JP2005353878A5 - - Google Patents
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- JP2005353878A5 JP2005353878A5 JP2004173745A JP2004173745A JP2005353878A5 JP 2005353878 A5 JP2005353878 A5 JP 2005353878A5 JP 2004173745 A JP2004173745 A JP 2004173745A JP 2004173745 A JP2004173745 A JP 2004173745A JP 2005353878 A5 JP2005353878 A5 JP 2005353878A5
- Authority
- JP
- Japan
- Prior art keywords
- mold
- runner
- resin
- lead frame
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (2)
上下で一対となる金型であり、前記単位フレーム毎の樹脂封止領域となるキャビティ部の型と、各キャビティ部の型に対応して設けられた複数のゲート部の型と、前記複数のゲート部に接続されるランナ部の型と、前記ランナ部の型より上下金型の空間の高さが薄く、前記ランナ部の型に接続されるサブランナ部の型とを有する、前記一対の金型を準備する工程と、A pair of upper and lower molds, a cavity part mold serving as a resin sealing region for each unit frame, a plurality of gate part molds provided corresponding to each cavity part mold, The pair of molds, comprising: a runner part mold connected to the gate part; and a sub-runner part mold connected to the runner part mold, wherein a space of the upper and lower molds is thinner than the runner part mold. Preparing the mold,
前記リードフレームに対して前記金型を設置し、前記サブランナ部の型と前記ランナ部の型と前記ゲート部の型を介して前記キャビティ部の型に樹脂を流入する工程とを有することを特徴とする半導体装置の製造方法。And a step of installing the mold with respect to the lead frame, and injecting resin into the cavity part mold through the sub-runner part mold, the runner part mold, and the gate part mold. A method for manufacturing a semiconductor device.
前記キャビティ部を樹脂で封止する際の治具であり、前記キャビティ部と前記ゲート部と前記ランナ部にそれぞれ対応する樹脂の流入経路の型と、樹脂の供給源となるカル部の型と、前記カル部と前記ランナ部の間の樹脂の流入経路に対応し、前記ランナ部との接続部分に縊れ形状を備えたサブランナ部の型とを有する金型を準備する工程と、
前記リードフレームに対して前記金型を設置し、前記カル部の型から前記キャビティ部の型に向けて樹脂を流入する工程と、
前記リードフレームから前記金型を取り外した際に、前記リードフレームの前記ランナ部の残存樹脂に連結されている前記サブランナ部および前記カル部の残存樹脂を、前記サブランナ部の残存樹脂に形成された前記縊れ形状の位置で除去する工程と、
前記ランナ部の残存樹脂を含むリードフレームを、切断装置に搬送する工程と、
前記切断装置を用いて、前記ランナ部の残存樹脂と前記ゲート部の残存樹脂を除去する工程とを有することを特徴とする半導体装置の製造方法。 A cavity portion that is a region including a tab and an inner lead, a gate portion that is a region that is connected to the cavity portion, and a runner that is a region that is connected to the gate portion and can be broken by a predetermined external force Preparing a lead frame having a portion;
A jig for sealing the cavity part with resin, a mold of a resin inflow path corresponding to the cavity part, the gate part, and the runner part, and a mold of a cull part serving as a resin supply source, A step of preparing a mold having a mold of a sub-runner portion corresponding to a resin inflow path between the cull portion and the runner portion and having a twisted shape at a connection portion with the runner portion;
Installing the mold on the lead frame, and flowing the resin from the cull part mold toward the cavity part mold;
When the mold is removed from the lead frame, the residual resin of the sub-runner portion and the cull portion connected to the residual resin of the runner portion of the lead frame is formed in the residual resin of the sub-runner portion. Removing at the position of the drooping shape;
Conveying the lead frame containing the residual resin of the runner part to a cutting device;
A method for manufacturing a semiconductor device, comprising: using the cutting device to remove residual resin in the runner portion and residual resin in the gate portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004173745A JP4454399B2 (en) | 2004-06-11 | 2004-06-11 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004173745A JP4454399B2 (en) | 2004-06-11 | 2004-06-11 | Manufacturing method of semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005353878A JP2005353878A (en) | 2005-12-22 |
| JP2005353878A5 true JP2005353878A5 (en) | 2007-07-26 |
| JP4454399B2 JP4454399B2 (en) | 2010-04-21 |
Family
ID=35588077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004173745A Expired - Fee Related JP4454399B2 (en) | 2004-06-11 | 2004-06-11 | Manufacturing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4454399B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5054923B2 (en) * | 2006-01-23 | 2012-10-24 | Ｔｏｗａ株式会社 | Resin sealing molding method for electronic parts |
| JP7121835B1 (en) | 2021-06-25 | 2022-08-18 | Ｔｏｗａ株式会社 | RESIN MOLDING APPARATUS AND METHOD OF MANUFACTURING RESIN MOLDED PRODUCT |
-
2004
- 2004-06-11 JP JP2004173745A patent/JP4454399B2/en not_active Expired - Fee Related
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