JP4455114B2 - ビルドアップ基板層間絶縁材料用の熱硬化性樹脂組成物、樹脂フィルム、製品およびビルドアップ基板の層間絶縁材料 - Google Patents
ビルドアップ基板層間絶縁材料用の熱硬化性樹脂組成物、樹脂フィルム、製品およびビルドアップ基板の層間絶縁材料 Download PDFInfo
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- JP4455114B2 JP4455114B2 JP2004090075A JP2004090075A JP4455114B2 JP 4455114 B2 JP4455114 B2 JP 4455114B2 JP 2004090075 A JP2004090075 A JP 2004090075A JP 2004090075 A JP2004090075 A JP 2004090075A JP 4455114 B2 JP4455114 B2 JP 4455114B2
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- Compositions Of Macromolecular Compounds (AREA)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004090075A JP4455114B2 (ja) | 2004-03-25 | 2004-03-25 | ビルドアップ基板層間絶縁材料用の熱硬化性樹脂組成物、樹脂フィルム、製品およびビルドアップ基板の層間絶縁材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004090075A JP4455114B2 (ja) | 2004-03-25 | 2004-03-25 | ビルドアップ基板層間絶縁材料用の熱硬化性樹脂組成物、樹脂フィルム、製品およびビルドアップ基板の層間絶縁材料 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005272722A JP2005272722A (ja) | 2005-10-06 |
| JP2005272722A5 JP2005272722A5 (enExample) | 2006-11-02 |
| JP4455114B2 true JP4455114B2 (ja) | 2010-04-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004090075A Expired - Fee Related JP4455114B2 (ja) | 2004-03-25 | 2004-03-25 | ビルドアップ基板層間絶縁材料用の熱硬化性樹脂組成物、樹脂フィルム、製品およびビルドアップ基板の層間絶縁材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4455114B2 (enExample) |
Cited By (2)
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| US20180186730A1 (en) * | 2015-07-23 | 2018-07-05 | Huntsman Advanced Materials Americas Llc | Curable benzoxazine compositions |
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-
2004
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101786085B1 (ko) | 2011-04-05 | 2017-10-17 | 도레이첨단소재 주식회사 | 반도체 장치용 접착제 조성물 및 이를 이용한 접착 필름 |
| US20180186730A1 (en) * | 2015-07-23 | 2018-07-05 | Huntsman Advanced Materials Americas Llc | Curable benzoxazine compositions |
| US10851049B2 (en) * | 2015-07-23 | 2020-12-01 | Huntsman Advanced Materials Americas Llc | Curable benzoxazine compositions |
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| JP2005272722A (ja) | 2005-10-06 |
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