JP4421294B2 - 半導体ウエハの識別 - Google Patents
半導体ウエハの識別 Download PDFInfo
- Publication number
- JP4421294B2 JP4421294B2 JP2003533207A JP2003533207A JP4421294B2 JP 4421294 B2 JP4421294 B2 JP 4421294B2 JP 2003533207 A JP2003533207 A JP 2003533207A JP 2003533207 A JP2003533207 A JP 2003533207A JP 4421294 B2 JP4421294 B2 JP 4421294B2
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- JP
- Japan
- Prior art keywords
- semiconductor wafer
- magnetic
- wafer
- region
- magnetic means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06187—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with magnetically detectable marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
残念ながら、光学情報は、ウエハプロセス中に消失するか、または読み取り不能となる場合が多い。特に、非常に小さく薄いマーキングは、ウエハ上の様々な膜堆積の工程後に消失する傾向がある。同様に、デバイス工程の前になされたレーザースクライブも、このような効果により、裸眼、顕微鏡、または光学文字読み取り装置で読み取ることが不可能になる場合が多い。
識別情報を磁気手段14により提供する工程と、
半導体ウエハ10の表面28,30に隣接して配置された磁気センサ26により、識別情報14を読み取る工程とを含む。磁気手段14を含む少なくとも一つの領域は平坦であり、かつ半導体ウエハ10と一平面を形成する。該方法は、少なくとも一つの領域を含む半導体ウエハ10の一平面を覆う保護膜を形成する工程を更に含む。
ウエハプロセス中に真空チャックにより係合されるウエハ内側領域内に、磁気識別子が配置される。この場合、真空チャックに読み取り能力が提供される。
物理的に表面を改質するレーザースクライブによる汚染の可能性が、完全に除去される。
例えばシリコンの磁化率は、材料の磁気特性を妨害しないものであると想定される。
磁気手段の付着工程による金属汚染は、EPI等のウエハ上に重なる層、裏面シール、および、例えばシリコン内のイオン注入深度等により最小となるであろう。注入されたイオンは、その移動が制限されるために、定位置に残留する。
本発明の概念は、Cu、low K、およびSOI等の進歩的なデバイスプロセス工程に適合する。
もよい。これに代わって、例えば最初の膜堆積等、他の膜堆積により汚染を防止してもよい。
一般に、磁気的に補助されるエッチング工程が、コードの読み取りを妨害しないように使用されることを確実にする必要がある。
ログラミングは、磁気テープ技術と同様の方法により行なわれ得る。
Claims (5)
- 半導体ウエハの識別情報を付帯する少なくとも一つの領域を有する半導体ウエハ(10)であって、前記識別情報は、磁気手段(14)により、前記少なくとも一つの領域に提供され、前記磁気手段は磁気イオンのイオン注入によって提供され、
前記磁気手段(14)が半導体表面の内側領域に配置され、かつ磁気読み取り能力を有する真空チャック装置が、前記半導体表面の内側領域において半導体ウエハ(10)に係合し得るものであり、
前記磁気手段(14)を含む少なくとも一つの領域は平坦であり、かつ前記半導体ウエハ(10)と一平面を形成し、
前記少なくとも一つの領域を含む前記半導体ウエハ(10)の前記一平面を覆う保護膜を備える半導体ウエハ。 - 前記磁気手段(14)は、一連の磁気領域および非磁気領域を備えてコードパターンを提供する、請求項1に記載の半導体ウエハ(10)。
- 前記磁気手段(14)は、異なる磁気の強さを有する複数の磁気領域を備えた請求項1に記載の半導体ウエハ(10)。
- 前記磁気手段(14)が、半導体ウエハの縁部(24)の近傍に配置されている請求項1に記載の半導体ウエハ(10)。
- 半導体ウエハ(10)上に、該半導体ウエハの識別情報を付帯する少なくとも一つの領域を設ける方法であって、
半導体ウエハ(10)を提供する工程と、
前記少なくとも一つの領域に磁気手段(14)を提供する工程とを含み、前記磁気手段は磁気イオンのイオン注入によって提供され、前記磁気手段(14)を含む少なくとも一つの領域は平坦であり、かつ前記半導体ウエハ(10)と一平面を形成するものであり、
前記少なくとも一つの領域を含む前記半導体ウエハ(10)の前記一平面を覆う保護膜を形成する工程を更に含み、
前記磁気手段(14)が半導体表面の内側領域に配置され、かつ磁気読み取り能力を有する真空チャック装置が、前記半導体表面の内側領域において半導体ウエハ(10)に係合し得る方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/966,046 US6759248B2 (en) | 2001-09-28 | 2001-09-28 | Semiconductor wafer identification |
PCT/US2002/029073 WO2003030081A2 (en) | 2001-09-28 | 2002-09-12 | Semiconductor wafer identification |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005507158A JP2005507158A (ja) | 2005-03-10 |
JP2005507158A5 JP2005507158A5 (ja) | 2006-01-05 |
JP4421294B2 true JP4421294B2 (ja) | 2010-02-24 |
Family
ID=25510852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003533207A Expired - Fee Related JP4421294B2 (ja) | 2001-09-28 | 2002-09-12 | 半導体ウエハの識別 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6759248B2 (ja) |
EP (1) | EP1449162A2 (ja) |
JP (1) | JP4421294B2 (ja) |
KR (1) | KR20040050068A (ja) |
AU (1) | AU2002333613A1 (ja) |
TW (1) | TWI256720B (ja) |
WO (1) | WO2003030081A2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3809353B2 (ja) * | 2001-08-02 | 2006-08-16 | キヤノン株式会社 | Id付き加工物の製造方法 |
US20040064801A1 (en) * | 2002-09-30 | 2004-04-01 | Texas Instruments Incorporated | Design techniques enabling storing of bit values which can change when the design changes |
DE10325541A1 (de) * | 2003-06-04 | 2005-01-13 | Infineon Technologies Ag | Elektronisches Bauteil, sowie Halbleiterwafer und Bauteilträger zur Herstellung des Bauteils |
US7531907B2 (en) * | 2005-04-29 | 2009-05-12 | Hitachi Global Storage Technologies Netherlands B.V. | System and method for forming serial numbers on HDD wafers |
CN102769068B (zh) * | 2012-05-09 | 2015-12-16 | 镇江环太硅科技有限公司 | 太阳能电池用多晶硅片的编码方法 |
US10714427B2 (en) | 2016-09-08 | 2020-07-14 | Asml Netherlands B.V. | Secure chips with serial numbers |
US10418324B2 (en) | 2016-10-27 | 2019-09-17 | Asml Netherlands B.V. | Fabricating unique chips using a charged particle multi-beamlet lithography system |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1534248A (en) * | 1976-03-31 | 1978-11-29 | Tokyo Shibaura Electric Co | Apparatus for manufacturing semiconductor devices |
GB1584343A (en) * | 1977-06-07 | 1981-02-11 | Tokyo Shibaura Electric Co | Apparatus for marking identification symbols on wafer |
CA2011296A1 (en) * | 1989-05-15 | 1990-11-15 | Douglas C. Bossen | Presence/absence bar code |
US6307241B1 (en) * | 1995-06-07 | 2001-10-23 | The Regents Of The Unversity Of California | Integrable ferromagnets for high density storage |
TW392218B (en) * | 1996-12-06 | 2000-06-01 | Toshiba Mechatronics Kk | Apparatus and method for marking of identifier onto semiconductor wafer |
JPH10256105A (ja) * | 1997-03-11 | 1998-09-25 | Super Silicon Kenkyusho:Kk | レーザマークを付けたウェーハ |
DE19733410A1 (de) * | 1997-08-01 | 1999-02-18 | Siemens Ag | Wafermarkierung |
JP3090113B2 (ja) * | 1998-02-13 | 2000-09-18 | 日本電気株式会社 | 半導体装置の製造方法 |
US6268641B1 (en) * | 1998-03-30 | 2001-07-31 | Kabushiki Kaisha Toshiba | Semiconductor wafer having identification indication and method of manufacturing the same |
US6063685A (en) * | 1998-08-07 | 2000-05-16 | Advanced Micro Devices, Inc. | Device level identification methodology |
JP2000077312A (ja) * | 1998-09-02 | 2000-03-14 | Mitsubishi Electric Corp | 半導体装置 |
US6197481B1 (en) * | 1998-09-17 | 2001-03-06 | Taiwan Semiconductor Manufacturing Company | Wafer alignment marks protected by photoresist |
EP1046192A1 (en) * | 1998-10-20 | 2000-10-25 | Koninklijke Philips Electronics N.V. | Method of manufacturing a semiconductor device in a silicon body, a surface of said silicon body being provided with an alignment grating and an at least partially recessed oxide pattern |
US6312876B1 (en) * | 1999-07-08 | 2001-11-06 | Taiwan Semiconductor Manufacturing Company | Method for placing identifying mark on semiconductor wafer |
US6383888B1 (en) * | 2001-04-18 | 2002-05-07 | Advanced Micro Devices, Inc. | Method and apparatus for selecting wafer alignment marks based on film thickness variation |
-
2001
- 2001-09-28 US US09/966,046 patent/US6759248B2/en not_active Expired - Fee Related
-
2002
- 2002-09-12 KR KR10-2004-7004635A patent/KR20040050068A/ko not_active Application Discontinuation
- 2002-09-12 EP EP02800333A patent/EP1449162A2/en not_active Withdrawn
- 2002-09-12 WO PCT/US2002/029073 patent/WO2003030081A2/en not_active Application Discontinuation
- 2002-09-12 AU AU2002333613A patent/AU2002333613A1/en not_active Abandoned
- 2002-09-12 JP JP2003533207A patent/JP4421294B2/ja not_active Expired - Fee Related
- 2002-09-27 TW TW091122347A patent/TWI256720B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20040050068A (ko) | 2004-06-14 |
JP2005507158A (ja) | 2005-03-10 |
WO2003030081A3 (en) | 2003-08-21 |
US20030064531A1 (en) | 2003-04-03 |
AU2002333613A1 (en) | 2003-04-14 |
WO2003030081A2 (en) | 2003-04-10 |
US6759248B2 (en) | 2004-07-06 |
TWI256720B (en) | 2006-06-11 |
EP1449162A2 (en) | 2004-08-25 |
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