JP4387065B2 - 液晶表示装置および液晶表示装置の作製方法 - Google Patents

液晶表示装置および液晶表示装置の作製方法 Download PDF

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Publication number
JP4387065B2
JP4387065B2 JP2001017704A JP2001017704A JP4387065B2 JP 4387065 B2 JP4387065 B2 JP 4387065B2 JP 2001017704 A JP2001017704 A JP 2001017704A JP 2001017704 A JP2001017704 A JP 2001017704A JP 4387065 B2 JP4387065 B2 JP 4387065B2
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Prior art keywords
wiring
insulating layer
semiconductor film
gate
pixel
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Expired - Fee Related
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JP2001017704A
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Japanese (ja)
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JP2001281703A (ja
JP2001281703A5 (enExample
Inventor
舜平 山崎
潤 小山
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Publication of JP2001281703A5 publication Critical patent/JP2001281703A5/ja
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Thin Film Transistor (AREA)
JP2001017704A 2000-01-26 2001-01-25 液晶表示装置および液晶表示装置の作製方法 Expired - Fee Related JP4387065B2 (ja)

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JP2001017704A JP4387065B2 (ja) 2000-01-26 2001-01-25 液晶表示装置および液晶表示装置の作製方法

Applications Claiming Priority (3)

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JP2000017636 2000-01-26
JP2000-17636 2000-01-26
JP2001017704A JP4387065B2 (ja) 2000-01-26 2001-01-25 液晶表示装置および液晶表示装置の作製方法

Related Child Applications (1)

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JP2006052929A Division JP4387364B2 (ja) 2000-01-26 2006-02-28 液晶表示装置およびその作製方法

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JP2001281703A JP2001281703A (ja) 2001-10-10
JP2001281703A5 JP2001281703A5 (enExample) 2006-04-20
JP4387065B2 true JP4387065B2 (ja) 2009-12-16

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014197199A (ja) * 2014-05-02 2014-10-16 株式会社半導体エネルギー研究所 表示装置、表示モジュール、及び電子機器
US9153352B2 (en) 2001-07-27 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4197233B2 (ja) 2002-03-20 2008-12-17 株式会社日立製作所 表示装置
JP2006065021A (ja) 2004-08-27 2006-03-09 Seiko Epson Corp アクティブマトリクス基板の製造方法、アクティブマトリクス基板、電気光学装置並びに電子機器
JP4606103B2 (ja) * 2004-09-22 2011-01-05 株式会社 日立ディスプレイズ 液晶表示装置
KR100659761B1 (ko) 2004-10-12 2006-12-19 삼성에스디아이 주식회사 반도체소자 및 그 제조방법
EP2924498A1 (en) 2006-04-06 2015-09-30 Semiconductor Energy Laboratory Co, Ltd. Liquid crystal desplay device, semiconductor device, and electronic appliance
WO2008007520A1 (en) * 2006-07-14 2008-01-17 Konica Minolta Holdings, Inc. Liquid crystal display device manufacturing method and liquid crystal display device
JP4989309B2 (ja) 2007-05-18 2012-08-01 株式会社半導体エネルギー研究所 液晶表示装置
US8278713B2 (en) * 2008-03-28 2012-10-02 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
JP2012118297A (ja) * 2010-12-01 2012-06-21 Sony Corp 表示パネルおよびその製造方法、表示装置、ならびに電子機器
US9069202B2 (en) 2011-03-11 2015-06-30 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
JP5443537B2 (ja) * 2012-04-27 2014-03-19 株式会社半導体エネルギー研究所 液晶表示装置及び電子機器
KR20170131787A (ko) * 2016-05-20 2017-11-30 삼성디스플레이 주식회사 박막트랜지스터의 제조방법 및 박막트랜지스터를 채용하는 표시장치
JP6539309B2 (ja) * 2017-07-14 2019-07-03 株式会社ジャパンディスプレイ 液晶表示装置
CN110426906B (zh) * 2018-08-10 2022-03-04 友达光电股份有限公司 像素阵列基板
CN112258991B (zh) * 2020-11-13 2025-04-01 京东方科技集团股份有限公司 一种阵列基板、显示面板及显示装置
CN113835272B (zh) * 2021-09-27 2022-11-25 Tcl华星光电技术有限公司 显示面板及显示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812354B2 (ja) * 1987-10-14 1996-02-07 セイコーエプソン株式会社 アクティブマトリクス基板の製造方法
JP3427611B2 (ja) * 1996-03-27 2003-07-22 株式会社日立製作所 液晶表示装置
JP3622934B2 (ja) * 1996-07-31 2005-02-23 エルジー フィリップス エルシーディー カンパニー リミテッド 薄膜トランジスタ型液晶表示装置
JPH10170959A (ja) * 1996-12-16 1998-06-26 Casio Comput Co Ltd 液晶表示装置
JPH1152403A (ja) * 1997-07-31 1999-02-26 Mitsubishi Electric Corp 液晶表示装置
JPH11194366A (ja) * 1998-01-07 1999-07-21 Seiko Epson Corp アクティブマトリックス基板およびその製造方法、液晶装置および電子機器
JPH11326941A (ja) * 1999-04-26 1999-11-26 Sharp Corp アクティブマトリクス表示装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153352B2 (en) 2001-07-27 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
US9917107B2 (en) 2001-07-27 2018-03-13 Semiconductor Energy Laboratory Co., Ltd. Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
US10854636B2 (en) 2001-07-27 2020-12-01 Semiconductor Energy Laboratory Co., Ltd. Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
JP2014197199A (ja) * 2014-05-02 2014-10-16 株式会社半導体エネルギー研究所 表示装置、表示モジュール、及び電子機器

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