TW200951157A - Curable epoxy composition, anisotropic conductive material and connection structure - Google Patents

Curable epoxy composition, anisotropic conductive material and connection structure Download PDF

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Publication number
TW200951157A
TW200951157A TW098106529A TW98106529A TW200951157A TW 200951157 A TW200951157 A TW 200951157A TW 098106529 A TW098106529 A TW 098106529A TW 98106529 A TW98106529 A TW 98106529A TW 200951157 A TW200951157 A TW 200951157A
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Taiwan
Prior art keywords
epoxy
epoxy composition
inch
compound
formula
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TW098106529A
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Chinese (zh)
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TWI449720B (en
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Takashi Kubota
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Sekisui Chemical Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
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  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is a curable epoxy composition which can be quickly cured at low temperatures. When the curable epoxy composition is used for connection of a member to be connected, the member can be efficiently connected by the composition. The curable epoxy composition contains an epoxy component and a curing agent, and the epoxy component includes a monomer of an epoxy compound having a structure represented by formula (1), a polymer wherein at least two of the epoxy compounds are bonded, or a mixture of the monomer and the polymer. (1) In the formula (1), R1 and R2 each represents an alkylene group having 1-5 carbon atoms; R3 represents a hydrogen atom, an alkyl group having 1-5 carbon atoms or a structure represented by formula (2); and R4 represents a hydrogen atom, an alkyl group having 1-5 carbon atoms or a structure represented by formula (3). (2) (3) In the formula (2) and formula (3), R5 and R6 each represents an alkylene group having 1-5 carbon atoms.

Description

200951157 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種硬化性環氧組合物，更詳細而言，係 關於一種可於低溫下迅速硬化，用於電路基板或電子零件 等之電極間之接續之情形時，可有效率地接續該電極間之 硬化性環氧組合物，以及使用有該硬化性環氧組合物之各 向異性導電材料及接續構造體。 【先前技術】 廣為人知的是：各向異性導電膠、各向異性導電墨水、 各向異性導電黏接著劑、各向異性導電膜或各向異性導電 片材等之各向異性導電材料。 各向異性導電材料用於1(：晶片與可撓性印刷電路基板之 接續以及1C晶片與具有ITO電極之電路基板之接續等。例 如，於1C晶片之電極與電路基板之電極之間配置各向異性 導電材料後，進行加熱及加壓，藉此可彼此接續該等電 極。 作為上述各向異性導電材料之一例，於下述專利文獻i 中揭7F有含有熱硬化性絕緣性接著劑 '導電性粒子"米嚷 潛伏性硬化劑以及胺潛伏性硬化劑之各向異性導電接著 膜。於專利文獻1中記载，即便於使該各向異性導電接著 膜於較低溫度下硬化之情形時，接續可靠性仍優異。 [專利文獻1]日本專利特開平9_1 15335號公報 【發明内容】 [發明所欲解決之問題] 138858.doc 200951157 近年來，為了有效地接續電路基板或電子零件之電極 間，要求降低接續所需之加熱溫度，且縮短加壓時間。 又，由於電路基板或電子零件因加熱容易劣化，因此強烈 要求降低加熱溫度。 - 關於專利文獻1中所記載之各向異性導電接著膜，其開 . 肖硬化所需之加熱溫度較低1而，該各向異性導電接著 膜存在於低溫下未充分進行硬化反應之情形。因此，存在 φ 》下隋形，即，為了使用該各向異性導電接著膜來接續電 路基板或電子零件之電極間，必須提高加熱溫度或進行長 時間加熱。因此，無法有效地接續電極間。 本發月之目的在於提供一種可於低溫下迅速硬化，且用 於接續對象構件之接續之情形時，可有效地對接續對象構 行接續之硬化性環氧組合物，以及使用該硬化性環氧 組合物之各向異性導電材料及接續構造體。 :據本發明之較廣樣態，提供-種硬化性環氧組合物， ❹ =s有％氧成分與硬化劑’上述環氧成分含有具有由下述 表不之結構之環氧化合物之單體、至少 化合物餘莊 Λ农氧 • 、、，σ而成之多聚體、或該單體與該多聚體之昆八 物： 〇 . [化 1]200951157 VI. Description of the Invention: [Technical Field] The present invention relates to a curable epoxy composition, and more particularly to an electrode which can be rapidly hardened at a low temperature and used for a circuit board or an electronic part or the like In the case of the continuation, the curable epoxy composition between the electrodes can be efficiently connected, and the anisotropic conductive material and the splice structure using the curable epoxy composition can be used. [Prior Art] An anisotropic conductive material such as an anisotropic conductive paste, an anisotropic conductive ink, an anisotropic conductive adhesive, an anisotropic conductive film, or an anisotropic conductive sheet is widely known. The anisotropic conductive material is used for 1 (the connection between the wafer and the flexible printed circuit board, and the connection between the 1C wafer and the circuit substrate having the ITO electrode, etc., for example, between the electrodes of the 1C wafer and the electrodes of the circuit substrate; After the anisotropic conductive material is heated and pressurized, the electrodes can be connected to each other. As an example of the anisotropic conductive material, the following Patent Document i discloses that 7F contains a thermosetting insulating adhesive. An anisotropic conductive adhesive film of a conductive particle " rice bran latent curing agent and an amine latent curing agent. Patent Document 1 describes that the anisotropic conductive adhesive film is hardened at a lower temperature. In the case of the present invention, the reliability of the connection is still excellent. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 9-9-15335 [Draft of the Invention] [Problems to be Solved by the Invention] 138858.doc 200951157 In recent years, in order to efficiently connect circuit boards or electronic parts Between the electrodes, it is required to lower the heating temperature required for the connection and to shorten the pressing time. Further, since the circuit board or the electronic component is easily deteriorated by heating, It is strongly required to lower the heating temperature. - The anisotropic conductive adhesive film described in Patent Document 1 has a heating temperature lower than that required for the hardening of the first, and the anisotropic conductive adhesive film is present at a low temperature. The hardening reaction is sufficiently performed. Therefore, there is a φ 隋 shape, that is, in order to use the anisotropic conductive adhesive film to connect the electrodes of the circuit substrate or the electronic component, it is necessary to increase the heating temperature or heat for a long time. It is not possible to effectively connect the electrodes. The purpose of this month is to provide a hardenable epoxy composition which can be effectively bonded to a continuous object when it is rapidly hardened at a low temperature and used for the connection of a member to be connected. And an anisotropic conductive material and a bonded structure using the curable epoxy composition. According to a broader aspect of the present invention, a curable epoxy composition is provided, ❹ = s has a % oxygen component and hardens Agent 'The above epoxy component contains a monomer having an epoxy compound of the structure shown below, at least a compound of Yuzhuang, Oxygen, and σ a polymer, or a monomer of the monomer and the polymer: 〇 . [Chemical 1]

…式⑴ 138858.doc 200951157 數基’R1A^數為1〜5之伸μ ; 表示破 下述式(二二3構表？原子、破數為W烷基或由 基或由下述式(3)所表示之結構： 數為1〜5之燒 [化2] 、丫。、 0 kR5Formula (1) 138858.doc 200951157 The number of bases 'R1A^ is 1~5. It means breaking the following formula (2:2, 3, 3, 3, 3, 3, 3, 3, 4, 4, 4, 4 3) Structure shown: Number 1 to 5 of burning [Chemical 2], 丫., 0 kR5

Ο •式⑺ ;上述式（2)中，R5表示碳數為1 [化3] '5之伸烷基 〇Ο • Formula (7); In the above formula (2), R5 represents an alkylene group having a carbon number of 1 [Chemical Formula 3] '5

VV

R6- 0 '0 …式（3) 於上述式（3)中，R6表示碳數為1〜5之伸燒基。 〇 2發明之硬化性縣組合物之某特定 式⑴中，R3M4為氫原子。 於上通 ;本發明之硬化性環氧組合物之其他特定樣 1〇0重量％之上述環氧成分中，具有由上述式（⑽表-於 :構之環氧化合物之單體、至少2個該環氧化合物鍵= 成之多聚體或、該單體與該多聚趙之混合 = 5〜100重量％之範圍内。 之3置處於 班於本發明之硬化性環氧組合物之其他特定樣態中 %氧成分進而含有具有含氮原子之雜環的環氧化合物〆 138858.doc -6 - 200951157 於本發明之硬化性環氧組合物之進而其他 中，上述具有含氛岸+ 菩 寺疋樣〜、 、有3亂原子之雜環的環氧化合物為由下述式⑺ 所表不之化合物或由下述式(8)所表示之環氧化合物： [化4] 〇R6- 0 '0 Formula (3) In the above formula (3), R6 represents a stretching group having a carbon number of 1 to 5. In a specific formula (1) of the curable county composition of the invention, R3M4 is a hydrogen atom. In the above epoxy component of the other specific type of the curable epoxy composition of the present invention, the epoxy component having the epoxy compound of the above formula ((10) is at least 2 The epoxy compound bond = a polymer or a mixture of the monomer and the poly123 = 5 to 100% by weight. The 3 is placed in the curable epoxy composition of the present invention. In other specific aspects, the % oxygen component further contains an epoxy compound having a heterocyclic ring containing a nitrogen atom. 138858. doc -6 - 200951157 In the other of the curable epoxy composition of the present invention, the above has an atmosphere containing + The epoxy compound having a heterocyclic ring of 3 atoms is a compound represented by the following formula (7) or an epoxy compound represented by the following formula (8): [Chemical 4] 〇

R13 X Ο ，··式⑺R13 X Ο ,··(7)

於上述式⑺中，R11〜R A 別表不碳數為1〜5之伸烷 基，X表示環氧基或羥基甲基； [化5] 〇—Λ___R17 Ό—R14 Ο：In the above formula (7), R11 to R A represent an alkylene group having a carbon number of 1 to 5, and X represents an epoxy group or a hydroxymethyl group; [Chemical 5] 〇-Λ___R17 Ό-R14 Ο:

Ο -R19 Φ 0—7一一R18Ο -R19 Φ 0—7 one by one R18

Ο -R16 .式（8) 於上述式⑻中，R14~R⑽ 基；P、qh分別表示！〜5之整數；^讀為1〜5之仲炫 為1〜5之伸烷基。 7〜R19分別表示碳數 於本發明之硬化性環氧組合物之其 具有含氮原子之雜環的環氧化 異。 酸醋或三㈣乙基異氛屎酸箱三縮切= 138858.doc 200951157 於本發明之硬化性環氧組合物之進而其他之特定樣態 中，於100重量％之上述環氧成分中，上述具有含氮原子 之雜環的環氧化合物之含量處於0.1〜10重量％之範圍内。 於本發明之硬化性環氧組合物之其他特定樣態_，上述 %氧成分進而含有具有芳香族環之環氧化合物。 於本發明之硬化性環氧組合物之進而其他之特定樣態 中，上述芳香族環為苯環、萘環或蒽環。 本發明之各向異性導電材料含有根據本發明所構成之硬 化性環氧組合物與導電性粒子。 本發月之接續構造體包括硬化物層、藉由該硬化物層接 續而成之接續對象構件，上述硬化物層係藉由使含有根據 本發明所構成之硬化性環氧組合物與導電性粒子之各向異 性導電材料硬化而形成。 又，本發明之接續構造體包括硬化物層、藉由該硬化物 層接續而成之接續對象構件，上述硬化物層係藉由使根據 本發明所構成之硬化性環氧組合物硬化而形成。 (發明之效果） 本發明之硬化性環氧組合物由於含有上述具有特定結構 之環氧化合物之單體、至少2個該環氧化合物鍵結而成之 多聚體、或該單體與該多聚體之混合物與硬化劑，因此可 於低溫下迅速硬化。 又，若將本發明之硬化性環氧組合物用於接續對象構件 之接續時’則可有效率地接續該接續對象構件。若將含有 本發明之硬化性環氧組合物與導電性粒子之各向異性導電 138858.doc 200951157 材料用於電路基板或電子零件算 令1千寺之電極間之接續，則 效地接續該電極間。 【實施方式】 以下’對本發明加以詳細闡述。 (硬化性環氧組合物） ::明之硬化性環氧組合物含有環氧成分與 之簞科,, 式⑴所表不之結構之環氧化合物 之早體、至少2個該環氣化人从 视 , α物鍵結而成之多聚體、或核 早體與該多聚體之混合物 飞°褒 Α)〇 (Μ，有時略記為環氧成分 上述環氧成分Α為具有由下述 化合物之單體、至少2個，；v()所表不之結構之環氧 ^ R 亥％氧化合物鍵結而成之容臀 及該單體與該多聚體之混合物中之任一者.Ο -R16 . (8) In the above formula (8), R14~R(10) base; P and qh respectively represent! An integer of ~5; ^ read as 1~5 of the Zhongxuan is 1~5 of the alkyl group. 7 to R19 each represent an epoxidation of a heterocyclic ring having a nitrogen atom in the curable epoxy composition of the present invention. Sour vinegar or tris(tetra)ethyl isophthalic acid tricaprate = 138858.doc 200951157 In still another specific aspect of the curable epoxy composition of the present invention, in 100% by weight of the above epoxy component, The content of the above epoxy compound having a hetero ring containing a nitrogen atom is in the range of 0.1 to 10% by weight. In another specific aspect of the curable epoxy composition of the present invention, the above-mentioned % oxygen component further contains an epoxy compound having an aromatic ring. In still another specific aspect of the curable epoxy composition of the present invention, the aromatic ring is a benzene ring, a naphthalene ring or an anthracene ring. The anisotropic conductive material of the present invention contains the hard epoxy composition and the conductive particles constituted by the present invention. The splicing structure of the present month includes a cured layer, a splicing member formed by splicing the cured layer, and the cured layer is obtained by containing a curable epoxy composition and conductivity according to the present invention. The anisotropic conductive material of the particles is formed by hardening. Further, the splicing structure of the present invention includes a cured layer formed by splicing the cured layer, and the cured layer is formed by hardening the curable epoxy composition formed according to the present invention. . (Effect of the Invention) The curable epoxy composition of the present invention contains a monomer having an epoxy compound having a specific structure, a polymer obtained by bonding at least two of the epoxy compounds, or the monomer and the monomer. A mixture of polymers and a hardener, which can be rapidly hardened at low temperatures. Further, when the curable epoxy composition of the present invention is used for the connection of the member to be joined, the joining target member can be efficiently connected. If the anisotropic conductive 138858.doc 200951157 material containing the curable epoxy composition of the present invention and the conductive particles is used for the connection between the electrodes of the circuit substrate or the electronic component, the electrode is connected successively. between. [Embodiment] The present invention will be described in detail below. (Curable epoxy composition): The curable epoxy composition of the present invention contains an epoxy component and an anthraquinone of an epoxy compound having a structure represented by the formula (1), and at least two gasification persons of the ring. From the visual, alpha-bonded multimer, or a mixture of the nuclear precursor and the multimer, Μ(Μ, sometimes abbreviated as an epoxy component, the above epoxy component 具有 has a lower The monomer of the compound, at least two, v(), the structure of the epoxy group, the epoxy compound, and the mixture of the monomer and the polymer By.

[化6] 仕^ ·[化6] Shi ^ ·

…式（1) 这式（1)中，R1表示碳數為丨 數為1〜5之伸p ‘你 之伸烷基；R2表示碳 烷基；R3表示氫原子 下述式⑺所表示之結㈣:數為1〜5之貌基或由 基或由下述式⑺所表示之結構氫原子、碳數為1〜5之院 [化7] 138858.doc 200951157 T〇、R5_^l …式(2) ο ° 於上述式（2)中，R5表示碳數為卜5之伸烷基； [化8] ΐΉ…式(3) 於上述式（3)中，R6表示碳數為卜5之伸烷基。 右上述伸烷基之碳數超過5，則硬化性環氧組合物之硬 化速度降低。又，若上述烷基之碳數超過5，則硬化性環 氧組口物之硬化速度降低。若上述伸烷基及上述烷基之碳 數較小，則硬化性環氧組合物之硬化速度變高。 上述式（1)中之R1較好的是碳數為i〜3之伸烷基，更好的 是碳數為1或2之伸烷基，進而更好的是亞甲基。上述式（1) 中之R2較好的是碳數為卜3之伸烧基，更好的是碳數為丄或 2之伸烷基’冑而更好的是亞甲基。再者，上述伸烷基可 為具有直鍵結構者，亦可為具有支鏈結構者。又，上述似 與上述R2可相同’亦可不同。 述式（1)中之R3較好的是氫原子、碳數為之烷基或 由上述式⑺所表示之結構，更好的是氫原子、碳數為… 烷基或由上述式（2)所表示之結構，進而更好的是氯原 子、甲基或由上述式（2)所表示之結構。上述式⑴中之R4 138858.doc 200951157 較好的疋虱原子、碳數為卜3之烧基或 之結構，更好的县备s I八卩）所表不 ⑶ 疋氧原子、碳數為1或2之烷基或由上述式 (3)所表R結構，進而更好的是 (3)所裊千夕τ 田上迷式 '° 再者，上述烷基可為具有直鏈結構者， ./為具有支鏈m又，上㈣與上述邮相同， 亦可不同。 θ亡：式(2)中之R5較好的是碳數為1〜3之伸烷基，更好的 Φ ^石厌為1或2之伸燒基，進而更好的是亞甲基。上述式（3) 2::= 好的進是二數為1〜3之伸烧基’更好的是碳數為1或 ▲進而更好的是亞甲基。再者，上述伸烧基可 為具有直鏈結構者，亦可為具有支鍵結構者。 具有由上述式⑴所表示之結構之環氧化合物之特徵在 於:具有不飽和雙鍵與至少2個環氧基。本發明之硬化性 環乳組合物含有上述環氧成分A，因此可於低溫下迅速硬 進而#於本發明之硬化性環氧組合物中添加導電性 ❹’粒+將3有該導電性粒子之組合物用S電路基板或電子 零件等之電極間之接續，則可有效地接續該電極間。 #為具有由上述式⑴所表示之結構之環氧化合物，例 如可列舉：於上述式⑴中⑺為亞曱基，R2為亞甲基， .R3為氫原子以腿為氫原子之環氧化合物；於上述式⑴ 中R1為亞甲基’R2為亞曱基，R3為由下述式⑷所表示 之結構以及R4為氫原子之環氧化合物；以及於上述式（1) 中’ R1為亞甲基，R2為亞甲基以及R^R4分別為由下述 式（4)所表示之結構之環氧化合物等： 138858.doc • 11 · 200951157 [化9] 了 Ί …式(4) 由於可使硬化性環氧組合物於低溫下更加迅速地硬化， 因此較好的是上述式（1)中之尺3及尺4為氫原子。即，具有 由上述式（1)所表示之結構之環氧化合物較好的是具有由下 述式（1Α)所表示之結構者： [化 10]Formula (1) In the formula (1), R1 represents a carbon number of 1 to 5, and an alkyl group; R2 represents a carbon alkyl group; and R3 represents a hydrogen atom represented by the following formula (7). Junction (4): a number of 1 to 5 or a structural hydrogen atom represented by the following formula (7), a carbon number of 1 to 5 [Chemistry 7] 138858.doc 200951157 T〇, R5_^l ... Formula (2) ο ° In the above formula (2), R5 represents an alkylene group having a carbon number of 5; [Chemical Formula 8] ΐΉ... Formula (3) In the above formula (3), R6 represents a carbon number 5 alkylene. When the number of carbon atoms of the above alkyl group exceeds 5, the hardening rate of the curable epoxy composition is lowered. Further, when the carbon number of the alkyl group exceeds 5, the curing rate of the curable epoxy group is lowered. When the alkyl group and the alkyl group have a small carbon number, the curing rate of the curable epoxy composition becomes high. R1 in the above formula (1) is preferably an alkylene group having a carbon number of i to 3, more preferably an alkylene group having a carbon number of 1 or 2, and still more preferably a methylene group. R2 in the above formula (1) is preferably a stretching group having a carbon number of 3, more preferably a alkyl group having a carbon number of 丄 or 2 and more preferably a methylene group. Further, the above alkylene group may have a direct bond structure or a branched structure. Further, the above may be the same as the above R2'. R3 in the above formula (1) is preferably a hydrogen atom, an alkyl group having a carbon number or a structure represented by the above formula (7), more preferably a hydrogen atom, a carbon number of an alkyl group or a formula (2) The structure represented by the above formula is more preferably a chlorine atom, a methyl group or a structure represented by the above formula (2). R4 138858.doc 200951157 in the above formula (1) is preferably a ruthenium atom, a carbon number of the group 3 or a structure of the group, and a better county s I octopus). (3) The oxygen atom and the carbon number are The alkyl group of 1 or 2 or the R structure represented by the above formula (3), and more preferably (3) the 迷 τ τ 田 田 田 田 田 田 ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° . / For having a branch m, the upper (four) is the same as the above, and may be different. θ 死: R5 in the formula (2) is preferably an alkylene group having a carbon number of 1 to 3, more preferably Φ ^ stone is an extension group of 1 or 2, and more preferably a methylene group. The above formula (3) 2::= good is a stretching group having a number of 1 to 3, and more preferably a carbon number of 1 or ▲ and more preferably a methylene group. Further, the above-mentioned stretching base may have a linear structure or a structure having a branched structure. The epoxy compound having the structure represented by the above formula (1) is characterized by having an unsaturated double bond and at least two epoxy groups. Since the curable ring-shaped emulsion composition of the present invention contains the above-mentioned epoxy component A, it can be rapidly hardened at a low temperature, and further, conductive ❹' granules can be added to the curable epoxy composition of the present invention, and 3 conductive particles can be added. When the composition is connected by an electrode such as an S circuit board or an electronic component, the electrode can be effectively connected. #为为为为优选为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为为a compound; in the above formula (1), R1 is a methylene group wherein R2 is a fluorenylene group, R3 is an epoxy compound represented by the following formula (4), and R4 is a hydrogen atom; and in the above formula (1), 'R1 It is a methylene group, R2 is a methylene group, and R^R4 is an epoxy compound of a structure represented by the following formula (4): 138858.doc • 11 · 200951157 [Chemical 9] Since the curable epoxy composition can be hardened more rapidly at a low temperature, it is preferred that the rule 3 and the rule 4 in the above formula (1) are hydrogen atoms. That is, the epoxy compound having the structure represented by the above formula (1) preferably has a structure represented by the following formula (1): [Chem. 10]

…式（1Α) 於上述式（1)中，R1表示碳數為卜5之伸烷基，R2表示碳 數為1~5之伸烧基。 又，由於可使硬化性環氧組合物於低溫下進一步迅速地 硬化，因此更好的是於上述式⑴中，R1為亞甲基，以 亞曱基，R3為氫原子及R4為氫原子之具有由下述式⑽）所 表示之結構之環氧化合物： [化 11]In the above formula (1), R1 represents an alkylene group having a carbon number of 5, and R2 represents a stretching group having a carbon number of 1 to 5. Further, since the curable epoxy composition can be further rapidly cured at a low temperature, it is more preferable that in the above formula (1), R1 is a methylene group, an anthracene group, R3 is a hydrogen atom, and R4 is a hydrogen atom. An epoxy compound having a structure represented by the following formula (10): [Chem. 11]

…式（1B) 138858.doc 200951157 具有由上述式〇) 於本發明中，可變:不之結構之環氧化合物為單體。 氧化合物之單雜，上=述，“之結構之環 具有由上述式⑴所 物之早體與至少2個 聚體。其中，上述環氧成分 表示之結構之環氧化合物之j㈣疋具有由上述式⑴所 結而成之多聚體、或兮單體1〇個該環氧化合物鍵Formula (1B) 138858.doc 200951157 Having the above formula 〇) In the present invention, the epoxy compound having a variable structure is a monomer. a single hetero atom of an oxygen compound, as described above, "the ring of the structure has an early body and at least two polymers of the above formula (1). wherein the epoxy compound of the structure represented by the epoxy component has (j) a polymer formed by the above formula (1), or a monomer of the oxime monomer

是上述環氧化合物之單體二 體之混合物，更好的 成之多聚體、或該單Hi或3㈣環氧化合物鍵結而 θ _ „ /、μ多聚體之混合物，進而更好的 =體與該多聚體之混合物。若使用超過丨。個具有由上 二斤表:之結構之環氧化合物鍵結而成之多聚體，則 子硬化性環氧組合物之黏度變得過高之情形。再者，於 使用具有由上述式⑴所表示之結構之環氧化合物之單體之 情形時，含有2個或3個上述單體鍵結而成之多聚體作為副 產物’根據保管條件，上述單體有時鍵結2個以上。Is a mixture of monomeric dimers of the above epoxy compounds, more preferably a multimer, or a mixture of the single Hi or 3 (tetra) epoxy compound and a mixture of θ _ /, μ multimers, and thus better a mixture of a body and the polymer. If a polymer having a structure of an epoxy compound bonded by a ruthenium is used, the viscosity of the sub-curable epoxy composition becomes excessive. In the case of using a monomer having an epoxy compound having a structure represented by the above formula (1), a polymer having 2 or 3 monomers bonded as a by-product is used as a by-product. The above monomers may be bonded to two or more depending on storage conditions.

女於100重量％之本發明之硬化性環氧組合物中，上述環 氧成刀Α之3量較好的是處於5〜8〇重量％之範圍内，更好 的是處於1〇〜70重量％之範圍内。若上述環氧成分A之含量 過夕則存在無法充分提高低溫下之硬化速度之情形。若 上述環氧成分A之含量過多，則存在硬化劑之含量相對變 >、’無法使環氧成分A等充分硬化之情形。 100重量％之上述環氧成分中之上述環氧成分人之含量較 好的疋處於5~1〇〇重量％之範圍内。又，併用上述環氡成 分A與該環氧成分a以外之其他環氧成分（以下亦稱為環氧 138858.doc •13· 200951157 成分B)之情形時，較好的县舌 彳㈣的疋100重篁〇/〇之上述環I成分令 之上柄氣成分Α之含量處於5〜9〇重量％之範圍内。上述 環氧成分A之含量處於上述較好之範圍内之情形時，可使 硬化性環氧組合物於低溫下更加迅速地硬化。⑽重量％ 之二環氧成分中之上述環氧成分A之含量的更好下限為。 重篁/。，進而好之下限為4〇重量％，更好之上限為8〇重 重，進而好之上限為6〇重量0/〇。 本發明之硬化性環氧組合物可含有上述環氧成分A以外 之其他環氧成分（以下亦稱為環氧成分B)。 於上述環氧成分中’較好的是含有具有含氮原子之雜環 的環氧化合物B3作為上述環氧成分B。藉由使用環氧化人 物B3’可進-步提高硬化性環氧組合物之硬化物之❹ 性。又，由於可進-步提高硬化物之耐熱性，因此 子之雜環較好的是三畊骨架。 μ 又’於上述環氧成分中’亦可含有上述環氧化合物幻以 外之環氧樹脂m作為上述環氧成分Ββ又，於上述環氧成 分中’亦可含有上述環氧化合物Β3及環氧樹脂m以外之 環氧化合物B2。 本發明之硬化性環氧組合物較好的是含有上述環氧化入 物B2或上述環氧化合物B3,更好的是含有上述環氧化: 物B2’進而更好的是含有上述環氧化合物的與 化合物B3。 $ 具有上述環氧成分A之組合物之黏度較低。藉由併用上 述環氧成分A與上述環氧化合物B2，可提高硬化性環氧組 138858.doc 200951157 合物之黏度。又，藉由併用上述環氧成分A與上述環氧化 合物B3，可進一步提高硬化性環氧組合物之硬化速度，或 提高硬化性環氧組合物之硬化物之财熱性。尤其是，藉由 併用上述環氧成分A、上述環氧化合物B2與上述環氧化合 物B3，可提高硬化性環氧組合物之硬化速度，提高硬化性 環氧組合物之硬化物之财熱性，進而使硬化性環氧組合物 之塗敷變容易。 再者，所謂「環氧樹脂」，一般係指1分子中具有2個以 上環氧基，且分子量為1 0000以下之低分子量之聚合物或 預聚物，或由於該聚合物或預聚物之環氧基之開環反應而 生成之硬化性樹脂。硬化性樹脂可為熱硬化性樹脂，亦可 為光硬化性樹脂。 作為上述環氧樹脂B 1之具體例，可列舉：雙酚型環氧樹 脂、環氧酚醛清漆樹脂或具有萘結構之環氧樹脂等。 作為上述環氧化合物B2之市售品，例如可列舉Adeka Resin EP-3300S 及 Adeka Resin EP-3300E(以上均為 ADEKA 公司製造）。硬化性環氧組合物較好的是含有Adeka Resin EP-3300S 及 Adeka Resin EP-3300E中之至少一者，更好的 是含有Adeka Resin EP-3300S。藉由使用該等較好之市售 品，可有效地提高硬化性環氧組合物之黏度。 又，上述環氧化合物B2較好的是具有芳香族環之環氧化 合物。上述環氧成分較好的是含有具有芳香族環之環氧化 合物。藉由使用具有芳香族環之環氧化合物，可提高硬化 性環氧組合物之硬化速度，使硬化性環氧組合物之塗敷變 138858.doc -15- 200951157 容易。 萘環或蒽環，更好的是苯 步使硬化性環氧組合物之 上述芳香族環較好的是苯環、 環或萘環。於此情形時，可進一 塗敷變容易。 -植L廿1 ,述〜族環之環氧化合物，可列舉間苯二酴 :縮：甘油醚或!，6-蔡二縮水甘油趟，尤其好的是間苯二 ^ 藉由使用間苯二酚二縮水甘油醚，可提 乳組合物之硬化速度，使硬化性環氧組合物之 塗敷變谷易。In 100% by weight of the curable epoxy composition of the present invention, the amount of the above-mentioned epoxy-forming knives is preferably in the range of 5 to 8% by weight, more preferably 1 to 70%. Within the range of % by weight. If the content of the epoxy component A is too long, the curing rate at a low temperature may not be sufficiently increased. When the content of the epoxy component A is too large, the content of the curing agent may be relatively changed, and the epoxy component A or the like may not be sufficiently cured. The content of the above-mentioned epoxy component in 100% by weight of the above epoxy component is preferably in the range of 5 to 1% by weight. Further, when the above-mentioned cyclic oxime component A and other epoxy components other than the epoxy component a (hereinafter also referred to as epoxy 138858.doc •13·200951157 component B) are used in combination, the sputum of the county tongue (four) is better. The above ring I component of 100 篁〇/篁〇 makes the content of the upper stalk component 处于 in the range of 5 to 9 〇 wt%. When the content of the epoxy component A is in the above preferred range, the curable epoxy composition can be hardened more rapidly at a low temperature. The lower limit of the content of the epoxy component A in the (10)% by weight of the epoxide component is preferably. Repeat /. Further, the lower limit is 4% by weight, and the upper limit is preferably 8〇, and the upper limit is 6〇0/〇. The curable epoxy composition of the present invention may contain an epoxy component other than the epoxy component A (hereinafter also referred to as epoxy component B). Among the above epoxy components, the epoxy compound B3 containing a hetero ring having a nitrogen atom is preferred as the epoxy component B. The enthalpy of the cured product of the curable epoxy composition can be further improved by using the epoxidized human B3'. Further, since the heat resistance of the cured product can be further improved, the heterocyclic ring is preferably a three-plowed skeleton.又 and 'in the above epoxy component' may also contain the epoxy resin m other than the above epoxy compound as the epoxy component Ββ, and may also contain the above epoxy compound Β3 and epoxy in the above epoxy component. Epoxy compound B2 other than resin m. The curable epoxy composition of the present invention preferably contains the above epoxidized product B2 or the above epoxy compound B3, more preferably contains the above epoxidized: B2' and more preferably contains the above epoxy compound. With compound B3. The composition having the above epoxy component A has a low viscosity. By using the above epoxy component A together with the above epoxy compound B2, the viscosity of the curable epoxy group 138858.doc 200951157 can be improved. Further, by using the epoxy component A and the epoxide B3 in combination, the curing rate of the curable epoxy composition can be further increased, or the heat resistance of the cured product of the curable epoxy composition can be improved. In particular, by using the epoxy component A, the epoxy compound B2, and the epoxy compound B3 in combination, the curing rate of the curable epoxy composition can be increased, and the heat of the cured product of the curable epoxy composition can be improved. Further, the application of the curable epoxy composition is facilitated. In addition, the term "epoxy resin" generally means a low molecular weight polymer or prepolymer having two or more epoxy groups in one molecule and having a molecular weight of 1,000,000 or less, or due to the polymer or prepolymer. A curable resin produced by ring-opening reaction of an epoxy group. The curable resin may be a thermosetting resin or a photocurable resin. Specific examples of the epoxy resin B 1 include a bisphenol epoxy resin, an epoxy novolac resin, and an epoxy resin having a naphthalene structure. Examples of the commercial product of the epoxy compound B2 include Adeka Resin EP-3300S and Adeka Resin EP-3300E (all of which are manufactured by ADEKA Co., Ltd.). The curable epoxy composition preferably contains at least one of Adeka Resin EP-3300S and Adeka Resin EP-3300E, more preferably Adeka Resin EP-3300S. By using these preferred commercial products, the viscosity of the curable epoxy composition can be effectively improved. Further, the epoxy compound B2 is preferably an epoxide having an aromatic ring. The above epoxy component preferably contains an epoxide having an aromatic ring. By using an epoxy compound having an aromatic ring, the curing rate of the curable epoxy composition can be increased, and the application of the curable epoxy composition can be easily changed to 138858.doc -15-200951157. The naphthalene ring or the anthracene ring is more preferably a benzene step. The above aromatic ring of the curable epoxy composition is preferably a benzene ring, a ring or a naphthalene ring. In this case, it becomes easy to apply one more. - 植 L廿1, the epoxy compound of the family ring, which may be exemplified by isophthalic acid: condensed: glyceryl ether or !, 6-cai diglycidyl hydrazine, especially preferably isophthalic acid ^ by using isophthalic acid Diphenol diglycidyl ether, the hardening rate of the extractable composition, makes the coating of the curable epoxy composition easy to change.

由於可進一步提高硬化性環氧組合物之硬化速度因此 上述具有含氮之雜環的環氧化合物Β3較好的是具有至少2 個環氧基’更好的是具有3個環氧基。 ^述，氧化合物Β3較好的是由下述式⑺或下述式(8)所 表不之環氧化合物。藉由使用該等較好之環氧化合物，可 提Γ7硬化H環氧組合物之硬化速度’進—步提高硬化性環 氧組合物之硬化物之耐熱性：The epoxy compound Β3 having a nitrogen-containing hetero ring preferably has at least two epoxy groups, and more preferably has three epoxy groups, since the curing rate of the curable epoxy composition can be further increased. The oxygen compound Β3 is preferably an epoxy compound represented by the following formula (7) or the following formula (8). By using these preferred epoxy compounds, the hardening rate of the hardened H epoxy composition can be improved. The heat resistance of the cured product of the curable epoxy composition is further improved:

[化 12][化 12]

式⑺ 於上述式（7)中，R11〜R13分別表示碳數為ι〜5之伸燒 基’ X表不環氧基或羥基甲基；R11〜R13可相同，亦可不 138858.doc -16- 200951157 同； [化 13]In the above formula (7), R11 to R13 each represent an alkyl group having a carbon number of 1 to 5, wherein X is an epoxy group or a hydroxymethyl group; R11 to R13 may be the same or may not be 138858.doc -16 - 200951157 同; [化13]

於上述式（8)t，R14〜R16分別表示碳數為丨〜5之伸烷 基；p、qi分另表示卜5之整數；R17〜R19分別表示碳數 為1 5之伸烷基。R14〜R16可相同，亦可不同β p、咖可 相同’亦可不同。R17〜R19可相同，亦可不同。In the above formula (8), R14 to R16 each represent an alkylene group having a carbon number of 丨~5; p and qi are each an integer of 5; and R17 to R19 each represent an alkylene group having a carbon number of 15; R14 to R16 may be the same, or may be different from β p and coffee, or may be different. R17 to R19 may be the same or different.

若上述式（7)中之R11〜R13之碳數超過5，則存在硬化性 環氧組合物之硬化速度變低之情形。若Rn〜Rn之碳數較 小，則硬化性環氧組合物之硬化速度變高。上述式（乃中之 R11〜RU較好的是分別為碳數為卜3之伸院基，更好的是 碳數為1或2之伸烷基，進而更好的是亞甲基。 上述式（7)中之X較好的是環氧基。於此情形時，可提高 硬化性環氧組合物之硬化速度，進—步提高硬化性環氧： 合物之硬化物之耐熱性。 若上述式（8)中之R14 環氧組合物之硬化速度變低之情形。 小’則硬化性環氧組合物之硬化速度 〜R16之碳數超過5，則存在硬化性 若R14~R16之碳數較 變高。上述式（8)令之 R14〜R16較好的是分別為碳數為2〜4之伸烷基， 更好的是 138858.doc -17- 200951157 碳數為2或3之伸烷基，進而更好的是伸乙基。 又’若上述式（8)中之ρ、^Γ超過5，則存在硬化性環氧 組合物之硬化速度變低之情形。若p、q&r較小，則硬化 性環氧組合物之硬化速度變高。上述式（8)中之p、^及^較 好的是分別為1〜3之整數，更好的是〗或2，進而更好的是 若上述式（8)中之R17〜R19之碳數超過5’則存在硬化性 環氧組合物之硬化速度變低之情形。若Rl?〜幻9之碳數較 小，則硬化性環氧組合物之硬化速度變高。上述式中之 川〜R19較好的是分別為碳數為㈠之伸院基更好的是 碳數為1或2之伸烷基，進而更好的是亞曱基。 上述環氧化合物B3更好的是由上述式⑺所表示之環氧 化合物。藉由使用由上述式⑺所表示之環氧化合物，可提 南硬化性環氧組合物之硬化速度，進—步提高硬化性環氧 組合物之硬化物之耐熱性。 述環氧化合物晴好的是三祕乙基異氰尿酸酿 水甘油㈣三縮水甘油基異氰尿酸§旨，更好的是三縮切 油基異氰尿酸S旨。即’上述環氧化合㈣較好的是由 式叫或下述式（8A)所表示之環氧化合物，更好的是由； 述式⑽所表示之環氧化合物。藉由使㈣等較 化合物，可進—步提高硬純環氧組合物之硬化速度：氧 [化 14] 138858.doc 200951157When the carbon number of R11 to R13 in the above formula (7) exceeds 5, the curing rate of the curable epoxy composition may be lowered. When the carbon number of Rn to Rn is small, the curing rate of the curable epoxy composition becomes high. The above formula (in the above, R11 to RU is preferably a stretching group having a carbon number of 3, more preferably an alkyl group having 1 or 2 carbon atoms, and even more preferably a methylene group. The X in the formula (7) is preferably an epoxy group. In this case, the curing rate of the curable epoxy composition can be increased, and the heat resistance of the cured product of the curable epoxy compound can be further improved. When the R14 epoxy composition in the above formula (8) has a low curing rate, the hardening rate of the curable epoxy composition is less than 5, and the hardenability is R14 to R16. The carbon number is higher. The above formula (8) preferably makes R14 to R16 each an alkylene group having a carbon number of 2 to 4, more preferably 138858.doc -17- 200951157 having a carbon number of 2 or 3 Further, the alkyl group is more preferably an ethyl group. Further, when ρ and Γ in the above formula (8) exceed 5, the curing rate of the curable epoxy composition may be lowered. When q&r is small, the curing speed of the curable epoxy composition becomes high. In the above formula (8), p, ^ and ^ are preferably integers of 1 to 3, respectively, more preferably or 2 In More preferably, when the carbon number of R17 to R19 in the above formula (8) exceeds 5', the curing rate of the curable epoxy composition may be lowered. If the carbon number of R1 to Fantasy 9 is small, The hardening rate of the curable epoxy composition is high. In the above formula, it is preferred that each of the groups is a carbon number of (1), and a carbon number of 1 or 2, and further, The epoxy group B3 is more preferably an epoxy compound represented by the above formula (7). By using the epoxy compound represented by the above formula (7), the south hardenable epoxy composition can be extracted. The hardening speed further improves the heat resistance of the cured product of the curable epoxy composition. The epoxy compound is good for the third secret ethyl ethyl isocyanuric acid glycerin (tetra) triglycidyl isocyanuric acid § It is preferable that the above-mentioned epoxidized (tetra) is preferably an epoxy compound represented by the formula or the following formula (8A), more preferably (10) The epoxy compound represented by which the hard-pure epoxy composition can be further improved by making the compound (4) and the like Velocity: oxide [Formula 14] 138858.doc 200951157

[化 15][化15]

e ❷ 好二重虛量%之環氧成分中之上述環氧化合物B2之含量較 ==5:9:重量%之範圍内…上述環氧化合物Μ r产之1/%者’ 1()()4量％之環氧成分中之具有芳香 :壤之化合物之含量較好的是處於5〜95重量%之範圍内。 上述環氧化合_或具有芳香族環之環氧化合物之 3處於該範圍内，可進一步有效地提高硬化性環氧垣合 物之黏度。UH)重量％之±述環氧成分巾之上述環氧化合 物B2或具有芳香族環之環氧化合物的含量之更好之下限為 15重量％ ’進而好之下限為35重量。/。，更好之上限為”重 量％，進而好之上限為55重量％。 1〇〇重量％之環氧成分中之上述環氧化合物幻之含量較 138858.doc -19- 200951157 好的是處於〇·Η〇重量％之範圍内。又，上述環氧化合物 Β3係具有含氮原子之雜環者，刚重量％之環氧成分中之 具有含氮原子之雜環的環氧化合物之含量較好的是處於 0.1〜1〇重量％之範圍内。藉由使上述環氧化合物Β3或具有 含氮原子之雜環的環氧化合物之含量處於該範圍内，可提 高硬化性環氧組合物之硬化速度，進一步提高硬化性環氧 組合物之硬化物之耐熱性。 硬化性環氧組合物之黏度（25t)較好的是處於20000〜 100000 mPa，s之範圍内。 又，硬化性環氧組合物之氯離子濃度較好的是5〇〇 ppm 以下。右上述氣離子濃度過高，則存在硬化性環氧組合物 之硬化速度變慢之情形。再者，上述氣離子濃度例如可藉 由1pc發光分析而測定。 上述硬化劑並無特別限定。作為上述硬化劑，可列舉： 咪唑硬化劑、胺硬化劑、酚硬化劑、聚硫醇硬化劑或酸酐 等。其中，由於可使硬化性環氧組合物於低溫下更加迅速 地硬化，因此較好的是咪唑硬化劑、聚硫醇硬化劑或胺硬 化劑。又，混合上述環氧成分與上述硬化劑時，可提高保 存穩定性，因此較好的是潛伏性之硬化劑。潛伏性之硬化 劑較好的是潛伏性咪唑硬化劑、潛伏性聚硫醇硬化劑或潛 伏性胺硬化劑。該等硬化劑可僅使用丨種，亦可併用2種以 上。再者’上述硬化劑可經聚胺基甲酸酯樹脂或聚酯樹脂 等高分子物質所被覆。 作為上述咪唑硬化劑，並無特別限定，可列舉：2_甲基 138858.doc -20- 200951157 咪唑、2-乙基-4·•曱基咪唑、丨-氰基乙基笨基咪唑、卜氰 基乙基-2-笨基咪唾鑌偏苯三甲酸酯、二胺基甲 基咪唑基-(Γ)]-乙基-均三P井或2,4_二胺基_6_[2，_曱基咪唑 基-(I1)]-乙基-均三畊異三聚氰酸加成物等。 作為上述聚硫醇硬化劑，並無特別限定，可列舉：三羥 甲基丙烧三_3_疏基丙酸醋、季戊四醇四」邊基丙酸醋或 二季戊四醇六-3-毓基丙酸酯等。 ❹ 作為上述胺硬化劑，並無特別限定，可列舉··己二胺、 辛胺夭一胺、3,9_雙（3_胺基丙基）2,4,8，仏四螺[55】十 一院、雙（4-胺基環己基）甲烧、間苯二胺或二胺基二苯基 确I等。 上述硬化劑之含量並無特別限定。相對於總計100重量 份^上述環氧成分，上述硬化劑之含量較好的是處於卜⑽ 重量份之範圍内。若上述硬化劑之含量未達】重量份，則 存在硬化性環氧組合物未充分硬化之情形。若上述硬化劑 2量超過40重量份，則存在硬化性環氧組合物之硬化物 熱性降低之情形。再者，所謂「總計100重量份之環 不含上述環氧成分A以外之其他環氧成分B之 氧成二以vrr量份之上述環氧成分A;於含有上述環 量==氧成分0之情形時，係指總計_ 上述％氧成分A與上述環氧成分B。 再者，於上述硬化劑為咪唑 時，相對於總物〇番吾於 ^盼硬化劑之情形 Π十100重量份之上述環氧成 或酚硬化劑之含晉鲂极从β名 τ f硬化劑 3里較好的是處於1〜b重量份之範圍内。 138858.doc • 21 - 200951157 又，於上述硬化劑為胺硬化刺、聚硫醇硬化劑或酸軒之情 形時，較好的是相對於總計100重量份之上述環氧成分， 胺硬化劑、聚硫醇硬化劑或酸酐之含量處於15〜4〇重=份 之範圍内。 ” 為了調整組合物之黏度，或使所塗布之組合物不產生潤 濕擴散，本發明之硬化性環氧組合物可進而含有聚合性化 合物。上述聚合性化合物並無特別限定。作為上述聚合性 化合物，例如可列舉交聯性化合物或非交聯性化合物。上 述聚合性化合物可僅使用1種，亦可併用2種以上。 上述交聯性化合物並無特別限定。作為上述交聯性化合 物之具體例，例如可列舉：1，4- 丁二醇二（甲基）丙烯酸 西曰、1,6-己一醇_一（甲基）丙稀酸醋、1,9 -壬二醇二（曱基）丙 烯酸酯、（聚）乙二醇二（曱基）丙烯酸酯、（聚）丙二醇二（曱 基）丙烯酸酯、新戊二醇二（甲基）丙烯酸酯、季戊四醇二 (甲基）丙烯酸酯、甘油甲基丙烯酸酯丙烯酸酯、季戊四醇 三（甲基）丙烯酸酯、三羥曱基丙燒三甲基丙烯酸酯、（曱 基）丙烯酸烯丙酯、（甲基）丙烯酸乙烯酯、二乙烯苯、聚δ旨 (曱基）丙稀酸酯或（曱基）丙烯酸胺基甲酸醋等。 上述非交聯性化合物並無特別限定。作為上述非交聯性 化合物之具體例，可列舉：（曱基）丙烯酸乙酯、（曱基）丙 烯酸正丙酯、（曱基）丙烯酸異丙酯、（甲基）丙烯酸正丁 酯、（曱基）丙烯酸異丁酯、（甲基）丙烯酸第三丁酯、（曱基） 丙烯酸戊酯、（曱基）丙烯酸己酯、（曱基）丙烯酸庚酯、（曱 基）丙烯酸2-乙基己酯、（曱基）丙烯酸正辛酯、（曱基）丙烯 138858.doc -22- 200951157 酸，、辛知、（甲基）丙稀酸壬醋、（甲基）丙稀酸癸醋、（甲基) 丙稀酸十—烧醋、（甲基）丙浠酸十二㈣、（甲基）丙浠酸 十二烷酯或（甲基）丙烯酸十四烷酯等。 上述聚合性化合物之含量並無特別限定。相對於總計 • 副重量份之上述環氧成分，上述聚合性化合物之含量較 . ㈣^處於1G〜6G重量份之範圍内。若上述聚合性化合物 之含量未達10重量份，則存在硬化性環氧組合物之硬化物 φ 〖耐熱性降低之情形。若上述聚合性化合物之量超過60重 3伤則存在硬化性環氧組合物之黏度變得過高之情形。 由於可提兩硬化性環氧組合物之硬化物對被黏附體之接 著力本發月之硬化性環氧组合物較好的是含有接著力調 整劑。上述接著力調整劑較好的切烧偶合劑。 上述矽烷偶合劑並無特別限定。作為上述矽烷偶合劑， 例如可列舉.·Ν-(2_胺基乙基）_3_胺基丙基三甲氧基石夕院、 Ν-(2-胺基乙基）_3_胺基丙基甲基二甲氧基碎烧、胺基 ❿ 乙基）_3·胺基丙基二甲氧基碎烧、Ν·(2-胺基乙基）-3-胺基 丙基三乙氧基石夕燒、3_胺基丙基二甲基乙氧基石夕烧、3-胺 .基丙基甲基二乙氧基碎烧、3_胺基丙基三甲氧基發烧、3_ 胺基丙基三乙氧基石夕燒、乙婦基三乙氧基石夕烧、乙稀基三 . Τ氧基㈣、乙埽基三乙酿氧基㈣、乙烯基三氯石夕院、 3-酼基丙基二曱氧基矽烷、3_巯基丙基曱基二曱氧基矽 烷、3-氣丙基三甲氧基矽烷、3·氣丙基三乙氧基矽烷、3_ 曱基丙稀酸氧基丙基三曱氧基石夕炫、3-甲基丙稀醯氧基丙 基二乙氧基矽烷、乙基三甲氧基矽烷、丙基三甲氧基矽 138858.doc -23- 200951157 炫:丙基三乙氧基料、十二貌基三乙氧基残、己基三 甲氧基矽烷、第三丁基異丁基二乙氧基矽烷、甲基苯基二 乙氧基矽烷、3·縮水甘油氧基丙基三乙氧基矽烷或甲基苯 基-甲氧基石夕貌等。上述石夕烧偶合劑可僅使用！種亦可 併用2種以上。e ❷ The content of the above epoxy compound B2 in the epoxy component of the double virgin % is in the range of ==5:9:% by weight... 1% of the above epoxy compound Μ r is produced as 1 () () 4% by weight of the epoxy component having an aromaticity: the content of the compound of the soil is preferably in the range of 5 to 95% by weight. The above epoxidized _ or the epoxy compound having an aromatic ring 3 is in this range, and the viscosity of the curable epoxy conjugate can be further effectively improved. The lower limit of the content of the above epoxide B2 or the epoxy compound having an aromatic ring of the above-mentioned epoxy component is preferably 15% by weight and further preferably 35 parts by weight. /. The upper limit of the better is "% by weight, and the upper limit is preferably 55% by weight. The content of the above epoxy compound in the epoxy component of 1% by weight is better than 138858.doc -19- 200951157. Further, the above epoxy compound Β3 is a heterocyclic ring containing a nitrogen atom, and the epoxy compound having a nitrogen atom-containing heterocyclic ring in the epoxy component of the weight % is preferably contained. It is in the range of 0.1 to 1% by weight. The hardening epoxy composition can be hardened by setting the content of the above epoxy compound Β3 or an epoxy compound having a hetero ring containing a nitrogen atom within this range. The speed further increases the heat resistance of the cured product of the curable epoxy composition. The viscosity (25t) of the curable epoxy composition is preferably in the range of 20,000 to 100,000 mPa, s. The chlorine ion concentration of the substance is preferably 5 〇〇 ppm or less. When the concentration of the gas ion on the right is too high, the curing rate of the curable epoxy composition may be slow. Further, the gas ion concentration may be, for example, 1pc luminous score The curing agent is not particularly limited, and examples of the curing agent include an imidazole curing agent, an amine curing agent, a phenol curing agent, a polythiol curing agent, and an acid anhydride. The material hardens more rapidly at a low temperature, and therefore is preferably an imidazole hardener, a polythiol hardener or an amine hardener. Further, when the epoxy component and the hardener are mixed, storage stability can be improved, so that it is preferred. It is a latent hardener. The latent hardener is preferably a latent imidazole hardener, a latent polythiol hardener or a latent amine hardener. These hardeners can be used only in combination or in combination. Further, the above curing agent may be coated with a polymer material such as a polyurethane resin or a polyester resin. The imidazole curing agent is not particularly limited, and examples thereof include 2-methyl 138858. Doc -20- 200951157 Imidazole, 2-ethyl-4·•nonyl imidazole, 丨-cyanoethyl strepyrazole, cyanoethyl-2-phenylpyrylene trimellitate, diamine Methylimidazolyl-(Γ)]-ethyl-homogeneous P well 2,4-diamino- 6-[2,-mercapto-imidazolyl-(I1)]-ethyl-average tri-cyanate isocyanate adduct, etc. As the above-mentioned polythiol hardener, there is no particular The definition may be exemplified by trimethylolpropane tris- 3_succinyl propionic acid vinegar, pentaerythritol tetra-salt propionic acid vinegar or dipentaerythritol hexa-3-mercaptopropionate. ❹ The amine curing agent is not particularly limited, and examples thereof include hexamethylenediamine, octylamine monoamine, and 3,9-bis(3-aminopropyl)2,4,8, and ruthenium. 】 Eleven, bis (4-aminocyclohexyl) methyl, m-phenylenediamine or diaminodiphenyl is I and so on. The content of the above curing agent is not particularly limited. The content of the above-mentioned hardener is preferably in the range of (10) parts by weight based on 100 parts by weight of the total of the above epoxy components. If the content of the above-mentioned curing agent is less than 5% by weight, the curable epoxy composition may not be sufficiently cured. When the amount of the curing agent 2 exceeds 40 parts by weight, the heat of the cured product of the curable epoxy composition may be lowered. In addition, "the total amount of 100 parts by weight of the ring does not contain the epoxy component A of the epoxy component B other than the epoxy component A, and the above-mentioned epoxy component A is in a part of vrr; and contains the above ring amount == oxygen component 0 In the case of the above, it means a total of _% of the oxygen component A and the epoxy component B. Further, when the curing agent is imidazole, it is ten parts by weight relative to the total amount of the curing agent. The above-mentioned epoxy or phenolic hardener-containing bismuth is preferably in the range of 1 to b parts by weight from the β-name τ f hardener 3. 138858.doc • 21 - 200951157 In the case of an amine hardening thorn, a polythiol hardener or an acid hydrazine, it is preferred that the content of the amine hardener, the polythiol hardener or the anhydride is 15 to 4 with respect to a total of 100 parts by weight of the above epoxy component. The weight of the crucible is in the range of parts. The curable epoxy composition of the present invention may further contain a polymerizable compound in order to adjust the viscosity of the composition or to prevent the wetted diffusion of the applied composition. The polymerizable compound is not particularly limited. The polymerizable compound may, for example, be a crosslinkable compound or a non-crosslinkable compound. The above-mentioned polymerizable compound may be used alone or in combination of two or more. The crosslinkable compound is not particularly limited. Specific examples of the crosslinkable compound include 1,4-butanediol disodium bis(methyl)acrylate, 1,6-hexanol-mono(methyl) acrylate vinegar, and 1, 9-decanediol di(indenyl)acrylate, (poly)ethylene glycol di(decyl)acrylate, (poly)propylene glycol bis(indenyl)acrylate, neopentyl glycol di(meth)acrylate , pentaerythritol di(meth) acrylate, glycerin methacrylate acrylate, pentaerythritol tri(meth) acrylate, trishydroxypropyl propyl trimethacrylate, allyl (meth) acrylate, (a) Base) vinyl acrylate, divinyl benzene, poly δ (mercapto) acrylate or (mercapto) acryl carboxylic acid vinegar. The above non-crosslinkable compound is not particularly limited. Specific examples of the non-crosslinkable compound include ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, and n-butyl (meth) acrylate. Mercapto) isobutyl acrylate, tert-butyl (meth)acrylate, amyl (meth) acrylate, hexyl (decyl) acrylate, heptyl (decyl) acrylate, 2-ethyl (fluorenyl) acrylate Hexyl hexyl ester, n-octyl acrylate, (mercapto) propylene 138858.doc -22- 200951157 acid, qizhi, (meth) acrylate vinegar, (meth) acrylate vinegar , (meth)acrylic acid decocted vinegar, (meth)propionic acid dodeca(tetra), (meth)propionic acid dodecyl ester or (tetra)methyl (meth) acrylate. The content of the above polymerizable compound is not particularly limited. The content of the above polymerizable compound is more than the total weight of the above-mentioned epoxy component, and is in the range of 1 G to 6 G parts by weight. When the content of the polymerizable compound is less than 10 parts by weight, the cured product of the curable epoxy composition φ [heat resistance may be lowered. When the amount of the above polymerizable compound exceeds 60 weights, the viscosity of the curable epoxy composition becomes too high. Since the hardened material of the two hardenable epoxy compositions can be attached to the adherend, the hardenable epoxy composition of the present invention preferably contains an adhesive strength adjusting agent. The above-mentioned adhesion modifier is preferably a chopping coupler. The above decane coupling agent is not particularly limited. As the above-mentioned decane coupling agent, for example, Ν-(2-aminoethyl)_3-aminopropyltrimethoxy sylvestre, Ν-(2-aminoethyl)-3-aminopropyl group Trimethyst calcination, amino hydrazine ethyl) _3·aminopropyl dimethoxy cleavage, Ν·(2-aminoethyl)-3-aminopropyltriethoxy sulphur , 3-aminopropyl dimethyl ethoxylate, 3-amine propyl methacrylate, 3-aminopropyltrimethoxy fever, 3-aminopropyl Ethoxylated sulphur, Evolyl triethoxy sulphur, Ethyl sulphate, decyloxy (tetra), ethenyltriethyloxy (IV), vinyl triclosan, 3-mercaptopropyl Dimethoxy decane, 3-mercaptopropyl decyl decyloxy decane, 3-apropyl propyl trimethoxy decane, 3 · propyl propyl triethoxy decane, 3 - decyl propyl oxypropyl propyl Trioxane oxazepine, 3-methyl propyl methoxy propyl diethoxy decane, ethyl trimethoxy decane, propyl trimethoxy hydrazine 138858.doc -23- 200951157 Hyun: propyl triethyl Oxylate, dodecyl triethoxy residue, hexyl trimethoxy decane, tert-butyl butyl Diethoxy Silane, silane-diethoxy-methylphenyl, 3-glycidoxypropyl triethoxy silane-methylphenyl or - Xi cornerstone methoxy like appearance. The above Shi Xi Shao coupling agent can be used only! Two or more types may be used in combination.

上述石夕炫偶合劑之含量並無特別限定。相對於總計1〇〇 重量份之上述環氧成分，上述㈣偶合劑之含量較好的是 處於4〜20重量份之範圍内。若上述矽烷偶合劑之含量未達 重量伤則存在硬化性環氧組合物之硬化物對被黏附體 :接著力降低之情形。若上述矽烷偶合劑之含量超過重 里伤貝J存在硬化性環氧組合物變得難以硬化之情形。 較好的疋本發明之硬化性環氧組合物含有無機粒子。藉 使用上述無機粒子’可抑制硬化性環氧組合物之硬化物 由 作為上述無機 。上述無機粒 之潛熱膨脹。上述無機粒子並無特別限定。 粒子’可列舉二氧化矽、氮化鋁或氧化鋁等 子可僅使用1種，亦可併用2種以上。The content of the above Shi Xi Xuan coupling agent is not particularly limited. The content of the above (4) coupling agent is preferably in the range of 4 to 20 parts by weight based on the total of 1 part by weight of the above epoxy component. If the content of the above decane coupling agent is less than the weight loss, there is a case where the cured product of the curable epoxy composition is bonded to the adherend: the adhesion is lowered. If the content of the above decane coupling agent exceeds that of the heavy-duty smear, it is difficult to harden the curable epoxy composition. Preferably, the curable epoxy composition of the present invention contains inorganic particles. By using the above inorganic particles ', it is possible to suppress the cured product of the curable epoxy composition from being the above-mentioned inorganic material. The latent heat expansion of the above inorganic particles. The inorganic particles are not particularly limited. The particles ' may be exemplified by one type of cerium oxide, aluminum nitride or aluminum oxide, or two or more types may be used in combination.

/述無㈣子之含量並無特別限^。較好的是相對於總 计1〇0重量份之上述環氧成分’上述無機粒子之含量處於 3:900重量份之範圍内。若上述無機粒子之含量未達3重量 、J存在無法抑制硬化性環氧組合物之硬化物之潛熱膨 脹之情形。若±述無機粒子之含量超過_重量份，則存 在硬化性環氧組合物中未充分分散無機粒子之情形。 本發明之硬化性環氧組合物可含有藉由光照射或加熱而 產生反應活I·生種之聚合起始劑。肖由使用上述聚合起始 138858.doc -24· 200951157 劑，可進-步提高硬化性環氧組合物之硬化速度。 上述聚合起始劑並無特別限定。作為上冑聚合起始劑， 例如可列舉：苯乙銅聚合起始劑、㈣聚合起始劑、“ 鲖、醢基氧化膦或醯基膦酸醋等。上述苯乙網聚合起始劑 纟無特別限^。作為上述苯乙酮聚合起始劑之具體例，可 歹J舉.4_(2_經基乙氧基）苯基Ο經基-2-丙基）酮、2-經基_ 2-甲基-1-苯基丙烷-、甲氧基苯乙酮、2,2_二甲氧基_ φ 丨，2-二苯基乙烷_1_酮、2_羥基-2-環己基苯乙酮等。又，上 述縮弼聚合起始劑並無特別限定。作為上述縮嗣聚合起始 劑之具體例’可列舉苯偶酿二甲基縮綱等。上述聚合起始 劑可僅使用1種，亦可併用2種以上。 上述聚合起始劑之含量並無特別限定。相對於總計1〇〇 重ΐ份之上述環氧成分，上述聚合起始劑之含量較好的是 處於2〜1〇重篁份之範圍内。若上述聚合起始劑之含量未達 量伤則存在無法充分獲得添加聚合起始劑之效果之 ❹ 凊形。右上述聚合起始劑之含量超過1〇重量份，則存在硬 化性％氧组合物之硬化物對被黏附體之接著力降低之情 形。 本發明之硬化性環氧組合物之製造方法並無特別限定。 作為硬化性環氧組合物之製造方法之具體例，可列舉如下 製k方法.調配上述環氧成分、上述硬化劑及視需要所添 加之其他成分，使用行星式攪拌機等進行充分混合。 本發明之硬化性環氧組合物作為單成分型（〇ne料汰 type)接著劑，可用於液晶面板或半導體晶片等之接著。本 138858.doc -25- 200951157 發明之硬化性環氧組合物 著劑。 /狀接者劑，亦可為膜狀接 並2發明之硬化性環氧組合物加4膜狀接著劑之方法 物：：別限定。例如’可列舉將本發明之硬化性環氧组合 物塗布於脫膜紙等基材上而加工為膜狀接著劑之方 :本發明之硬化性環氧組合物中添加溶劑 塗布於 ㈣紙等基材上以較上述硬化劑之活性溫度=之 ’皿度’使溶劑揮發’從而加工為膜狀接著劑之方法等。 作為使本發明之硬化性環氧組合物硬化之方法，可列舉 對硬化性環氧組合物進行加熱之方法；對硬化性環氧組合 物照射光’繼而對硬化性環氧組合物進行加熱之方法；以 及對硬化性環氧組合物照射光，同時對硬化性環氧組合物 進行加熱之方法等。 使本發明之硬化性環氧組合物硬化時之加熱溫度較好的 是處於160〜25(TC之範圍内，更好的是處於16〇〜2〇〇。〇之範 圍内。由於本發明之硬化性環氧組合物可於低溫下硬化， 因此可降低加熱所需之能量。 關於先前之硬化性環氧組合物，若上述加熱溫度為 200 C以下，則硬化時間變長，例如若加熱溫度為2〇〇它， 則硬化時間會超過10秒。與此相對，關於本發明之硬化性 環氧組合物，即便上述加熱溫度為2〇〇〇c以下，亦可於短 時間内硬化’例如若加熱溫度為20(rc，則硬化時間即便 長亦未達10秒《再者，於本說明書中，所謂低溫，係指 200°C以下之溫度。 138858.doc -26 · 200951157 再者’作為使本發明之硬化性環氧組合杨硬化之方法， 與僅進行加熱之方法相比，藉由對硬化性環氧組合物照射 光’繼而對硬化性環氧組合物進行加熱之方法可使硬化性 環氧組合物於短時間内硬化。 對本發明之硬化性環氧組合物照射光時所使用之光源並 無特別限定。作為該光源，例如可列舉波長為42〇⑽以 下’具有充分之發光分布之光源等。又，作為光源之具體 ❿ 例，例如可列舉：低壓水銀燈、中壓水銀燈、高壓水銀 燈、超高壓水銀燈、化學燈、黑光燈、微波激發水銀燈或 金屬鹵素燈等。其中，較好的是化學燈。化學燈可有效地 發出聚合起始劑之活性波長區域之光，且組合物中之聚合 起始劑以外之其他成分之光吸收波長區域中之發光量較 ^進而，藉由使用化學燈，可有效率地使光達至組合物 内部所存在之聚合起始劑。 例如，於含有具有苯乙酮基之裂解型聚合起始劑之情形 ❹ 時，較好的是365 nm〜420 rnn之波長區域下之光照射強度 為 0.1 〜100 mW/cm2。 (各向異性導電材料） 藉由使本發明之硬化性環氧組合物中含有導電性粒子， ’ 可獲得各向異性導電材料。 上述導電性粒子電氣接續相對向之電氣接續部分之間， 例如電路基板之電極與電子零件之電極之間等。上述導電 ㈣衫為至少外表面具有導電性之粒子，則並無特別限 疋。作為上述導電性粒子，例如可列舉：有機粒子、無機 138858.doc •27· 200951157 粒子、有機無機混合粒子或金屬粒子等之表面以金屬層被 覆之導電性粒子或實質上僅由金屬所構成之金屬粒子等。 上述金屬層並無特別限定。作為上述金屬層，可列舉··金 層、銀層、銅層、鎳層、鈀層或含有錫之金屬層等。 上述導電性粒子之含量並無特別限定。相對於總計1〇〇 重量份之上述環氧成分，上述導電性粒子之含量較好的是 處於0.5〜5重量份之範圍内。若上述導電性粒子之含量未 達0.5重篁份，則存在無法確實地彼此導通電極之現象。 若導電性粒子之含量超過5重量份，則存在於不得導通之 〇 相鄰接之電極間產生短路之現象。 各向異性導電材料為液狀或膠狀之情形時，較好的是各 向異性導電材料之黏度（25°C)處於20000〜100000 mPa.Si 範圍内。右上述黏度過低，則存在導電性粒子於各向異性 導電材料中沈澱之現象。若上述黏度過高，則存在導電性 粒子未充分分散於各向異性導電材料中之現象。 又、，較好的是各向異性導電材料之氣離子濃度為5〇〇 pp x下若上述氯離子濃度過高，則存在各向異性導電 ® 材料中所含之硬化性環氧組合物之硬化速度變慢之現象。 本發明之各向異性導電材料可轉：各向異性導電膠、 各向異性導電墨水、各向異性導電黏接著劑、各向異性導 電模或各向異性導電片材等。本發明之含有導電性粒子之 各u導電材料用作各向異性導電膜或各向異性導電片 材等膜狀之接著劑之情形時，可於含有該導電性粒子之膜 狀接著劑上積層並不含導電性粒子之膜狀接著劑。 138858.doc •28· 200951157 (接續構造體） 使用本發明之各向異性導電材料，對接續對 接續，藉此可獲得接續構造體。接續對象構件較好的是Γ 子零件及電路基板中之至少一者。 的疋电 • 上述接續構造體包含硬化物層與接續對象構件， • 使本發明之各向異性導二= 之硬化性裱氧組合物硬化而形成。 較好的是上述接續構造體包括：具有第 第1接續對象構件、具有第2電氣接續部之第 件、作為電氣接續第i、第2電氣接續部之接續部分 ::形r化物層係藉由使本發明之各向異性導電材料硬 圖1係示意性地表示使用有包含本發明之-實施… =:r與導電性粒子之各向異性導電材_ 續構體之正面剖面圖。 ❹ 圖1所示之接續構造體1具備··第！接續對象構件2、第2 接續對象構件3以及電氣接續第1、第2接續對象構件2、3 =州。硬化物層4係接續部分，係使 導=粒子5之作為各向異性導電材料之各向異性導電膠 向形成。 於第1接續對象構件2之上面^設置有複數個電極2b。於 第2接續對象構件3之下面化設置有複數個電極外。經由藉 由3有¥電性粒子工之各向異性導電膠所形成之硬化物層 4,於第1接續對象構件2之上面2峨層有第2接續對象構件 138858.doc •29- 200951157 3°藉由導電性粒子5而電氣接續電極2b與電極3b。 作為上述接續構造體，具體可料導電接續有半導體曰 片、電容器及二極體等電子零件，以及印刷基板、可撓性曰 印刷基板及柄基板等電路基板之接續構造體。 本發明之接續構造體之製造方法並無㈣限定。作為接 績構造體之製造方、本 _ r ^ :裊w方法’可列舉如下之製造方法：於形成於 電子零件或電路基板等第〗接續對象構件上之第〗電極、與 形成於電子零件或電路基板等第2接續對象構件上之第2電 極之間配置上述各向異性導電材料，獲得積層體後，對該 積層體進行加熱、加壓。 以下’列舉實施例及比較例，對本發明加以具體說明。 本發明並不僅限定於以下實施例。 準備下述材料作為用轉得硬化性環氧組合物之環氧成 [環氧成分A] (1) 環氧化合物[A-1]:具有由上述式（1B)所表示之結構 之環氧化合物（具有由上述式（1)所表示之結構之環氧化合 物，且上述式（1)中之R1&R2為亞甲基’ 113及114為氫原子） (2) 裱氧化合物[A-2]:具有由上述式（1)所表示之結構 之環氧化合物，且上述式（1)中之R1&R2為正伸丙基，幻 及R4為氫原子 (3) 環氧化合物[A-3]:具有由上述式（1)所表示之結構 之環氧化合物，且上述式（1)中之R1&R2為正伸戊基，Μ 及R4為氫原子 138858.doc -30- 200951157 (4) 環氧化合物[A_4广具有由上述式（1)所表示之結構 之核氧化合物，且上述式（1)中之R1及R2為亞甲基，R3表 不由上述式（2)所表示之結構，且式中之R5為亞甲基， R4表不由上述式（3)所表示之結構，且上述式（3)中之R6為 亞甲基 (5) 環氧化合物[A_5]:具冑由下述式（1〇1)所表示之結 構之環氧化合物：There is no special limit to the content of the (4) sub. It is preferred that the content of the above inorganic particles is in the range of 3:900 parts by weight based on 1 to 0 parts by weight of the total of the above epoxy component. When the content of the inorganic particles is less than 3 parts by weight, J may not inhibit the latent heat expansion of the cured product of the curable epoxy composition. When the content of the inorganic particles exceeds _ parts by weight, the inorganic particles are not sufficiently dispersed in the curable epoxy composition. The curable epoxy composition of the present invention may contain a polymerization initiator which generates a reactive activity by light irradiation or heating. By using the above polymerization starting agent 138858.doc -24·200951157, the hardening speed of the hardenable epoxy composition can be further increased. The polymerization initiator is not particularly limited. Examples of the top polymerization initiator include a styrene copper polymerization initiator, (iv) a polymerization initiator, and “antimony, fluorenylphosphine oxide or decylphosphonic acid vinegar. The above-mentioned phenylethyl network polymerization initiator 纟There is no particular limitation. As a specific example of the above-mentioned acetophenone polymerization initiator, 4_(2_ mercaptoethoxy)phenylsulfonyl-2-propyl)one, 2-pyridyl can be mentioned. _ 2-Methyl-1-phenylpropane-, methoxyacetophenone, 2,2-dimethoxy_ φ 丨, 2-diphenylethane-1-one, 2-hydroxy-2- Further, the above-mentioned polycondensation polymerization initiator is not particularly limited. Specific examples of the above-mentioned polycondensation polymerization initiator include benzoin dimethyl reduction and the like. The content of the polymerization initiator is not particularly limited, and the content of the polymerization initiator is preferably at least 1 part by weight based on the total amount of the epoxy component. It is in the range of 2 to 1 〇. If the content of the above polymerization initiator is not up to the amount, there is a 凊 shape which cannot sufficiently obtain the effect of adding a polymerization initiator. When the content is more than 1 part by weight, the curing agent of the curable % oxygen composition may have a reduced adhesion to the adherend. The method for producing the curable epoxy composition of the present invention is not particularly limited. Specific examples of the method for producing the epoxy composition include the following k-method. The epoxy component, the curing agent, and other components added as needed are blended, and sufficiently mixed using a planetary mixer or the like. The epoxy composition can be used as a one-component type adhesive for a liquid crystal panel or a semiconductor wafer, etc. This 138858.doc -25- 200951157 invention is a curing epoxy composition composition. The contact agent may be a method of adding a film-like adhesive to the curable epoxy composition of the invention of the invention, and may be exemplified. For example, the curable epoxy composition of the present invention may be applied to The film is formed into a film-like adhesive on a substrate such as a release paper: a solvent is added to the substrate of the (4) paper or the like in the curable epoxy composition of the present invention to be more active than the above-mentioned curing agent. A method of processing a film-like adhesive agent by volatilizing a solvent. The method of curing the curable epoxy composition of the present invention includes a method of heating a curable epoxy composition; A method in which the oxygen composition is irradiated with light', followed by heating the curable epoxy composition, a method of irradiating the curable epoxy composition with light, and heating the curable epoxy composition, etc. The curability of the present invention is made. The heating temperature at which the epoxy composition is hardened is preferably in the range of 160 to 25 (TC), more preferably in the range of 16 Å to 2 Torr. Due to the curable epoxy composition of the present invention. It can be hardened at a low temperature, so that the energy required for heating can be reduced. With respect to the prior curable epoxy composition, if the heating temperature is 200 C or less, the hardening time becomes long, for example, if the heating temperature is 2 〇〇, Then the hardening time will exceed 10 seconds. On the other hand, in the curable epoxy composition of the present invention, even if the heating temperature is 2 〇〇〇 c or less, it can be cured in a short time. For example, if the heating temperature is 20 (rc, the curing time is long. In the present specification, the term "low temperature" means a temperature of 200 ° C or less. 138858.doc -26 · 200951157 Further, as a method of hardening the curable epoxy combination of the present invention, The curable epoxy composition can be cured in a short time by heating the curable epoxy composition by irradiating light to the curable epoxy composition as compared with the method of heating only. The light source used when the curable epoxy composition is irradiated with light is not particularly limited, and examples of the light source include a light source having a sufficient light emission distribution at a wavelength of 42 Å (10) or less. Further, as a specific example of the light source, For example, a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, a chemical lamp, a black light lamp, a microwave excited mercury lamp or a metal halide lamp, etc., among which, The chemical lamp can effectively emit light in the active wavelength region of the polymerization initiator, and the amount of luminescence in the light absorption wavelength region of the components other than the polymerization initiator in the composition is further improved by using chemistry. The lamp can efficiently bring the light to the polymerization initiator present inside the composition. For example, in the case of containing a cleavage polymerization initiator having an acetophenone group, it is preferably 365 nm to 420. The light irradiation intensity in the wavelength region of rnn is 0.1 to 100 mW/cm2. (Anisotropic conductive material) By providing conductive particles in the curable epoxy composition of the present invention, an anisotropic conductive material can be obtained. The conductive particles are electrically connected between the electrically connected portions, for example, between the electrodes of the circuit board and the electrodes of the electronic component, etc. The conductive (four) shirt is a particle having at least an outer surface having conductivity, and is not particularly limited. Examples of the conductive particles include organic particles and inorganic 138858.doc •27·200951157 particles, organic-inorganic hybrid particles or metal particles, and the like are made of metal. The conductive particles to be coated or the metal particles substantially composed only of a metal. The metal layer is not particularly limited. Examples of the metal layer include a gold layer, a silver layer, a copper layer, a nickel layer, and a palladium layer. The content of the conductive particles is not particularly limited, and the content of the conductive particles is preferably in the range of 0.5 to 5 parts by weight based on the total of 1 part by weight of the epoxy component. If the content of the conductive particles is less than 0.5 part by weight, there is a phenomenon that the electrodes cannot be reliably connected to each other. If the content of the conductive particles exceeds 5 parts by weight, the adjacent electrodes are not allowed to be turned on. When a positive conductive material is in the form of liquid or gel, it is preferred that the viscosity of the anisotropic conductive material (25 ° C) is in the range of 20,000 to 100,000 mPa·Si. When the above viscosity is too low, there is a phenomenon in which conductive particles are precipitated in the anisotropic conductive material. If the viscosity is too high, there is a phenomenon that the conductive particles are not sufficiently dispersed in the anisotropic conductive material. Further, it is preferred that the anisotropic conductive material has a gas ion concentration of 5 〇〇 pp x, and if the chloride ion concentration is too high, the curable epoxy composition contained in the anisotropic conductive material is present. The phenomenon that the hardening speed is slow. The anisotropic conductive material of the present invention can be transferred: an anisotropic conductive paste, an anisotropic conductive ink, an anisotropic conductive adhesive, an anisotropic conductive mold or an anisotropic conductive sheet. When each of the u conductive materials containing the conductive particles of the present invention is used as a film-like adhesive such as an anisotropic conductive film or an anisotropic conductive sheet, it can be laminated on a film-like adhesive containing the conductive particles. It does not contain a film-like adhesive of conductive particles. 138858.doc • 28· 200951157 (Continuous structure) Using the anisotropic conductive material of the present invention, the connection is continued, whereby the continuous structure can be obtained. Preferably, the connection target member is at least one of a die part and a circuit board. The above-mentioned connection structure includes a cured layer and a joint member, and is formed by curing the anisotropic conductive composition of the present invention. Preferably, the connection structure includes: a first connection target member, a first member having a second electrical connection portion, and a connection portion as an electrical connection i and a second electrical connection portion: The anisotropic conductive material of the present invention is schematically shown in Fig. 1 as a front cross-sectional view of an anisotropic conductive material-constructed body comprising the present invention comprising -=r and conductive particles.接 The splicing structure 1 shown in Fig. 1 is equipped with ·· The connection target member 2, the second connection target member 3, and the electrical connection first and second connection target members 2, 3 = state. The cured layer 4 is a splicing portion which is formed by anisotropic conductive adhesive of the anisotropic conductive material. A plurality of electrodes 2b are provided on the upper surface of the first connection target member 2. A plurality of electrodes are disposed below the second splicing target member 3. The second continuous member member 138858.doc • 29- 200951157 3 is formed on the upper surface of the first joint member 2 via the cured layer 4 formed of an anisotropic conductive paste having three electric particles. The electrode 2b and the electrode 3b are electrically connected by the conductive particles 5. As the connection structure, specifically, an electronic component such as a semiconductor chip, a capacitor, and a diode, and a connection structure of a circuit board such as a printed circuit board, a flexible printed circuit board, and a handle substrate are electrically connected. The manufacturing method of the splicing structure of the present invention is not limited to (4). As a manufacturing method of the splicing structure, the _r ^ : 袅w method' can be exemplified by a manufacturing method formed on an electronic component, a circuit board, or the like, a splicing electrode, and an electronic component. The anisotropic conductive material is placed between the second electrodes on the second connection member such as the circuit board to obtain a laminate, and then the laminate is heated and pressurized. The present invention will be specifically described below by way of examples and comparative examples. The invention is not limited to the following examples. The following materials were prepared as an epoxy to be converted into a curable epoxy composition [epoxy component A] (1) Epoxy compound [A-1]: epoxy having a structure represented by the above formula (1B) a compound (having an epoxy compound having a structure represented by the above formula (1), wherein R1 & R2 in the above formula (1) is a methylene group '113 and 114 is a hydrogen atom) (2) an anthracene compound [A- 2]: an epoxy compound having a structure represented by the above formula (1), wherein R1 & R2 in the above formula (1) is a positive-extension propyl group, and R4 is a hydrogen atom (3) epoxy compound [A- 3]: an epoxy compound having a structure represented by the above formula (1), wherein R1&R2 in the above formula (1) is a pentamethylene group, and R4 is a hydrogen atom 138858.doc -30- 200951157 (4) The epoxy compound [A_4 has a nucleus oxygen compound having a structure represented by the above formula (1), and R1 and R2 in the above formula (1) are methylene groups, and R3 is represented by the above formula (2). And R5 is a methylene group, R4 represents a structure represented by the above formula (3), and R6 in the above formula (3) is a methylene group (5) epoxy compound [A_5]: By the following formula (1 1) represented by the structure of the epoxy compound:

[化 16][Chemistry 16]

…式（101) 氣化合物[A·6]:具有由上述式⑴所表示之結構 ，環氧化合物’ ^上述式⑴中之R1及R2為伸己基，们及 R4為氫原子 再者’上述環氧化合物[Α_1]〜[Α·6]之單體與至少2個鍵 結而成之多聚體之混合比率(單體：多聚體)為8〇重量％: 20重量％。 [環氧成分Α以外之環氧成分Β] ⑴％氧化合物[BM]:雙酚a型環氧樹脂 氧化 口物阳2·1] : Adeka Resin EP_33〇〇S(ADEKA 公司製造） 、 (3) %氧化合物[B2_2]:間苯二酚二縮水甘油醚 138858.doc -31 - 200951157 (4) 環氧化合物[B3-1]:三縮水甘油基異氰尿酸酯（由上 述式（7A)所表示之環氧化合物） (5) 環氧化合物[B3-2]:三羥基乙基異氰尿酸酯三縮水 甘油醚（由上述式（8A)所表示之環氧化合物） 又，準備下述材料作為用以獲得硬化性環氧組合物之硬 化劑。 [硬化劑] ⑴味唾硬化劑（胺加合物型硬化劑（Ajin〇m〇t〇 FineFormula (101) Gas compound [A·6]: having a structure represented by the above formula (1), an epoxy compound '^ wherein R1 and R2 in the above formula (1) are a hexanyl group, and R4 is a hydrogen atom and then The mixing ratio (monomer: multimer) of the monomer of the epoxy compound [Α_1] to [Α·6] and the polymer of at least two bonds (monomer: multimer) was 8% by weight: 20% by weight. [Epoxy component other than epoxy component Β] (1)% oxygen compound [BM]: bisphenol a type epoxy resin oxidized cation cation 2·1] : Adeka Resin EP_33〇〇S (made by ADEKA), (3 % oxygen compound [B2_2]: resorcinol diglycidyl ether 138858.doc -31 - 200951157 (4) epoxy compound [B3-1]: triglycidyl isocyanurate (from the above formula (7A) (epoxy compound represented by the formula) (5) epoxy compound [B3-2]: trishydroxyethyl isocyanurate triglycidyl ether (epoxy compound represented by the above formula (8A)) The following materials are used as hardeners for obtaining a curable epoxy composition. [Harding Agent] (1) Flavor Scaling Agent (Amine Admixture Type Hardener (Ajin〇m〇t〇 Fine)

Techno公司製造之「pn_23J」）） Q (2) 1，2-二曱基η米唾 (3) 胺硬化劑（乙二胺） (4) 聚硫醇硬化劑（sc有機化學公司製造之「ΤΜΜρ:三 經甲基丙燒二-3 -疏基丙酸醋」） (實施例1) 將作為上述環氧成分之上述環氧化合物[八_1](具有由上 述式（1Β)所表示之結構之環氧化合物）1〇〇重量份、平均粒 徑為0.02 二氧化矽粒子7重量份、作為硬化劑之咪唑 ❹ 硬化劑（胺加合物型硬化劑（Ajin〇m〇t〇 Fine Techn〇公司製 每之「PN-23J」））40重量份、作為矽烷偶合劑之3_縮水甘 油氧基丙基三乙氧基矽烷4.5重量份、平均粒徑為3叫之 導電性粒子2重量份加以調配，獲得硬化性組合物。再 者，、所使用之上述導電性粒子係於二乙稀苯樹脂粒子表面 形成鑛鎳層，且於該鍍鎳層表面形成鍵金層之具有金屬層 之導電性粒子。 138858.doc -32· 200951157 使用行星式攪拌機，以2000 rpm對所得之硬化性組合物 授拌8分鐘’使用尼龍製濾紙（孔徑為1〇 ^㈣進行過濾，製 作作為各向異性導電材料之各向異性導電膠。 (比較例1)"pn_23J" manufactured by Techno)) (2) 1,2-didecyl η m saliva (3) Amine hardener (ethylenediamine) (4) Polythiol hardener (made by Sc Organic Chemical Co., Ltd.) ΤΜΜρ: trimethyl methacrylic acid 2-3 - thioglycolic acid vinegar" (Example 1) The above epoxy compound [8_1] (having the above formula (1 Β)) as the above epoxy component Epoxy compound of the structure) 1 part by weight, average particle diameter of 0.02 cerium oxide particles 7 parts by weight, imidazolium hardener as hardener (amine adduct type hardener (Ajin〇m〇t〇Fine) 40 parts by weight of each of "PN-23J") manufactured by Techn Co., Ltd., 4.5 parts by weight of 3_glycidoxypropyltriethoxydecane as a decane coupling agent, and an electroconductive particle having an average particle diameter of 3 The parts by weight are blended to obtain a curable composition. Further, the conductive particles to be used are formed of a mineralized nickel layer on the surface of the diethylbenzene resin particles, and a conductive layer having a metal layer of a bond gold layer formed on the surface of the nickel plating layer. 138858.doc -32· 200951157 The obtained curable composition was mixed for 8 minutes at 2000 rpm using a planetary mixer. Filtered using a nylon filter paper (having a pore size of 1 〇 ^ (4), each of which was made as an anisotropic conductive material. Anisotropic conductive paste. (Comparative Example 1)

使用行星式攪拌機，以2000 rpm對上述環氧化合物[B1-U(雙齡A型環氧樹脂）ι〇〇重量份、作為硬化劑之丨，2二甲 基米吐5重a；份撥拌5分鐘，從而獲得混合物。於所得之混 «物中’添加平均粒徑為〇 〇2 μηι之二氧化梦粒子7重量 份、平均粒徑為3 μηι之導電性粒子2重量份，從而獲得硬 化性組合物。再者’所使用之上述導電性粒子係於二乙稀 苯樹脂粒子表面形成鑛錄層，且於該鍍錄層表面形成鍵金 層之具有金屬層之導電性粒子。 使用订星式搜拌機，以2〇〇〇 rpm對所得之硬化性組合物 授拌8分鐘’使用尼龍製i紙（隸為1{)㈣進行過滤，從 而製作作為各向異性導電材料之各向異性導電膠。 (實施例2〜60及比較例2、3) D下述表1 6所不，變更環氧成分之種類及調配量（調配 單位為重量份）’除此以外以與實施例i相同之方式進行， 獲得各向異性導電膠。 (實施例61、62) 如下述表7所示，變 施例7相同之方式進行 (實施例63) 更硬化劑之種類，除此以外以與實 ’獲得各向異性導電膠。 型號為「MS- 使用分子蒸㈣置（柴田科學公司製造 138858.doc -33- 200951157 300型旋轉薄膜式」）’離析出上述環氧化合物[…]中所人 之早體。使用自環氧化合物中離析出之單體替代： 述環氧化合物[H]，除此以外以與實施例7相同之方 行，獲得各向異性導電膠。 J遵 (實施例64) 使用分子蒸館裝置（柴田科學公司製造’型號為「Ms_ 3〇〇型％轉薄膜式」），離析出上述環氧化合物[A-1]中所含 之單體。使用自環氧化合物⑷]中離析出單體後之多二 體替代上述環氧化合物[H]，除此以外以與實施例7相同 之方式進行，獲得各向異性導電膠。 再者β Μ例1〜64中所得之各向異性導電膠之氣離子濃 度分別為500 ppm以下。 (評價） (1) 峰值溫度及發熱量 使用示差掃描熱析儀（TA lnstruments公司製造，型號為 DSC 2920」）’以升溫速度為1〇<>c /分鐘之條件，對實施 例及比較Ϊ列中所得之各向異性_電膠之峰值溫度與發熱量 進行測定。再者，於以上述條件進行測定之情形時，將峰 值溫度為14〇t以下之各向異性導電膠視為合格。 (2) 玻璃轉移溫度 將各向異性導電膠填充於氟樹脂製之型内，以15〇。〇加 熱30分鐘，藉此獲得縱i 111111><橫2〇 mmx厚〇 3 之測定樣 tm。 使用動態黏彈性裝置DMA(TA Instruments公司製造，型 138858.doc •34- 200951157 號為「Q 800」）’測定所得之測定樣品2tanS成為最大值 之溫度，將成為該最大值之溫度作為玻璃轉移溫度。 (3) 吸水率 將各向異性導電膠填充於氟樹脂製之型内，以15〇t加 熱30分鐘，藉此獲得縱2 111111><橫2〇 111111><厚〇 4爪瓜之測定樣 品0 將所得之測定樣品於85t及相對濕度為85%之高溫高濕 下放置24小時。藉由下述式’由放置前之測定樣品之重量 與放置後之測疋樣品之重量求出吸水率： 吸水率(重量％)=(放置後之重量_放置前之重量)/(放置前之重量)χ1〇〇 (4) 硬化時間 準備於上面設置有ιτο電極（L/S=10 μιη)之玻璃基板（縱 5〇 mmx橫50 mmx厚lmm)。進而，準備於下面設置有金凸 塊（縱10 μιηχ高30 μηι)之半導體晶片（縱2爪似橫 4〇 mmx厚0.3 mm)。於上述玻璃基板上塗敷實施例及比較 © 例之各各向異性導電膠。繼而，於塗敷有各向異性導電膠 之玻璃基板上積層上述半導體晶片，從而獲得積層體。於 壓力為98 190 C之條件下，將所得之積層體熱壓接合 10秒鐘，從而獲得接續構造體。對所得之接續構造體之電 極間之接續電阻值進行測定。其結果可確認，於使用實施 例1〜64之各各向異性導電膠之情形時，接續構造體之電極 間導電接續。於使用有比較例i〜3之各各向異性導電膠之 情形時’電極間並未導電接續。 又，於壓力為98 N及180。(：之條件下，將上述積層體熱 138858.do. -35- 200951157 壓接合ι〇秒鐘，測定電極間之接續電阻值，藉此確認電極 間是否導電接續。於熱壓接合10秒鐘而電極間未導電接續 之情形時，準備新的積層體，於壓力為98 N&i8(rc之條 件下熱壓接合20秒鐘，測定電極間之接續電阻值，藉此確 認電極間是否導電接續。於熱壓接合2〇秒鐘而電極間未導 電接續之情形_，準備新的積層體，於壓力冑％⑽ 1 80°C之條件下熱壓接合3〇秒鐘，測 值’藉此確電極間是否導電接續。 化時間。 [硬化時間之評價基準] 定電極間之接續電阻 藉由以下基準評價硬 Θ ◎ 〇 △ 熱壓接合10秒鐘而電極間導電接續。 熱壓接合20秒鐘而電極間導電接續。 熱壓接合30秒鐘而電極間導電接續。 X :即便熱壓接合3G秒鐘，電極間亦未導電接續 將結果示於下述表中。Using a planetary mixer, the above epoxy compound [B1-U (two-year-old type A epoxy resin) oxime parts by weight at 2000 rpm, as a hardener, 2 dimethyl rice vomit 5 weight a; Mix for 5 minutes to obtain a mixture. To the obtained mixed material, 7 parts by weight of the oxidized dream particles having an average particle diameter of 〇 2 μηι and 2 parts by weight of the conductive particles having an average particle diameter of 3 μηι were added to obtain a hardening composition. Further, the above-mentioned conductive particles used are formed of a mineral layer on the surface of the diethylbenzene resin particles, and a conductive layer having a metal layer formed on the surface of the plating layer. The obtained curable composition was mixed for 8 minutes at 2 rpm using a star-stitching mixer, and filtered using nylon i paper (represented as 1{) (4) to prepare an anisotropic conductive material. Anisotropic conductive adhesive. (Examples 2 to 60 and Comparative Examples 2 and 3) D The following Table 16 shows that the type and amount of the epoxy component are changed (the mixing unit is a part by weight), except that in the same manner as in Example i. It is carried out to obtain an anisotropic conductive paste. (Examples 61 and 62) The anisotropic conductive paste was obtained in the same manner as in Example 7 except that the type of the curing agent was changed in the same manner as in the seventh embodiment. The model "MS- uses molecular vapor (four)" (manufactured by Shibata Scientific Co., Ltd. 138858.doc -33 - 200951157 300 type rotary film type)" to isolate the human body of the above epoxy compound [...]. An anisotropic conductive paste was obtained in the same manner as in Example 7 except that the monomer which was isolated from the epoxy compound was replaced with the epoxy compound [H]. J Compliance (Example 64) The monomer contained in the above epoxy compound [A-1] was isolated by using a molecular vapor evaporation apparatus (manufactured by Shibata Scientific Co., Ltd., model "Ms_3〇〇 type % transfer film type") . An anisotropic conductive paste was obtained in the same manner as in Example 7 except that the above-mentioned epoxy compound [H] was used in place of the above-mentioned epoxy compound [H] from the epoxy compound (4). Further, the gas ion concentrations of the anisotropic conductive paste obtained in ? Examples 1 to 64 were respectively 500 ppm or less. (Evaluation) (1) The peak temperature and the calorific value were measured using a differential scanning calorimeter (manufactured by TA Instruments, model DSC 2920) at a temperature increase rate of 1 〇 <>c /min. The peak temperature and calorific value of the anisotropic _electrogel obtained in the array are compared. Further, in the case of measurement under the above conditions, an anisotropic conductive paste having a peak temperature of 14 〇t or less was regarded as acceptable. (2) Glass transition temperature The anisotropic conductive paste was filled in a fluororesin type to 15 Å. The crucible was heated for 30 minutes, thereby obtaining a measurement sample tm of the vertical i 111111 < horizontal 2 mm x thick 〇 3 . Using the dynamic viscoelastic device DMA (manufactured by TA Instruments, type 138858.doc • 34-200951157 as "Q 800"), the measured sample 2tanS was measured to have a maximum temperature, and the temperature at which the maximum value was obtained was used as a glass transfer. temperature. (3) Water absorption rate The anisotropic conductive paste was filled in a fluororesin type and heated at 15 Torr for 30 minutes, thereby obtaining a longitudinal 2 111111 >< transverse 2 〇 111111 >< Measurement Sample 0 The obtained measurement sample was allowed to stand under high temperature and high humidity of 85 t and a relative humidity of 85% for 24 hours. The water absorption rate was determined by the following formula 'from the weight of the sample before standing and the weight of the sample after standing: Water absorption (% by weight) = (weight after placement _ weight before placement) / (before placement) Weight) χ1〇〇(4) The hardening time is prepared on a glass substrate (5/mm = 50 mm x thickness lmm) provided with an ιτο electrode (L/S = 10 μηη). Further, a semiconductor wafer (longitudinal 2 claw-like width 4 mm x 0.3 mm thick) provided with gold bumps (length 10 μm χ high 30 μηι) was prepared. The examples and the respective anisotropic conductive pastes of the examples are coated on the above glass substrate. Then, the semiconductor wafer was laminated on a glass substrate coated with an anisotropic conductive paste to obtain a laminate. The resulting laminate was thermocompression bonded for 10 seconds under the conditions of a pressure of 98 190 C to obtain a continuous structure. The splicing resistance between the electrodes of the resulting joined structure was measured. As a result, it was confirmed that in the case of using the anisotropic conductive pastes of Examples 1 to 64, the electrodes of the succeeding structures were electrically connected to each other. In the case where the anisotropic conductive pastes of Comparative Examples i to 3 were used, the electrodes were not electrically connected. Also, the pressure is 98 N and 180. Under the condition of (:, the laminated body heat 138858.do. -35- 200951157 was pressure-bonded for 〇 for 2 seconds, and the splicing resistance between the electrodes was measured to confirm whether the electrodes were electrically connected to each other. When the electrodes are not electrically connected to each other, a new laminated body is prepared, and the pressure is 98 N&i8 (rc under the condition of thermocompression bonding for 20 seconds, and the connection resistance between the electrodes is measured to confirm whether the electrodes are electrically conductive. Continuation. After thermocompression bonding for 2 sec seconds and the electrodes are not electrically connected to each other _, prepare a new laminate, and press-bond for 3 sec under pressure 胄%(10) 1 80 °C. It is confirmed whether or not the electrodes are electrically connected to each other. The time of the evaluation. [Evaluation criteria of the hardening time] The connection resistance between the fixed electrodes was evaluated by the following criteria: 〇 〇 Δ The thermocompression bonding was carried out for 10 seconds and the electrodes were electrically connected to each other. In the second, the electrodes were electrically connected to each other. The thermocompression bonding was carried out for 30 seconds and the electrodes were electrically connected to each other. X: Even if the thermocompression bonding was performed for 3 G seconds, the electrodes were not electrically connected to each other, and the results are shown in the following table.

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迗當-1努I 138858.doc -41 - 200951157 095爸駟 06 01 ·寸 Νι·ε S3 寸8£ 寸一一 ο00 - οι Ν 0Τ 161 m 911 τ ·'寸 09 - οι Ν 8·「 SI "§6叫 Z.U τ '_ ο寸 - οι Ν 9·ζ 61-1 S寸 611 「 •'f 0Ζ - 〇一 ·寸 〇 寸τg1-1 一一寸一-1 06 〇一 ο 1卜1 09 τ ·'寸 迗"-",Γιιοϊ^^1 99s ^1¾ i-r-^1 I#-1^^^ 【•ea 蓉 φ-^ίϊ 19 潜蜣^ψ^®''11 _tl'-a蓉φ1-1^'^ ^淚和^1缓 Μ 衾 μ^ει 【'za客伞-赫蛘sooe£3 ul-'ϋρν 【•δ】#φ-^ϊί 【•la 客伞-^ti 屮噼顽：2^'s -硝101拿：se5J 【V】荽<0-鯀蛘 -^M9SS ~雄雄w^'i^1碳 SWIMd^: 锥龙 w^嫦 s¥ : 2 硪 i亞：ΖΉ^Ξ t'v】蓉Φ-UIE 屮噼碱：t^t^s -硪 vt:s^5 【VI 者♦qrws-i 屮噼碱：s^'s* -fy拿：s¥2 t'v】蓉命-成餘 ^2 " 2^2 - 2^51 【'V】審>Ί5ϊί 138858.doc -42- 200951157 [表7] 實施例61 實施例62 實施例63 實施例64 調 配 成 分 1 量 環氧化合物[A-1] R1及R2 :亞曱基，R3及R4 :氫原子 60 60 自環氧化合物[A-1] 離析出之單體 60 自環氧化合物[Α·1] 離析出單體後之多聚體 60 環氧化合物[Β2-2] 間苯二酚二縮水甘油醚 35 35 35 35 環氧化合物[Β3-1] 三縮水甘油基異氣尿酸酯 5 5 5 5 咪唑硬化劑 10 10 胺硬化劑 40 聚硫酵硬化劑 40 二氧化矽粒子 7 7 7 7 矽烷偶合劑 4.5 4.5 4.5 4.5 導電性粒子 2 2 2 2 評 價 峰值溫度(°c) 85 105 105 120 發熱量(mJ/mg) 568 425 600 510 玻璃轉移溫度(°c) 136 136 170 140 吸水率(重量％) 2.8 2.8 2.8 2.1 硬化時間 ◎ ◎ ◎ 〇 ❿ 實施例1〜64之各向異性導電膠與比較例1之各向異性導 電膠相比，其峰值溫度較低，且發熱量較高。又，與比較 例1之各向異性導電膠相比，實施例1〜64之各向異性導電 膠可迅速硬化。又，比較例2、3之各向異性導電膠之峰值 溫度較高，發熱量較低，因此難以迅速硬化。. 【圖式簡單說明】 圖1係示意性地表示使用有含有本發明之一實施形態之 硬化性環氧組合物與導電性粒子之各向異性導電材料之接 續構造體之正面剖面圖。 【主要元件符號說明】 1 接續構造體 2 第1接續對象構件 2a 上面 -43- 138858.doc 200951157 2b 3 3a 3b 4 5 電極 第2接續對象構件 下面 電極 硬化物層 導電性粒子 138858.doc -44-迗当-1努I 138858.doc -41 - 200951157 095Daddy 06 01 ·inch Νι·ε S3 inch 8£ inch one ο00 - οι Ν 0Τ 161 m 911 τ ·' inch 09 - οι Ν 8·" SI "§6 is called ZU τ '_ ο inch- οι Ν 9·ζ 61-1 S inch 611 " • 'f 0Ζ - 〇一·inch 〇 inch τg1-1 one inch one -1 06 〇一ο 1 Bu 1 09 τ ·'inch迗"-",Γιιοϊ^^1 99s ^13⁄4 ir-^1 I#-1^^^ [•ea 蓉-φίϊ 19 潜蜣^ψ^®''11 _tl '-a蓉φ1-1^'^^ Tears and ^1 Μ Μμ^ει ['za guest umbrella-Herze sooe £3 ul-'ϋρν [•δ]#φ-^ϊί [•la guest umbrella -^ti 屮噼顽:2^'s -Nitrate 101: se5J [V]荽<0-鲧蛘-^M9SS ~雄雄w^'i^1 carbon SWIMd^: cone dragon w^嫦s¥ : 2 硪i 亚:ΖΉ^Ξ t'v】蓉Φ-UIE 屮噼 base: t^t^s -硪vt:s^5 [VI ♦qrws-i 屮噼 base: s^'s* - Fy take: s¥2 t'v] 蓉命-成余^2 " 2^2 - 2^51 ['V】审>Ί5ϊί 138858.doc -42- 200951157 [Table 7] Example 61 Example 62 Example 63 Example 64 Formulation of component 1 Amount of epoxy compound [A-1] R1 and R2: anthracenylene, R3 and R4: hydrogen atom 60 60 from epoxy Compound [A-1] Isolated monomer 60 Multipolymer 60 after separation of monomer from epoxy compound [Α·1] Epoxy compound [Β2-2] Resorcinol diglycidyl ether 35 35 35 35 Epoxy compound [Β3-1] Triglycidyl isogas urate 5 5 5 5 Imidazole hardener 10 10 Amine hardener 40 Polysulfide hardener 40 Ceria particles 7 7 7 7 Decane coupling agent 4.5 4.5 4.5 4.5 Conductive particles 2 2 2 2 Evaluation peak temperature (°c) 85 105 105 120 Calorific value (mJ/mg) 568 425 600 510 Glass transfer temperature (°c) 136 136 170 140 Water absorption (% by weight) 2.8 2.8 2.8 2.1 Hardening time ◎ ◎ ◎ 各向异性 The anisotropic conductive paste of Examples 1 to 64 has a lower peak temperature and a higher calorific value than the anisotropic conductive paste of Comparative Example 1. Further, the anisotropic conductive pastes of Examples 1 to 64 were rapidly hardened as compared with the anisotropic conductive paste of Comparative Example 1. Further, the anisotropic conductive pastes of Comparative Examples 2 and 3 have a high peak temperature and a low calorific value, so that it is difficult to harden rapidly. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front cross-sectional view schematically showing a continuous structure using an anisotropic conductive material containing a curable epoxy composition according to an embodiment of the present invention and conductive particles. [Description of main component symbols] 1 splicing structure 2 1st splicing object 2a upper -43- 138858.doc 200951157 2b 3 3a 3b 4 5 electrode 2nd splicing object lower electrode hardened layer conductive particle 138858.doc -44 -

Claims (1)

200951157 七、申請專利範圍： 1 ·種硬化性環氧組合物，其係令古m ^ , . J3S ^ ' 有環氧成分與硬化劑 者，上述環氧成分包含具有由下 ΜΆ 4b 边式（1)所表示之結構之 %乳化合物之單體、至少2個 多肀栌、十β 艰氧化合物鍵結而成之 聚體Ί亥單體與該多聚體之混合物. [化 1] '200951157 VII, the scope of application for patents: 1 · a kind of hardening epoxy composition, which is ordered by Gu m ^ , . J3S ^ 'The epoxy component and the hardener, the above epoxy component contains the edge of the lower jaw 4b ( 1) A mixture of a monomer of a milk compound represented by a structure of at least two polyterpenes, a ten-beta oxy-compound compound, and a polymer of the polymer. [Chemical Formula 1] ...式（1) 於上述式⑴中，m表示碳數為卜5之伸烧基， 碳數為1〜5之伸烷基，R3表示氫原子 不 或由下述式⑺所表示之結構 ’-、〜之烷基 再R4表不氫原子、碳數為 1〜5之烷基或由下述式（3)所表示之結構： ·，、、 [化2] ❿In the above formula (1), m represents a stretching group having a carbon number of 5, a alkyl group having a carbon number of 1 to 5, and R3 represents a hydrogen atom which is not represented by the following formula (7). The alkyl group of the structure '-, and further R4 represents a hydrogen atom, an alkyl group having a carbon number of 1 to 5, or a structure represented by the following formula (3): ·,,, [Chemical 2] ❿ 式（2) 於上述式（2)中，R5表示碳數為卜5之伸烷基； [化3] ①土 ’In the above formula (2), R5 represents an alkylene group having a carbon number of 5; [Chemical 3] 1 soil ’ …式（3) 138858.doc 200951157 於上述式（3)中，R6表示碳數為之伸烷基。 2. 如請求項丨之硬化性環氧組合物，其中於上述式（1)中， R3及R4為氫原子。 3. 如請求項W2之硬化性環氧組合物，其中於1〇〇重量弘 上述環氧成分中，具有由上述式⑴所表示之結構之環氧 化合物之單體、至少2個該環氧化合物鍵結而成之多聚 體或該單體與該多聚體之混合物之含量處於5〜_ 之範圍内。 4. 如請求⑹之硬化性環氧組合物，其中上述環 而包含具有含氮原子之雜環的環氧化合物0 刀 5. 如請求項4之硬化性環氧組合物其中上 子之雜環的環氧化合物係由下 有含氮原 物或由下述式⑻所表示之環氧化合物所“之環氧化合 [化4]Formula (3) 138858.doc 200951157 In the above formula (3), R6 represents an alkyl group having a carbon number. 2. The curable epoxy composition according to claim 1, wherein in the above formula (1), R3 and R4 are a hydrogen atom. 3. The curable epoxy composition according to claim W2, wherein at least two of the epoxy compounds having the structure represented by the above formula (1) are contained in the above epoxy component. The polymer-bonded multimer or the mixture of the monomer and the multimer is in the range of 5 to _. 4. The hardenable epoxy composition according to (6), wherein the above ring comprises an epoxy compound having a nitrogen atom-containing heterocyclic ring. 5. The hardenable epoxy composition of claim 4 wherein the upper ring is a heterocyclic ring. The epoxy compound is epoxidized by the epoxy compound having the nitrogen-containing original or represented by the following formula (8). 刀別表示碳數 基，X表示環氧基或羥基曱基； ‘·、、〜5之伸特 [化5] 138858.doc 200951157Knife represents a carbon number group, X represents an epoxy group or a hydroxy group; ′·, 〜5的伸特 [化5] 138858.doc 200951157 6. 8.6. 8. 9.9. R17R17 R18L Jq …式（8) 於上述式W中，R14〜R16分別表示碳數為卜5之伸烧 基；P、qh分㈣示卜5之整數；Rn〜⑽分別表示碳 數為1〜5之伸燒基。 如請求項5之硬化性環氧組合物，其中上述具有含氮原 子之雜環的環氧化合物為三縮水甘油基異氰尿酸醋或三 羥基乙基異氰尿酸酯三縮水甘油醚。 如請求項4至6中任-項之硬化性環氧組合物， ⑽重量％之上述環氧成分中，上述具有含氮原子之雜環 的環氧化合物之含量處於重量％之範圍内。 如請求項1或4之硬化性環氧組合物，其中上述環氧成分 進而包含具有芳香族環之環氧化合物。 如請求項8之硬化性環氧組合物，Μ上述芳香族環為 苯環、萘環或蒽環。 10·:種各向異性導電材料，其含有如請求項i之硬化性環 氧組合物與導電性粒子。U· -種接續構造體’其係包括硬化物層、藉由該硬化物層 接續而成之接續對象構件者’上述硬化物層係藉由使含 月求項1之硬化性環氧組合物與導電性粒子的各向 138858.doc 200951157 異性導電材料硬化而形成。 12. —種接續構造體，其係包括硬化物層、藉由該硬化物層 接續而成之接續對象構件者，上述硬化物層係藉由使如 請求項1之硬化性環氧組合物硬化而形成。 138858.docR18L Jq Formula (8) In the above formula W, R14 to R16 respectively represent an alkyl group having a carbon number of 5; P, qh are (4) an integer of 5; and Rn to (10) respectively represent a carbon number of 1 to 5. Extend the base. The hardenable epoxy composition according to claim 5, wherein the epoxy compound having a hetero ring containing a nitrogen atom is triglycidyl isocyanurate or trishydroxyethyl isocyanurate triglycidyl ether. The hardening epoxy composition according to any one of claims 4 to 6, wherein the content of the epoxy compound having a nitrogen atom-containing heterocyclic ring in the above epoxy component is (%) by weight. The hardenable epoxy composition of claim 1 or 4, wherein the epoxy component further comprises an epoxy compound having an aromatic ring. The hardenable epoxy composition of claim 8, wherein the aromatic ring is a benzene ring, a naphthalene ring or an anthracene ring. 10. An anisotropic conductive material comprising the curable epoxy composition according to claim i and conductive particles. The U-type splicing structure includes a cured layer and a spliced member formed by the slab layer. The hardened layer is formed by using the curable epoxy composition containing the first item 1. It is formed by hardening the opposite conductive conductive material with the conductive particles 138858.doc 200951157. 12. A splicing structure comprising a cured layer and a spliced member formed by the slab, wherein the cured layer is cured by curing the curable epoxy composition as claimed in claim 1. And formed. 138858.doc
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