トップ層の形成時よりも低下させることにより、硬度が前記トップ層より低下しているオーバレイ層を前記トップ層上に形成する工程と、を備え、
前記オーバレイ層を前記トップ層上に形成する前記工程が、前記トップ層と前記オーバレイ層の構成元素比率を同じにして、バイアス電圧を所定の減少率で時間的に低下させる工程を含むことを特徴とするDLCコーティング膜の作製方法。 - さらに、ダイヤモンド砥粒を用いて前記オーバレイ層を研磨する工程を含むことを特徴とする請求項1に記載のDLCコーティング膜の作製方法。
- 前記オーバレイ層を研磨した後の研磨表面において、微小突起の高さが206nm以下であることを特徴とする請求項2に記載のDLCコーティング膜の作製方法。
- 前記オーバレイ層を研磨した後の研磨表面において、高さ10〜30nmの微小突起の数が高さ30nm以上の微小突起の数より大きいことを特徴とする請求項2に記載のDLCコーティング膜の作製方法。
- 前記オーバレイ層を研磨した後の研磨表面において、30nm以上の微小突起の密度が多くとも0.71×105/mm2、40nm以上の微小突起の密度が多くとも0.14×105/mm2、または80nm以上の微小突起の密度が多くとも6.9×103/mm2であることを特徴とする請求項2に記載のDLCコーティング膜の作製方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004026553A JP4473592B2 (ja) | 2003-02-07 | 2004-02-03 | Dlcコーティング膜 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003030248 | 2003-02-07 | ||
JP2004026553A JP4473592B2 (ja) | 2003-02-07 | 2004-02-03 | Dlcコーティング膜 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004256912A JP2004256912A (ja) | 2004-09-16 |
JP4473592B2 true JP4473592B2 (ja) | 2010-06-02 |
Family
ID=33133740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004026553A Expired - Fee Related JP4473592B2 (ja) | 2003-02-07 | 2004-02-03 | Dlcコーティング膜 |
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JP (1) | JP4473592B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006266285A (ja) * | 2005-03-22 | 2006-10-05 | Kayaba Ind Co Ltd | メカニカルシール |
JP2006303136A (ja) * | 2005-04-20 | 2006-11-02 | Shin Etsu Handotai Co Ltd | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
DE102008042747A1 (de) * | 2008-10-10 | 2010-04-15 | Federal-Mogul Burscheid Gmbh | Gleitelement in einem Verbrennungsmotor, insbesondere Kolbenring |
FR2975404B1 (fr) * | 2011-05-19 | 2014-01-24 | Hydromecanique & Frottement | Piece avec revetement dlc et procede d'application du revetement dlc |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1192935A (ja) * | 1997-09-19 | 1999-04-06 | Daido Steel Co Ltd | 耐摩耗性硬質炭素被膜 |
JP4683177B2 (ja) * | 2001-07-17 | 2011-05-11 | 住友電気工業株式会社 | 非晶質炭素被膜と非晶質炭素被膜の製造方法および非晶質炭素被膜の被覆部材 |
JP4085699B2 (ja) * | 2002-06-04 | 2008-05-14 | トヨタ自動車株式会社 | 摺動部材及びその製造方法 |
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2004
- 2004-02-03 JP JP2004026553A patent/JP4473592B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2004256912A (ja) | 2004-09-16 |
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