JP4359518B2 - パワー半導体モジュールの押付接触装置 - Google Patents
パワー半導体モジュールの押付接触装置 Download PDFInfo
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- JP4359518B2 JP4359518B2 JP2004036835A JP2004036835A JP4359518B2 JP 4359518 B2 JP4359518 B2 JP 4359518B2 JP 2004036835 A JP2004036835 A JP 2004036835A JP 2004036835 A JP2004036835 A JP 2004036835A JP 4359518 B2 JP4359518 B2 JP 4359518B2
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- 239000004065 semiconductor Substances 0.000 title claims description 43
- 239000004020 conductor Substances 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims description 16
- 239000011810 insulating material Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
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- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H01L2924/014—Solder alloys
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- H—ELECTRICITY
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Die Bonding (AREA)
- Measuring Fluid Pressure (AREA)
- Emergency Protection Circuit Devices (AREA)
Description
120 ガイド
20 基板
30 コネクティング導体
210 絶縁材料ボディ
220 接続パス
230 金属層
250 パワー半導体構成要素(パワー半導体素子)
252 ワイヤボンディング接続部
40 導体プレート
410 第1主面
430 外部接続パス
432 負荷電流コネクティングパス
434 補助或いは制御コネクティングパス
450 構成要素(素子)
50 押付部材(圧力部材)
510 第1主面
512 第2主面
520 押付要素(圧力要素)
530 押付要素(圧力要素)
532 孔
540 孔
550 スリーブ
580 メタルコア
60 捩込接続部
Claims (8)
- ベースプレートを備えた又は冷却体上に直接的に取り付けるパワー半導体モジュールの押付接触装置であって、ケーシング(10)と、少なくとも1つの電気絶縁式の基板(20)とを有し、この基板は絶縁材料ボディ(210)を有し、この絶縁材料ボディが、この絶縁材料ボディ上に設けられていて互いに絶縁されている金属性の多数の接続パス(220)と、この絶縁材料ボディ上に設けられていて回路に適してそれらの接続パスと接続されている多数のパワー半導体構成要素(250)とを備えていて、更には、ケーシング(10)の外に配設されている導体プレート(40)と接続パス(220)を電気接続させるための少なくとも部分的に弾性的に構成されているコネクティング導体(30)と、このコネクティング導体(30)と導体プレート(40)を押付接触させるための少なくとも1つの形状安定性押付部材(50)とを有する前記装置において、
押付部材(50)が、導体プレート(40)側のその主面(512)に、この主面を導体プレート(40)から離間させる多数の押付要素(520、530)を有することを特徴とする装置。 - 押付部材(50)が、その両方の主面(510、512)を接続する少なくとも1つの孔(540)を有し、押付要素(520、530)が、押付部材(50)の少なくとも1つの縁部からこの孔(540)へ対流の流れが可能であるように配設されていることを特徴とする、請求項1に記載の装置。
- 押付部材(50)が、捩込接続部(60)を受け入れるための電気絶縁された少なくとも1つのスリーブ(550)を有することを特徴とする、請求項1に記載の装置。
- 押付部材(50)が、電気絶縁式の形状安定性プラスチックから成ることを特徴とする、請求項1に記載の装置。
- 押付部材(50)が、電気絶縁式のプラスチックとメタルコア(580)から成る結合体で構成されていることを特徴とする、請求項1に記載の装置。
- 押付要素(520、530)が、バーとして、又は、フィンガーとして、又は、バー及びフィンガーとして形成されていることを特徴とする、請求項1に記載の装置。
- 押付要素の少なくとも2つのバー(530)が結びついて形成されていて、少なくとも部分的にフレームを形成することを特徴とする、請求項6に記載の装置。
- バー(530)が、通過流のための孔(532)を有することを特徴とする、請求項6に記載の装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10306643A DE10306643B4 (de) | 2003-02-18 | 2003-02-18 | Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004253798A JP2004253798A (ja) | 2004-09-09 |
JP4359518B2 true JP4359518B2 (ja) | 2009-11-04 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004036835A Expired - Lifetime JP4359518B2 (ja) | 2003-02-18 | 2004-02-13 | パワー半導体モジュールの押付接触装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6979204B2 (ja) |
EP (1) | EP1450404B1 (ja) |
JP (1) | JP4359518B2 (ja) |
AT (1) | ATE500612T1 (ja) |
DE (2) | DE10306643B4 (ja) |
DK (1) | DK1450404T3 (ja) |
ES (1) | ES2360216T3 (ja) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
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DE10340297B4 (de) * | 2003-09-02 | 2006-07-20 | Semikron Elektronik Gmbh & Co. Kg | Verbindugsanordnung zur Verbindung von aktiven und passiven elektrischen und elektronischen Bauelementen |
DE10358843B3 (de) * | 2003-12-16 | 2005-03-24 | Semikron Elektronik Gmbh | Verpackungsbehältnis für Leistungshalbleitermodule |
JP4154325B2 (ja) * | 2003-12-19 | 2008-09-24 | 株式会社日立産機システム | 電気回路モジュール |
DE102005017849B4 (de) * | 2005-04-18 | 2012-11-08 | Siemens Ag | Elektronisches Bauteil |
DE102005055608B3 (de) * | 2005-11-22 | 2007-05-10 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit zueinander parallel geschalteten Kondensatoren |
DE102006021412B3 (de) | 2006-05-09 | 2007-11-15 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
DE102006025453B4 (de) * | 2006-05-31 | 2009-12-24 | Infineon Technologies Ag | Halbleiterschaltungsanordnung |
DE102006052620B4 (de) * | 2006-11-08 | 2009-07-09 | Semikron Elektronik Gmbh & Co. Kg | Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist. |
DE102006058692A1 (de) * | 2006-12-13 | 2008-06-26 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Kontaktfedern |
DE102007006212B4 (de) * | 2007-02-08 | 2012-09-13 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Kontaktfedern |
DE102007010883A1 (de) * | 2007-03-06 | 2008-09-18 | Infineon Technologies Ag | Leistungshalbleiteranordnung und Verfahren zu dessen Herstellung |
DE102007024160B4 (de) * | 2007-05-24 | 2011-12-01 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
US9373563B2 (en) * | 2007-07-20 | 2016-06-21 | Infineon Technologies Ag | Semiconductor assembly having a housing |
DE102007045281B4 (de) | 2007-09-21 | 2010-02-25 | Semikron Elektronik Gmbh & Co. Kg | Leistungsmodul |
DE102007054709B4 (de) * | 2007-11-16 | 2014-11-13 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Substrat und mit einer Druckeinrichtung |
DE102007062163B4 (de) * | 2007-12-21 | 2009-08-13 | Semikron Elektronik Gmbh & Co. Kg | Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul |
DE102008005547B4 (de) * | 2008-01-23 | 2013-08-29 | Infineon Technologies Ag | Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul |
DE102008018793B3 (de) * | 2008-04-15 | 2009-11-12 | Semikron Elektronik Gmbh & Co. Kg | Anordnung in Druckkontaktausführung mit einem Leistungshalbleitermodul |
DE102008034068B4 (de) * | 2008-07-22 | 2019-07-18 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
DE102008045615C5 (de) | 2008-09-03 | 2018-01-04 | Infineon Technologies Ag | Verfahren zur Herstellung eines Leistungshalbleitermoduls |
DE102008057832B4 (de) * | 2008-11-19 | 2010-07-01 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder |
DE102009002993B4 (de) * | 2009-05-11 | 2012-10-04 | Infineon Technologies Ag | Leistungshalbleitermodul mit beabstandeten Schaltungsträgern |
DE102009026558B3 (de) | 2009-05-28 | 2010-12-02 | Infineon Technologies Ag | Leistungshalbleitermodul mit beweglich gelagerten Schaltungsträgern und Verfahren zur Herstellung eines solchen Leistungshalbleitermoduls |
WO2013038493A1 (ja) * | 2011-09-13 | 2013-03-21 | トヨタ自動車株式会社 | 半導体モジュール |
JP2013243264A (ja) * | 2012-05-21 | 2013-12-05 | Yaskawa Electric Corp | 電子部品取付モジュールおよび電力変換装置 |
CN104170078B (zh) | 2012-07-18 | 2017-04-05 | 富士电机株式会社 | 半导体装置以及半导体装置的制造方法 |
US10231340B2 (en) | 2016-05-26 | 2019-03-12 | Semiconductor Components Industries, Llc | Single reflow power pin connections |
DE102016112779B4 (de) * | 2016-07-12 | 2022-02-24 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitereinrichtung und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung |
US11444002B2 (en) * | 2020-07-29 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5653379A (en) * | 1989-12-18 | 1997-08-05 | Texas Instruments Incorporated | Clad metal substrate |
DE4211759C2 (de) * | 1992-04-08 | 1997-04-03 | Schroff Gmbh | Lüftereinschub |
US5259781A (en) * | 1992-11-18 | 1993-11-09 | International Business Machines Corporation | Electrical connector alignment and actuation assembly |
KR200163045Y1 (ko) | 1994-10-31 | 2000-01-15 | 전주범 | 테이프레코더의 릴테이블 급제동장치(device for breaking a reel table for a tape recorder) |
DE19630173C2 (de) * | 1996-07-26 | 2001-02-08 | Semikron Elektronik Gmbh | Leistungsmodul mit Halbleiterbauelementen |
US5793618A (en) * | 1996-11-26 | 1998-08-11 | International Business Machines Corporation | Module mounting assembly |
DE19847029A1 (de) * | 1998-10-13 | 2000-04-27 | Semikron Elektronik Gmbh | Umrichter mit niederinduktivem Kondensator im Zwischenkreis |
DE29819349U1 (de) * | 1998-10-30 | 1999-12-09 | Siemens AG, 80333 München | Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung |
DE19903875C2 (de) * | 1999-02-01 | 2001-11-29 | Semikron Elektronik Gmbh | Leistungshalbleiterschaltungsanordnung, insbesondere Stromumrichter, in Druckkontaktierung |
DE19924993C2 (de) * | 1999-05-31 | 2002-10-10 | Tyco Electronics Logistics Ag | Intelligentes Leistungsmodul in Sandwich-Bauweise |
JP3395739B2 (ja) * | 1999-11-16 | 2003-04-14 | 日本電気株式会社 | 薄膜トランジスタアレイ基板及びその製造方法 |
US6454587B1 (en) | 2000-10-27 | 2002-09-24 | Hewlett-Packard Company | Assembly for mounting a bus termination device to a printed circuit board (PCB) |
-
2003
- 2003-02-18 DE DE10306643A patent/DE10306643B4/de not_active Expired - Lifetime
-
2004
- 2004-01-09 AT AT04000281T patent/ATE500612T1/de active
- 2004-01-09 DE DE502004012242T patent/DE502004012242D1/de not_active Expired - Lifetime
- 2004-01-09 EP EP04000281A patent/EP1450404B1/de not_active Expired - Lifetime
- 2004-01-09 ES ES04000281T patent/ES2360216T3/es not_active Expired - Lifetime
- 2004-01-09 DK DK04000281.8T patent/DK1450404T3/da active
- 2004-02-13 JP JP2004036835A patent/JP4359518B2/ja not_active Expired - Lifetime
- 2004-02-18 US US10/780,981 patent/US6979204B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20040242031A1 (en) | 2004-12-02 |
DE502004012242D1 (de) | 2011-04-14 |
DE10306643B4 (de) | 2005-08-25 |
EP1450404B1 (de) | 2011-03-02 |
DK1450404T3 (da) | 2011-05-23 |
EP1450404A2 (de) | 2004-08-25 |
EP1450404A3 (de) | 2004-09-01 |
JP2004253798A (ja) | 2004-09-09 |
ATE500612T1 (de) | 2011-03-15 |
DE10306643A1 (de) | 2004-08-26 |
US6979204B2 (en) | 2005-12-27 |
ES2360216T3 (es) | 2011-06-01 |
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