JP4435663B2 - はんだ材料、電子部品、及び電子部品の製造方法 - Google Patents
はんだ材料、電子部品、及び電子部品の製造方法 Download PDFInfo
- Publication number
- JP4435663B2 JP4435663B2 JP2004291979A JP2004291979A JP4435663B2 JP 4435663 B2 JP4435663 B2 JP 4435663B2 JP 2004291979 A JP2004291979 A JP 2004291979A JP 2004291979 A JP2004291979 A JP 2004291979A JP 4435663 B2 JP4435663 B2 JP 4435663B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic component
- solder material
- component
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 168
- 239000000463 material Substances 0.000 title claims description 80
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 76
- 239000002184 metal Substances 0.000 claims description 76
- 239000000203 mixture Substances 0.000 claims description 59
- 239000000843 powder Substances 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 33
- 239000003566 sealing material Substances 0.000 claims description 23
- 230000004907 flux Effects 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 52
- 230000000694 effects Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004291979A JP4435663B2 (ja) | 2004-10-04 | 2004-10-04 | はんだ材料、電子部品、及び電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004291979A JP4435663B2 (ja) | 2004-10-04 | 2004-10-04 | はんだ材料、電子部品、及び電子部品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006102769A JP2006102769A (ja) | 2006-04-20 |
| JP2006102769A5 JP2006102769A5 (enrdf_load_stackoverflow) | 2009-08-06 |
| JP4435663B2 true JP4435663B2 (ja) | 2010-03-24 |
Family
ID=36373061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004291979A Expired - Fee Related JP4435663B2 (ja) | 2004-10-04 | 2004-10-04 | はんだ材料、電子部品、及び電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4435663B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174332A (ja) | 2011-02-17 | 2012-09-10 | Fujitsu Ltd | 導電性接合材料、導体の接合方法、及び半導体装置の製造方法 |
| JP2013119089A (ja) * | 2011-12-06 | 2013-06-17 | Fujitsu Ltd | 導電性接合材料、並びに電子部品及び電子機器 |
| KR102156373B1 (ko) * | 2013-05-10 | 2020-09-16 | 엘지이노텍 주식회사 | 솔더 페이스트 |
| CN114055008B (zh) * | 2021-11-18 | 2023-09-05 | 陕西众森电能科技有限公司 | 一种制备超细焊锡膏的金属粉、焊锡膏及其制备方法 |
-
2004
- 2004-10-04 JP JP2004291979A patent/JP4435663B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006102769A (ja) | 2006-04-20 |
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