JP4452199B2 - 固体撮像装置およびその駆動方法 - Google Patents
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- 238000003384 imaging method Methods 0.000 title claims description 46
- 238000000034 method Methods 0.000 title description 21
- 238000006243 chemical reaction Methods 0.000 claims description 41
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000009825 accumulation Methods 0.000 description 19
- 230000007547 defect Effects 0.000 description 16
- 230000003321 amplification Effects 0.000 description 8
- 239000003574 free electron Substances 0.000 description 8
- 238000003199 nucleic acid amplification method Methods 0.000 description 8
- 238000002955 isolation Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 206010047571 Visual impairment Diseases 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
- H04N25/626—Reduction of noise due to residual charges remaining after image readout, e.g. to remove ghost images or afterimages
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/65—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to reset noise, e.g. KTC noise related to CMOS structures by techniques other than CDS
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Transforming Light Signals Into Electric Signals (AREA)
Description
固体撮像装置およびその駆動方法を提供することを目的とする。
図1(a)は、本発明の第1実施形態に係るMOS型固体撮像装置(増幅型イメージセンサ)の単位画素部の平面図である。また、図1(b)は、図1(a)のA−A’線断面図である。この単位画素部は、半導体基板10のウェル5に形成された光電変換部2、正孔蓄積層3およびドレイン領域4と、ウェル5上に絶縁膜9を挟んで形成されたゲート電極とを備えている。ウェル5と正孔蓄積層3の導電型はP型であり、光電変換部2とドレイン領域4の導電型はN型である。光電変換部2とウェル5とのPN接合によってフォトダイオードが構成されている。光電変換部2とドレイン領域4とを含む領域の周囲には、素子分離領域11が形成されている。正孔蓄積層3は、暗出力を抑制する目的で設けられた領域である。
に応じた電圧信号が現れる。次に、水平走査回路17が垂直信号線を順次選択すると、選択された垂直信号線上の電圧信号は、ノイズ除去回路116でノイズを除去された後に、増幅回路18で増幅若しくはインピーダンス変換されて、出力端子19から外部に出力される。この繰り返しによって、一画像データが取得される。
図6は、本発明の第2の実施形態に係る固体撮像装置の駆動方法を説明する図であって、垂直ブランキングタイミング、ゲート電圧およびウェル電圧のタイミングチャートである。なお、この駆動方法を行う装置は、第1の実施形態で説明したものと同じであるため、その説明を省略する。
図7は、本発明の第3の実施形態に係る固体撮像装置の回路図である。また、図8は、垂直走査回路15と受光領域30とを通る線における概略断面図である。本実施形態に係る固体撮像装置では、周辺回路領域40のウェルである周辺回路ウェル45と、受光領域30のウェルである受光部ウェル35とが、電気的に分離された別のウェルになっている。
2 光電変換部
3 正孔蓄積層
4 ドレイン領域
5 ウェル
6 ゲート電極
7 増幅トランジスタ
8 リセットトランジスタ
9 絶縁膜
10 半導体基板
11 素子分離領域
12 基準電圧配線
13 バックゲート領域
14 単位画素部
15 垂直走査回路
16 ノイズ除去回路
17 水平走査回路
18 増幅回路
19 出力端子
20a チップ
20b チップ
24 基準電圧供給端子
30 受光領域
32 受光部基準電圧配線
34 基準電圧供給端子
35 受光部ウェル
40 周辺回路領域
42 周辺回路基準電圧配線
44 基準電圧供給端子
45 周辺回路ウェル
101 トランジスタ
102 光電変換部
103 正孔蓄積層
104 ドレイン領域
105 ウェル
106 ゲート電極
107 増幅トランジスタ
108 リセットトランジスタ
109 絶縁膜
110 半導体基板
111 分離領域
112 基準電圧配線
113 バックゲート領域
Claims (2)
- 半導体基板に設けた第1ウェルおよび第2ウェルがあり、前記第1ウェルに少なくとも入射光を光電変換して得た信号電荷を蓄積する光電変換部と前記信号電荷が転送されるドレイン領域と前記第1ウェルの上に前記信号電荷を前記光電変換部から前記ドレイン領域に転送するゲート電極とを備えた単位画素をマトリクス状に配置した受光部を設け、前記第2ウェルあるいはその上に少なくとも垂直走査回路、水平走査回路あるいは増幅回路を備えた周辺回路を設け、
前記第1ウェルと前記第2ウェルはともにP型のウェルであり、
前記第1ウェルと前記第2ウェルは電気的に分離された別のウェルであり、
前記第1ウェルには受光部基準電圧配線が接続し、前記第2ウェルには周辺回路基準電圧配線が接続し、
前記受光部基準電圧配線は、0V以上の第1の電圧を信号読み出し期間に供給し、0Vよりも大きく前記第1の電圧よりも高い電圧である第2の電圧を露光期間に供給することによって、前記第1の電圧と前記第2の電圧とを切り替えて供給し、
前記周辺回路基準電圧配線は、前記第1の電圧のみを供給することを特徴とする固体撮像装置。 - 前記第2の電圧は、
前記半導体基板に供給する電源電圧、前記電源電圧を基に生成した電圧、及び前記電源電圧とは別電圧のうちの、いずれか一つであることを特徴とする請求項1に記載の固体撮像装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005051513A JP4452199B2 (ja) | 2005-02-25 | 2005-02-25 | 固体撮像装置およびその駆動方法 |
PCT/JP2005/013363 WO2006090492A1 (ja) | 2005-02-25 | 2005-07-21 | 固体撮像装置およびその駆動方法 |
KR1020077019643A KR20070106622A (ko) | 2005-02-25 | 2005-07-21 | 고체 촬상 장치 및 그 구동방법 |
EP05766443A EP1852914A4 (en) | 2005-02-25 | 2005-07-21 | SEMICONDUCTOR IMAGING DEVICE AND METHOD FOR CONTROLLING THE SAME |
US11/883,556 US7859032B2 (en) | 2005-02-25 | 2005-07-21 | Solid-state imaging device and method for driving the same |
CNA2005800486790A CN101128934A (zh) | 2005-02-25 | 2005-07-21 | 固体摄像器件及其驱动方法 |
TW094125533A TW200631429A (en) | 2005-02-25 | 2005-07-28 | Solid imaging device and driving method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005051513A JP4452199B2 (ja) | 2005-02-25 | 2005-02-25 | 固体撮像装置およびその駆動方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006237381A JP2006237381A (ja) | 2006-09-07 |
JP4452199B2 true JP4452199B2 (ja) | 2010-04-21 |
Family
ID=36927142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005051513A Expired - Fee Related JP4452199B2 (ja) | 2005-02-25 | 2005-02-25 | 固体撮像装置およびその駆動方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7859032B2 (ja) |
EP (1) | EP1852914A4 (ja) |
JP (1) | JP4452199B2 (ja) |
KR (1) | KR20070106622A (ja) |
CN (1) | CN101128934A (ja) |
TW (1) | TW200631429A (ja) |
WO (1) | WO2006090492A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4337906B2 (ja) * | 2007-05-10 | 2009-09-30 | ソニー株式会社 | 固体撮像素子およびカメラシステム |
JP2009088706A (ja) * | 2007-09-27 | 2009-04-23 | Fujifilm Corp | 撮像装置及び固体撮像素子の駆動方法 |
JP4702384B2 (ja) * | 2008-03-26 | 2011-06-15 | ソニー株式会社 | 固体撮像素子 |
JP2011040536A (ja) * | 2009-08-10 | 2011-02-24 | Panasonic Corp | 固体撮像素子およびその駆動方法 |
US8426902B2 (en) * | 2010-07-30 | 2013-04-23 | Unisantis Electronics Singapore Pte Ltd. | Solid-state imaging device |
CN107018338B (zh) * | 2016-01-22 | 2021-01-29 | 松下知识产权经营株式会社 | 摄像装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2679659B2 (ja) | 1995-02-01 | 1997-11-19 | 日本電気株式会社 | 固体撮像装置 |
JP3598648B2 (ja) * | 1996-04-02 | 2004-12-08 | ソニー株式会社 | 電荷転送素子及び電荷転送素子の駆動方法 |
JP3455655B2 (ja) | 1997-03-03 | 2003-10-14 | 株式会社東芝 | 固体撮像装置および固体撮像装置応用システム |
TW421962B (en) * | 1997-09-29 | 2001-02-11 | Canon Kk | Image sensing device using mos type image sensing elements |
JPH11274459A (ja) * | 1998-03-20 | 1999-10-08 | Toshiba Corp | 固体撮像装置 |
JP2000150856A (ja) | 1998-11-18 | 2000-05-30 | Sony Corp | 固体撮像素子 |
JP3324581B2 (ja) * | 1999-09-21 | 2002-09-17 | 日本電気株式会社 | 固体撮像装置及びその製造方法 |
JP3467013B2 (ja) * | 1999-12-06 | 2003-11-17 | キヤノン株式会社 | 固体撮像装置 |
US6960817B2 (en) * | 2000-04-21 | 2005-11-01 | Canon Kabushiki Kaisha | Solid-state imaging device |
JP3647390B2 (ja) * | 2000-06-08 | 2005-05-11 | キヤノン株式会社 | 電荷転送装置、固体撮像装置及び撮像システム |
JP2002353433A (ja) * | 2001-05-25 | 2002-12-06 | Canon Inc | 固体撮像装置 |
JP4337549B2 (ja) | 2002-04-04 | 2009-09-30 | ソニー株式会社 | 固体撮像装置 |
JP4470363B2 (ja) | 2002-10-04 | 2010-06-02 | ソニー株式会社 | 固体撮像素子及びその制御方法 |
JP4503955B2 (ja) | 2003-08-21 | 2010-07-14 | パナソニック株式会社 | 固体撮像装置およびカメラ |
JP4075773B2 (ja) * | 2003-11-05 | 2008-04-16 | ソニー株式会社 | 固体撮像装置 |
JP2006059995A (ja) * | 2004-08-19 | 2006-03-02 | Matsushita Electric Ind Co Ltd | 増幅型固体撮像装置 |
-
2005
- 2005-02-25 JP JP2005051513A patent/JP4452199B2/ja not_active Expired - Fee Related
- 2005-07-21 CN CNA2005800486790A patent/CN101128934A/zh active Pending
- 2005-07-21 WO PCT/JP2005/013363 patent/WO2006090492A1/ja active Application Filing
- 2005-07-21 EP EP05766443A patent/EP1852914A4/en not_active Withdrawn
- 2005-07-21 US US11/883,556 patent/US7859032B2/en active Active
- 2005-07-21 KR KR1020077019643A patent/KR20070106622A/ko not_active Application Discontinuation
- 2005-07-28 TW TW094125533A patent/TW200631429A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20080087925A1 (en) | 2008-04-17 |
TW200631429A (en) | 2006-09-01 |
EP1852914A1 (en) | 2007-11-07 |
EP1852914A4 (en) | 2008-06-04 |
JP2006237381A (ja) | 2006-09-07 |
US7859032B2 (en) | 2010-12-28 |
CN101128934A (zh) | 2008-02-20 |
WO2006090492A1 (ja) | 2006-08-31 |
KR20070106622A (ko) | 2007-11-02 |
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