JP4439275B2 - 圧電振動子収納用パッケージおよび圧電装置 - Google Patents
圧電振動子収納用パッケージおよび圧電装置 Download PDFInfo
- Publication number
- JP4439275B2 JP4439275B2 JP2004020282A JP2004020282A JP4439275B2 JP 4439275 B2 JP4439275 B2 JP 4439275B2 JP 2004020282 A JP2004020282 A JP 2004020282A JP 2004020282 A JP2004020282 A JP 2004020282A JP 4439275 B2 JP4439275 B2 JP 4439275B2
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- JP
- Japan
- Prior art keywords
- piezoelectric vibrator
- metallized layer
- layer
- recess
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001465 metallisation Methods 0.000 claims description 43
- 239000004020 conductor Substances 0.000 description 21
- 239000000758 substrate Substances 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000005219 brazing Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229910010293 ceramic material Inorganic materials 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
そして、このような圧電振動子収納用パッケージの凹部2の内部に圧電振動子1を収容するとともに、圧電振動子1の電極と上側メタライズ層4とを導電性接着剤9を介して電気的に接続し、次に、絶縁基体3の上面の凹部2の周囲8に凹部2を覆うように、蓋体7を銀ろうや低融点ガラス等のろう材等を介して取着することにより、絶縁基体3の凹部2と蓋体7とで形成される容器の内部に圧電振動子1が気密封止され、圧電装置として形成される。
2・・・・・凹部
3・・・・・絶縁基体
4・・・・・上側メタライズ層
5・・・・・下側メタライズ層
5’・・・・延出部
6・・・・・電極
7・・・・・蓋体
9・・・・・導電性接着剤
10・・・・・配線導体
Claims (2)
- 上側主面に平板状の圧電振動子を収納するための凹部を有する絶縁基体と、前記凹部の底面の隅部に形成された、下側メタライズ層とその上に積層された上側メタライズ層とから成るとともに該上側メタライズ層の上面に前記圧電振動子の下面の端部が取着される突出した電極とを具備しており、前記上側メタライズ層は四角形状であり、前記下側メタライズ層は、四角形状の中央部とその各辺から外側に延出する延出部とから成り、該延出部は、前記各辺において同じ長さのものが間隔をあけて形成されていることを特徴とする圧電振動子収納用パッケージ。
- 請求項1に記載の圧電振動子収納用パッケージと、前記凹部内に収納されるとともに前記上側メタライズ層に電気的に接続された圧電振動子と、前記絶縁基体の上面の前記凹部の周囲に前記凹部を覆うように取着された蓋体とを具備していることを特徴とする圧電装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004020282A JP4439275B2 (ja) | 2004-01-28 | 2004-01-28 | 圧電振動子収納用パッケージおよび圧電装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004020282A JP4439275B2 (ja) | 2004-01-28 | 2004-01-28 | 圧電振動子収納用パッケージおよび圧電装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005217647A JP2005217647A (ja) | 2005-08-11 |
JP4439275B2 true JP4439275B2 (ja) | 2010-03-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004020282A Expired - Fee Related JP4439275B2 (ja) | 2004-01-28 | 2004-01-28 | 圧電振動子収納用パッケージおよび圧電装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4439275B2 (ja) |
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2004
- 2004-01-28 JP JP2004020282A patent/JP4439275B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2005217647A (ja) | 2005-08-11 |
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