JP4454399B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

Info

Publication number
JP4454399B2
JP4454399B2 JP2004173745A JP2004173745A JP4454399B2 JP 4454399 B2 JP4454399 B2 JP 4454399B2 JP 2004173745 A JP2004173745 A JP 2004173745A JP 2004173745 A JP2004173745 A JP 2004173745A JP 4454399 B2 JP4454399 B2 JP 4454399B2
Authority
JP
Japan
Prior art keywords
resin
lead frame
runner
mold
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004173745A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005353878A (ja
JP2005353878A5 (https=
Inventor
文司 倉冨
洋一 河田
福美 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2004173745A priority Critical patent/JP4454399B2/ja
Publication of JP2005353878A publication Critical patent/JP2005353878A/ja
Publication of JP2005353878A5 publication Critical patent/JP2005353878A5/ja
Application granted granted Critical
Publication of JP4454399B2 publication Critical patent/JP4454399B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2004173745A 2004-06-11 2004-06-11 半導体装置の製造方法 Expired - Fee Related JP4454399B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004173745A JP4454399B2 (ja) 2004-06-11 2004-06-11 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004173745A JP4454399B2 (ja) 2004-06-11 2004-06-11 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005353878A JP2005353878A (ja) 2005-12-22
JP2005353878A5 JP2005353878A5 (https=) 2007-07-26
JP4454399B2 true JP4454399B2 (ja) 2010-04-21

Family

ID=35588077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004173745A Expired - Fee Related JP4454399B2 (ja) 2004-06-11 2004-06-11 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4454399B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240006064A (ko) 2021-06-25 2024-01-12 토와 가부시기가이샤 수지 성형 장치, 및 수지 성형품의 제조 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5054923B2 (ja) * 2006-01-23 2012-10-24 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240006064A (ko) 2021-06-25 2024-01-12 토와 가부시기가이샤 수지 성형 장치, 및 수지 성형품의 제조 방법

Also Published As

Publication number Publication date
JP2005353878A (ja) 2005-12-22

Similar Documents

Publication Publication Date Title
US8497158B2 (en) Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
US9806035B2 (en) Semiconductor device
US20060125064A1 (en) Semiconductor device and a method of manufacturing the same
US20080020510A1 (en) Fabrication method of semiconductor device
JPH06291234A (ja) 半導体装置用リードフレームおよびこれを使用した半導体装置の製造方法
JPH08125097A (ja) リードフレーム
US20040203194A1 (en) Method of resin-sealing a semiconductor device, resin-sealed semiconductor device, and forming die for resin-sealing the semiconductor device
JP4454399B2 (ja) 半導体装置の製造方法
JP4202632B2 (ja) 一括封止型半導体パッケージの樹脂封止構造およびその製造装置
JP2007036273A (ja) 半導体集積回路装置の製造方法
JP2004319900A (ja) 樹脂封止用型及び樹脂封止用型の仕様決定方法
US7701073B2 (en) Locking feature and method for manufacturing transfer molded IC packages
JP2761193B2 (ja) 外部リードを固定したリードフレーム及びこれを利用した半導体装置並びにその製造方法
JP5233288B2 (ja) 半導体装置の製造方法及び基板
JPH04293243A (ja) 樹脂封止用金型装置とゲートの切断方法
JPS60138949A (ja) 半導体装置用リ−ドフレ−ム
KR100531423B1 (ko) 반도체 패키지 제조용 리드프레임 및 이에 적용되는 몰드다이, 그리고 이를 이용한 패키지 제조장치.
JP3566812B2 (ja) 半導体装置の製造方法
JPH0878455A (ja) 樹脂封止型半導体装置の製造装置及び製造方法
JP2962405B2 (ja) 半導体装置の製造方法
JPH09223706A (ja) 半導体製造方法およびその製造装置
JP3070795B2 (ja) 半導体装置用箱形樹脂成形体の成形方法およびそれによって成形された箱形樹脂成形体
JP3539659B2 (ja) 半導体装置の製造方法およびその方法において用いられるリードフレーム
KR20070035725A (ko) 2단 게이트 구조를 갖는 몰딩용 다이
JPS63137440A (ja) 半導体装置およびその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070608

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070608

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070927

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090908

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091102

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100105

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100202

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130212

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4454399

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130212

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140212

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees