JP2007173877A5 - - Google Patents

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Publication number
JP2007173877A5
JP2007173877A5 JP2007084580A JP2007084580A JP2007173877A5 JP 2007173877 A5 JP2007173877 A5 JP 2007173877A5 JP 2007084580 A JP2007084580 A JP 2007084580A JP 2007084580 A JP2007084580 A JP 2007084580A JP 2007173877 A5 JP2007173877 A5 JP 2007173877A5
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JP
Japan
Prior art keywords
wiring board
semiconductor device
heat sink
hole
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007084580A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007173877A (ja
JP4345835B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007084580A priority Critical patent/JP4345835B2/ja
Priority claimed from JP2007084580A external-priority patent/JP4345835B2/ja
Publication of JP2007173877A publication Critical patent/JP2007173877A/ja
Publication of JP2007173877A5 publication Critical patent/JP2007173877A5/ja
Application granted granted Critical
Publication of JP4345835B2 publication Critical patent/JP4345835B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007084580A 2007-03-28 2007-03-28 半導体装置及びその製造方法 Expired - Fee Related JP4345835B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007084580A JP4345835B2 (ja) 2007-03-28 2007-03-28 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007084580A JP4345835B2 (ja) 2007-03-28 2007-03-28 半導体装置及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13360298A Division JP3959839B2 (ja) 1998-05-15 1998-05-15 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2007173877A JP2007173877A (ja) 2007-07-05
JP2007173877A5 true JP2007173877A5 (enrdf_load_stackoverflow) 2009-05-14
JP4345835B2 JP4345835B2 (ja) 2009-10-14

Family

ID=38299920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007084580A Expired - Fee Related JP4345835B2 (ja) 2007-03-28 2007-03-28 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP4345835B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5496845B2 (ja) * 2010-09-30 2014-05-21 本田技研工業株式会社 電動車両
JP5755196B2 (ja) * 2012-07-27 2015-07-29 三菱電機株式会社 電力用半導体装置
JP2017107419A (ja) * 2015-12-10 2017-06-15 凸版印刷株式会社 温度センサを内蔵したｒｆｉｄタグおよび温度センサ付ｉｃパッケージ基板

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