JP2005353878A5 - - Google Patents

Download PDF

Info

Publication number
JP2005353878A5
JP2005353878A5 JP2004173745A JP2004173745A JP2005353878A5 JP 2005353878 A5 JP2005353878 A5 JP 2005353878A5 JP 2004173745 A JP2004173745 A JP 2004173745A JP 2004173745 A JP2004173745 A JP 2004173745A JP 2005353878 A5 JP2005353878 A5 JP 2005353878A5
Authority
JP
Japan
Prior art keywords
mold
runner
resin
lead frame
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004173745A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005353878A (ja
JP4454399B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004173745A priority Critical patent/JP4454399B2/ja
Priority claimed from JP2004173745A external-priority patent/JP4454399B2/ja
Publication of JP2005353878A publication Critical patent/JP2005353878A/ja
Publication of JP2005353878A5 publication Critical patent/JP2005353878A5/ja
Application granted granted Critical
Publication of JP4454399B2 publication Critical patent/JP4454399B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004173745A 2004-06-11 2004-06-11 半導体装置の製造方法 Expired - Fee Related JP4454399B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004173745A JP4454399B2 (ja) 2004-06-11 2004-06-11 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004173745A JP4454399B2 (ja) 2004-06-11 2004-06-11 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005353878A JP2005353878A (ja) 2005-12-22
JP2005353878A5 true JP2005353878A5 (https=) 2007-07-26
JP4454399B2 JP4454399B2 (ja) 2010-04-21

Family

ID=35588077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004173745A Expired - Fee Related JP4454399B2 (ja) 2004-06-11 2004-06-11 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4454399B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5054923B2 (ja) * 2006-01-23 2012-10-24 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法
JP7121835B1 (ja) 2021-06-25 2022-08-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Similar Documents

Publication Publication Date Title
JP2008514364A5 (https=)
KR101598129B1 (ko) 런너 표준취출식 3단 사출금형
JP2009269380A (ja) 枠体付きガラスの射出成形用金型
JP2005353878A5 (https=)
JP2009269381A (ja) 枠体付きガラスの射出成形用金型および枠体付きガラスの製造方法
CN101533732A (zh) 将键盘底板与键盘底座直接结合的方法
JP5054923B2 (ja) 電子部品の樹脂封止成形方法
JP6288120B2 (ja) 樹脂封止金型および電子部品の樹脂成形部を製造する方法
JP2007208158A5 (https=)
KR101173064B1 (ko) 사출 성형용 금형 장치
CN205439098U (zh) 汽车窗框护板注塑模具浇口料防拉断机构
CN209126092U (zh) 一种橡胶传动轴模具
KR20110050803A (ko) 사출금형장치 및 방법
JPS62173726A (ja) 半導体装置用樹脂成形方法
CN112549427B (zh) 半导体制造装置及半导体装置的制造方法
KR200413709Y1 (ko) 사출금형의 2단 작동 밀판
CN219600274U (zh) 一种高流动性黑胶注塑元器件成型的框架结构
JP2007050553A (ja) 射出成形金型におけるゲート方式
CN103448212A (zh) 转子精密注塑模具
CN205767261U (zh) 一种可排气的改良型注塑模具
JP5313013B2 (ja) トンネルゲート式成形金型
KR200421277Y1 (ko) 방수클립 제조장치
JP2009158978A5 (https=)
CN211515976U (zh) 变速器外壳的多腔式砂型成型模具
JP2007268819A (ja) インサート成型品および製造方法