JP4412710B2 - 光電変換装置の設計方法 - Google Patents

光電変換装置の設計方法 Download PDF

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Publication number
JP4412710B2
JP4412710B2 JP2003393978A JP2003393978A JP4412710B2 JP 4412710 B2 JP4412710 B2 JP 4412710B2 JP 2003393978 A JP2003393978 A JP 2003393978A JP 2003393978 A JP2003393978 A JP 2003393978A JP 4412710 B2 JP4412710 B2 JP 4412710B2
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JP
Japan
Prior art keywords
film
antireflection film
color filter
photoelectric conversion
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003393978A
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English (en)
Japanese (ja)
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JP2005158940A5 (enExample
JP2005158940A (ja
Inventor
智之 野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003393978A priority Critical patent/JP4412710B2/ja
Priority to US10/986,945 priority patent/US7518096B2/en
Publication of JP2005158940A publication Critical patent/JP2005158940A/ja
Publication of JP2005158940A5 publication Critical patent/JP2005158940A5/ja
Priority to US12/397,751 priority patent/US7985947B2/en
Application granted granted Critical
Publication of JP4412710B2 publication Critical patent/JP4412710B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/331—Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2003393978A 2003-11-25 2003-11-25 光電変換装置の設計方法 Expired - Fee Related JP4412710B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003393978A JP4412710B2 (ja) 2003-11-25 2003-11-25 光電変換装置の設計方法
US10/986,945 US7518096B2 (en) 2003-11-25 2004-11-15 Method of designing photoelectric conversion apparatus with carefully set antireflective film thickness
US12/397,751 US7985947B2 (en) 2003-11-25 2009-03-04 Photoelectric conversion apparatus and image pickup system using photoelectric conversion apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003393978A JP4412710B2 (ja) 2003-11-25 2003-11-25 光電変換装置の設計方法

Publications (3)

Publication Number Publication Date
JP2005158940A JP2005158940A (ja) 2005-06-16
JP2005158940A5 JP2005158940A5 (enExample) 2007-01-18
JP4412710B2 true JP4412710B2 (ja) 2010-02-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003393978A Expired - Fee Related JP4412710B2 (ja) 2003-11-25 2003-11-25 光電変換装置の設計方法

Country Status (2)

Country Link
US (2) US7518096B2 (enExample)
JP (1) JP4412710B2 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100753391B1 (ko) * 2004-05-14 2007-08-30 매그나칩 반도체 유한회사 씨모스 이미지센서
JP4944399B2 (ja) * 2005-07-04 2012-05-30 キヤノン株式会社 固体撮像装置
US8274715B2 (en) 2005-07-28 2012-09-25 Omnivision Technologies, Inc. Processing color and panchromatic pixels
US8139130B2 (en) 2005-07-28 2012-03-20 Omnivision Technologies, Inc. Image sensor with improved light sensitivity
EP1788797B1 (en) * 2005-11-18 2013-06-26 Canon Kabushiki Kaisha Solid-state image pickup device
US7916362B2 (en) 2006-05-22 2011-03-29 Eastman Kodak Company Image sensor with improved light sensitivity
US8031258B2 (en) 2006-10-04 2011-10-04 Omnivision Technologies, Inc. Providing multiple video signals from single sensor
US8896712B2 (en) * 2007-07-20 2014-11-25 Omnivision Technologies, Inc. Determining and correcting for imaging device motion during an exposure
JP4548519B2 (ja) * 2007-10-16 2010-09-22 セイコーエプソン株式会社 光源装置
US7924504B2 (en) * 2008-01-01 2011-04-12 United Microelectronics Corp. Color filter structure having inorganic layers
JP5371463B2 (ja) 2008-02-28 2013-12-18 キヤノン株式会社 撮像装置、撮像システム、および、撮像装置の制御方法
JP5314914B2 (ja) * 2008-04-04 2013-10-16 キヤノン株式会社 光電変換装置、撮像システム、設計方法、及び光電変換装置の製造方法
US8350952B2 (en) * 2008-06-04 2013-01-08 Omnivision Technologies, Inc. Image sensors with improved angle response
US20100006908A1 (en) * 2008-07-09 2010-01-14 Brady Frederick T Backside illuminated image sensor with shallow backside trench for photodiode isolation
US7915067B2 (en) * 2008-07-09 2011-03-29 Eastman Kodak Company Backside illuminated image sensor with reduced dark current
US7859033B2 (en) 2008-07-09 2010-12-28 Eastman Kodak Company Wafer level processing for backside illuminated sensors
JP5203913B2 (ja) * 2008-12-15 2013-06-05 キヤノン株式会社 光電変換装置、撮像システム、及び光電変換装置の駆動方法
JP2010238848A (ja) * 2009-03-31 2010-10-21 Sony Corp 固体撮像装置および電子機器
US8237831B2 (en) * 2009-05-28 2012-08-07 Omnivision Technologies, Inc. Four-channel color filter array interpolation
JP2012038938A (ja) * 2010-08-06 2012-02-23 Canon Inc 固体撮像素子およびカメラ
JP6071183B2 (ja) 2011-10-20 2017-02-01 キヤノン株式会社 固体撮像装置およびカメラ
JP2024046470A (ja) 2022-09-22 2024-04-03 株式会社東芝 固体撮像装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3079567B2 (ja) 1990-11-30 2000-08-21 ソニー株式会社 固体撮像装置
CN1070292C (zh) * 1995-03-23 2001-08-29 松下电器产业株式会社 光学用板及使用它的透射式屏
JP3070513B2 (ja) * 1997-04-07 2000-07-31 日本電気株式会社 固体撮像素子及びその製造方法
JP3620237B2 (ja) 1997-09-29 2005-02-16 ソニー株式会社 固体撮像素子
JP3103064B2 (ja) 1998-04-23 2000-10-23 松下電子工業株式会社 固体撮像装置およびその製造方法
WO2000063924A1 (en) * 1999-04-20 2000-10-26 Matsushita Electric Industrial Co., Ltd. Transparent substrate with conductive multilayer antireflection coating, touch panel using transparent substrate, and electronic device using touch panel
JP2001352051A (ja) 2000-06-07 2001-12-21 Sony Corp 固体撮像素子及びその製造方法
US6497981B2 (en) * 2001-03-07 2002-12-24 United Microelectronics Corp. Method of forming color filter array
US6828259B2 (en) * 2001-03-28 2004-12-07 Advanced Micro Devices, Inc. Enhanced transistor gate using E-beam radiation
JPWO2003005069A1 (ja) * 2001-07-05 2004-10-28 帝人デュポンフィルム株式会社 反射防止フィルムおよびその製造法
JP2003197949A (ja) * 2001-12-26 2003-07-11 Sharp Corp 受光素子および回路内蔵型受光装置および光ディスク装置
JP2003229562A (ja) 2002-02-05 2003-08-15 Sony Corp 半導体装置、その製造方法及び半導体製造装置
US6884702B2 (en) * 2002-06-04 2005-04-26 Advanced Micro Devices, Inc. Method of making an SOI semiconductor device having enhanced, self-aligned dielectric regions in the bulk silicon substrate

Also Published As

Publication number Publication date
JP2005158940A (ja) 2005-06-16
US20090189060A1 (en) 2009-07-30
US20050110002A1 (en) 2005-05-26
US7518096B2 (en) 2009-04-14
US7985947B2 (en) 2011-07-26

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