JP4345835B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP4345835B2
JP4345835B2 JP2007084580A JP2007084580A JP4345835B2 JP 4345835 B2 JP4345835 B2 JP 4345835B2 JP 2007084580 A JP2007084580 A JP 2007084580A JP 2007084580 A JP2007084580 A JP 2007084580A JP 4345835 B2 JP4345835 B2 JP 4345835B2
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JP
Japan
Prior art keywords
wiring board
heat sink
semiconductor device
hole
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007084580A
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English (en)
Japanese (ja)
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JP2007173877A (ja
JP2007173877A5 (enrdf_load_stackoverflow
Inventor
嘉治 原田
俊夫 鈴木
広記 岩宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2007084580A priority Critical patent/JP4345835B2/ja
Publication of JP2007173877A publication Critical patent/JP2007173877A/ja
Publication of JP2007173877A5 publication Critical patent/JP2007173877A5/ja
Application granted granted Critical
Publication of JP4345835B2 publication Critical patent/JP4345835B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007084580A 2007-03-28 2007-03-28 半導体装置及びその製造方法 Expired - Fee Related JP4345835B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007084580A JP4345835B2 (ja) 2007-03-28 2007-03-28 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007084580A JP4345835B2 (ja) 2007-03-28 2007-03-28 半導体装置及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13360298A Division JP3959839B2 (ja) 1998-05-15 1998-05-15 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2007173877A JP2007173877A (ja) 2007-07-05
JP2007173877A5 JP2007173877A5 (enrdf_load_stackoverflow) 2009-05-14
JP4345835B2 true JP4345835B2 (ja) 2009-10-14

Family

ID=38299920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007084580A Expired - Fee Related JP4345835B2 (ja) 2007-03-28 2007-03-28 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP4345835B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5496845B2 (ja) * 2010-09-30 2014-05-21 本田技研工業株式会社 電動車両
JP5755196B2 (ja) * 2012-07-27 2015-07-29 三菱電機株式会社 電力用半導体装置
JP2017107419A (ja) * 2015-12-10 2017-06-15 凸版印刷株式会社 温度センサを内蔵したｒｆｉｄタグおよび温度センサ付ｉｃパッケージ基板

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Publication number Publication date
JP2007173877A (ja) 2007-07-05

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