JP4418028B2 - 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金 - Google Patents
電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金 Download PDFInfo
- Publication number
- JP4418028B2 JP4418028B2 JP2009509224A JP2009509224A JP4418028B2 JP 4418028 B2 JP4418028 B2 JP 4418028B2 JP 2009509224 A JP2009509224 A JP 2009509224A JP 2009509224 A JP2009509224 A JP 2009509224A JP 4418028 B2 JP4418028 B2 JP 4418028B2
- Authority
- JP
- Japan
- Prior art keywords
- compound
- alloy
- mass
- strength
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012776 electronic material Substances 0.000 title claims description 14
- 229910045601 alloy Inorganic materials 0.000 title description 36
- 239000000956 alloy Substances 0.000 title description 36
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 title description 22
- 150000001875 compounds Chemical class 0.000 claims description 43
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 36
- 229910019819 Cr—Si Inorganic materials 0.000 claims description 27
- 229910052710 silicon Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 13
- 229910052804 chromium Inorganic materials 0.000 claims description 11
- 239000006185 dispersion Substances 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 description 45
- 238000001816 cooling Methods 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 18
- 230000032683 aging Effects 0.000 description 16
- 239000000203 mixture Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- 229910018098 Ni-Si Inorganic materials 0.000 description 11
- 229910018529 Ni—Si Inorganic materials 0.000 description 11
- 238000005452 bending Methods 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000006104 solid solution Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 7
- 238000005097 cold rolling Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 5
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 229910021332 silicide Inorganic materials 0.000 description 5
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910019974 CrSi Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001376 precipitating effect Effects 0.000 description 3
- 238000004881 precipitation hardening Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011856 silicon-based particle Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000000864 Auger spectrum Methods 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 229910021357 chromium silicide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007094441 | 2007-03-30 | ||
| JP2007094441 | 2007-03-30 | ||
| PCT/JP2008/056138 WO2008123433A1 (ja) | 2007-03-30 | 2008-03-28 | 電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP4418028B2 true JP4418028B2 (ja) | 2010-02-17 |
| JPWO2008123433A1 JPWO2008123433A1 (ja) | 2010-07-15 |
Family
ID=39830918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009509224A Active JP4418028B2 (ja) | 2007-03-30 | 2008-03-28 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100086435A1 (zh) |
| EP (1) | EP2154257B1 (zh) |
| JP (1) | JP4418028B2 (zh) |
| KR (1) | KR101211984B1 (zh) |
| CN (1) | CN101646792B (zh) |
| TW (1) | TWI395824B (zh) |
| WO (1) | WO2008123433A1 (zh) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2270242B1 (en) * | 2008-03-31 | 2014-06-04 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric or electronic apparatuses, method for producing it and component |
| JP4653239B2 (ja) * | 2008-03-31 | 2011-03-16 | 古河電気工業株式会社 | 電気電子機器用銅合金材料および電気電子部品 |
| EP2508634B1 (en) * | 2009-12-02 | 2017-08-23 | Furukawa Electric Co., Ltd. | Method for producing a copper alloy sheet material having low young's modulus |
| US9005521B2 (en) * | 2010-04-02 | 2015-04-14 | Jx Nippon Mining & Metals Corporation | Cu—Ni—Si alloy for electronic material |
| JP5045784B2 (ja) * | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
| JP5714863B2 (ja) | 2010-10-14 | 2015-05-07 | 矢崎総業株式会社 | 雌端子および雌端子の製造方法 |
| JP5712585B2 (ja) * | 2010-12-03 | 2015-05-07 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
| JP5684022B2 (ja) * | 2011-03-28 | 2015-03-11 | 三菱伸銅株式会社 | 耐応力緩和特性と曲げ加工後の耐疲労特性およびばね特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板およびその製造方法 |
| US9159985B2 (en) * | 2011-05-27 | 2015-10-13 | Ostuka Techno Corporation | Circuit breaker and battery pack including the same |
| JP5903842B2 (ja) | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法 |
| KR101274063B1 (ko) * | 2013-01-22 | 2013-06-12 | 한국기계연구원 | 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법 |
| KR101709560B1 (ko) | 2013-09-27 | 2017-02-23 | 주식회사 엘지화학 | 낮은 저항의 전극 탭을 포함하는 이차전지 |
| JP6452472B2 (ja) * | 2014-01-27 | 2019-01-16 | 古河電気工業株式会社 | 銅合金材およびその製造方法 |
| CN105385890A (zh) * | 2015-11-27 | 2016-03-09 | 宁波博威合金材料股份有限公司 | 一种含镍、硅的青铜合金及其应用 |
| CN105821238B (zh) * | 2016-05-31 | 2018-01-02 | 黄河科技学院 | 一种铜合金材料及其制备方法 |
| CN106191725B (zh) * | 2016-06-24 | 2018-01-26 | 河南江河机械有限责任公司 | 高强度高导电铜合金纳米相析出工艺方法 |
| CN108193080B (zh) * | 2016-12-08 | 2019-12-17 | 北京有色金属研究总院 | 高强度、高导电耐应力松弛铜镍硅合金材料及其制备方法 |
| CN109609801A (zh) * | 2018-12-06 | 2019-04-12 | 宁波博威合金材料股份有限公司 | 高性能铜合金及其制备方法 |
| CN115386766A (zh) * | 2022-08-11 | 2022-11-25 | 中国科学院金属研究所 | 一种Cu-Ni-Si-Cr-Mg五元铜合金及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61115249A (ja) | 1984-11-09 | 1986-06-02 | Sanyo Electric Co Ltd | 電気機械変換器の支持装置 |
| JP2862942B2 (ja) | 1990-03-20 | 1999-03-03 | 古河電気工業株式会社 | コルソン合金の熱処理方法 |
| JP3049137B2 (ja) * | 1991-12-27 | 2000-06-05 | 株式会社神戸製鋼所 | 曲げ加工性が優れた高力銅合金及びその製造方法 |
| JPH0718356A (ja) * | 1993-07-01 | 1995-01-20 | Mitsubishi Electric Corp | 電子機器用銅合金、その製造方法およびｉｃリードフレーム |
| JP2001207229A (ja) * | 2000-01-27 | 2001-07-31 | Nippon Mining & Metals Co Ltd | 電子材料用銅合金 |
| JP4177221B2 (ja) | 2003-10-06 | 2008-11-05 | 古河電気工業株式会社 | 電子機器用銅合金 |
| JP3864965B2 (ja) * | 2004-06-08 | 2007-01-10 | 日立電線株式会社 | 端子・コネクタ用銅合金の製造方法 |
| CN101166840B (zh) * | 2005-02-28 | 2012-07-18 | 古河电气工业株式会社 | 铜合金 |
| CN1776997B (zh) * | 2005-12-13 | 2010-05-05 | 江苏科技大学 | 大容量汽轮发电机转子铜合金槽楔及其制备方法 |
-
2008
- 2008-03-28 TW TW097111276A patent/TWI395824B/zh active
- 2008-03-28 KR KR1020097022449A patent/KR101211984B1/ko active IP Right Grant
- 2008-03-28 JP JP2009509224A patent/JP4418028B2/ja active Active
- 2008-03-28 EP EP08739256.9A patent/EP2154257B1/en active Active
- 2008-03-28 CN CN2008800101895A patent/CN101646792B/zh active Active
- 2008-03-28 WO PCT/JP2008/056138 patent/WO2008123433A1/ja active Application Filing
- 2008-03-28 US US12/532,929 patent/US20100086435A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20100086435A1 (en) | 2010-04-08 |
| EP2154257B1 (en) | 2016-10-05 |
| CN101646792B (zh) | 2012-02-22 |
| TWI395824B (zh) | 2013-05-11 |
| EP2154257A4 (en) | 2012-01-11 |
| TW200902732A (en) | 2009-01-16 |
| JPWO2008123433A1 (ja) | 2010-07-15 |
| WO2008123433A1 (ja) | 2008-10-16 |
| KR101211984B1 (ko) | 2012-12-13 |
| KR20090123017A (ko) | 2009-12-01 |
| CN101646792A (zh) | 2010-02-10 |
| EP2154257A1 (en) | 2010-02-17 |
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