JP4473341B2 - 硬化性エポキシ組成物、異方性導電材料及び接続構造体 - Google Patents

硬化性エポキシ組成物、異方性導電材料及び接続構造体 Download PDF

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JP4473341B2
JP4473341B2 JP2009509200A JP2009509200A JP4473341B2 JP 4473341 B2 JP4473341 B2 JP 4473341B2 JP 2009509200 A JP2009509200 A JP 2009509200A JP 2009509200 A JP2009509200 A JP 2009509200A JP 4473341 B2 JP4473341 B2 JP 4473341B2
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epoxy
epoxy compound
curable
formula
weight
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JPWO2009107699A1 (ja
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敬士 久保田
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2009509200A 2008-02-28 2009-02-26 硬化性エポキシ組成物、異方性導電材料及び接続構造体 Expired - Fee Related JP4473341B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2008048219 2008-02-28
JP2008048219 2008-02-28
JP2008158972 2008-06-18
JP2008158972 2008-06-18
PCT/JP2009/053503 WO2009107699A1 (ja) 2008-02-28 2009-02-26 硬化性エポキシ組成物、異方性導電材料及び接続構造体

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JP4473341B2 true JP4473341B2 (ja) 2010-06-02
JPWO2009107699A1 JPWO2009107699A1 (ja) 2011-07-07

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JP (1) JP4473341B2 (zh)
KR (1) KR101329887B1 (zh)
CN (1) CN101959922B (zh)
TW (1) TWI449720B (zh)
WO (1) WO2009107699A1 (zh)

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JP5811688B2 (ja) * 2011-08-22 2015-11-11 デクセリアルズ株式会社 熱カチオン重合性組成物、異方性導電接着フィルム、接続構造体及びその製造方法
KR102494437B1 (ko) * 2015-11-10 2023-02-01 닛산 가가쿠 가부시키가이샤 장쇄 알킬렌기함유 에폭시 수지 조성물
JP7225546B2 (ja) * 2018-03-01 2023-02-21 味の素株式会社 封止用樹脂組成物

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2002145940A (ja) * 2000-11-14 2002-05-22 Tdk Corp 架橋性低比誘電性高分子材料ならびにそれを用いたフィルム、基板および電子部品

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JPS5341650B1 (zh) * 1969-01-31 1978-11-06
JP4238124B2 (ja) 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
EP1852452A1 (en) * 2005-02-23 2007-11-07 Asahi Kasei Chemicals Corporation Latent hardener for epoxy resin and epoxy resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002145940A (ja) * 2000-11-14 2002-05-22 Tdk Corp 架橋性低比誘電性高分子材料ならびにそれを用いたフィルム、基板および電子部品

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CN101959922B (zh) 2013-08-07
KR101329887B1 (ko) 2013-11-18
TWI449720B (zh) 2014-08-21
TW200951157A (en) 2009-12-16
JPWO2009107699A1 (ja) 2011-07-07
CN101959922A (zh) 2011-01-26
KR20100134569A (ko) 2010-12-23
WO2009107699A1 (ja) 2009-09-03

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