JP4378980B2 - 制御端子付き電子部品 - Google Patents

制御端子付き電子部品 Download PDF

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Publication number
JP4378980B2
JP4378980B2 JP2003068345A JP2003068345A JP4378980B2 JP 4378980 B2 JP4378980 B2 JP 4378980B2 JP 2003068345 A JP2003068345 A JP 2003068345A JP 2003068345 A JP2003068345 A JP 2003068345A JP 4378980 B2 JP4378980 B2 JP 4378980B2
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JP
Japan
Prior art keywords
package
inspection
electronic component
terminal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003068345A
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English (en)
Japanese (ja)
Other versions
JP2004007469A5 (enExample
JP2004007469A (ja
Inventor
克彦 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2003068345A priority Critical patent/JP4378980B2/ja
Publication of JP2004007469A publication Critical patent/JP2004007469A/ja
Publication of JP2004007469A5 publication Critical patent/JP2004007469A5/ja
Application granted granted Critical
Publication of JP4378980B2 publication Critical patent/JP4378980B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2003068345A 2002-03-25 2003-03-13 制御端子付き電子部品 Expired - Fee Related JP4378980B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003068345A JP4378980B2 (ja) 2002-03-25 2003-03-13 制御端子付き電子部品

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002084333 2002-03-25
JP2003068345A JP4378980B2 (ja) 2002-03-25 2003-03-13 制御端子付き電子部品

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2009069526A Division JP5024317B2 (ja) 2002-03-25 2009-03-23 電子部品および電子部品の製造方法
JP2009108870A Division JP2009175155A (ja) 2002-03-25 2009-04-28 制御端子付き電子部品
JP2009108871A Division JP2009171607A (ja) 2002-03-25 2009-04-28 制御端子付き電子部品

Publications (3)

Publication Number Publication Date
JP2004007469A JP2004007469A (ja) 2004-01-08
JP2004007469A5 JP2004007469A5 (enExample) 2006-04-20
JP4378980B2 true JP4378980B2 (ja) 2009-12-09

Family

ID=30445934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003068345A Expired - Fee Related JP4378980B2 (ja) 2002-03-25 2003-03-13 制御端子付き電子部品

Country Status (1)

Country Link
JP (1) JP4378980B2 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4251070B2 (ja) 2003-12-10 2009-04-08 エプソントヨコム株式会社 圧電発振器、電子部品、及び圧電発振器の製造方法
US7710002B2 (en) 2006-06-21 2010-05-04 Epson Toyocom Corporation Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator
JP4848676B2 (ja) * 2005-06-10 2011-12-28 株式会社村田製作所 部品内蔵基板、この部品内蔵基板を用いた部品内蔵モジュール、および部品内蔵基板の製造方法
JP4654837B2 (ja) * 2005-08-24 2011-03-23 エプソントヨコム株式会社 表面実装型圧電発振器用パッケージ、表面実装型圧電発振器
JP4724519B2 (ja) * 2005-09-29 2011-07-13 京セラキンセキ株式会社 圧電発振器
JP2007103994A (ja) * 2005-09-30 2007-04-19 Kyocera Kinseki Corp 圧電発振器
JP4894248B2 (ja) * 2005-12-01 2012-03-14 セイコーエプソン株式会社 電子デバイスの外部信号入力方法
JP2007243536A (ja) * 2006-03-08 2007-09-20 Epson Toyocom Corp 圧電デバイス及びその製造方法
JP2008141412A (ja) * 2006-11-30 2008-06-19 Kyocera Kinseki Corp 圧電デバイス
JP2009174910A (ja) 2008-01-22 2009-08-06 Olympus Corp 積層実装構造体
JP2009194725A (ja) * 2008-02-15 2009-08-27 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP5252992B2 (ja) * 2008-05-21 2013-07-31 京セラ株式会社 水晶発振器用パッケージおよび水晶発振器
JP5459985B2 (ja) * 2008-06-19 2014-04-02 京セラ株式会社 パッケージ及びそれを用いた電子装置、並びに発光装置
JP5188916B2 (ja) * 2008-09-30 2013-04-24 京セラクリスタルデバイス株式会社 圧電発振器
JP5613370B2 (ja) * 2008-10-29 2014-10-22 日本電波工業株式会社 セット基板に対する表面実装水晶発振器の実装方法
JP2010141875A (ja) * 2008-11-13 2010-06-24 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2011014951A (ja) * 2009-06-30 2011-01-20 Kyocera Kinseki Corp 圧電発振器
JP5368208B2 (ja) * 2009-07-30 2013-12-18 京セラクリスタルデバイス株式会社 圧電デバイス
JP5468327B2 (ja) * 2009-07-30 2014-04-09 京セラクリスタルデバイス株式会社 圧電デバイス
JP2010154565A (ja) * 2010-03-24 2010-07-08 Seiko Epson Corp 圧電発振器、電子機器および圧電発振器の製造方法
JP5747574B2 (ja) 2011-03-11 2015-07-15 セイコーエプソン株式会社 圧電デバイス及び電子機器
JP6334192B2 (ja) * 2014-02-21 2018-05-30 京セラ株式会社 圧電デバイスおよびその実装構造
JP2016076514A (ja) * 2014-10-02 2016-05-12 大日本印刷株式会社 配線板、電子モジュール
JP6524679B2 (ja) 2015-02-02 2019-06-05 富士通株式会社 水晶振動子の検査方法
JP6451367B2 (ja) 2015-02-06 2019-01-16 富士通株式会社 水晶振動子
CN112485640B (zh) * 2020-11-18 2023-06-27 苏州华兴源创科技股份有限公司 内置电容器的检测方法、装置、检测设备和存储介质

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Publication number Publication date
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