JP2013105792A5 - - Google Patents
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- Publication number
- JP2013105792A5 JP2013105792A5 JP2011246910A JP2011246910A JP2013105792A5 JP 2013105792 A5 JP2013105792 A5 JP 2013105792A5 JP 2011246910 A JP2011246910 A JP 2011246910A JP 2011246910 A JP2011246910 A JP 2011246910A JP 2013105792 A5 JP2013105792 A5 JP 2013105792A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- recess
- resin
- hole
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 56
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011246910A JP5808227B2 (ja) | 2011-11-10 | 2011-11-10 | 放熱用部品、半導体パッケージ及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011246910A JP5808227B2 (ja) | 2011-11-10 | 2011-11-10 | 放熱用部品、半導体パッケージ及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013105792A JP2013105792A (ja) | 2013-05-30 |
| JP2013105792A5 true JP2013105792A5 (enrdf_load_stackoverflow) | 2014-09-11 |
| JP5808227B2 JP5808227B2 (ja) | 2015-11-10 |
Family
ID=48625149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011246910A Active JP5808227B2 (ja) | 2011-11-10 | 2011-11-10 | 放熱用部品、半導体パッケージ及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5808227B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9859262B1 (en) * | 2016-07-08 | 2018-01-02 | Globalfoundries Inc. | Thermally enhanced package to reduce thermal interaction between dies |
| TWI692611B (zh) * | 2019-06-28 | 2020-05-01 | 新加坡商 Ｊ＆Ｊ 資本控股有限公司 | 熱傳導結構及其製造方法、行動裝置 |
| WO2023085607A1 (ko) * | 2021-11-09 | 2023-05-19 | 삼성전자주식회사 | 열 전도성 계면 물질을 수용하는 인쇄 회로 기판 구조체를 포함하는 전자 장치 |
| CN116581035B (zh) * | 2023-06-05 | 2024-11-08 | 华天科技（昆山）电子有限公司 | 一种高散热的扇出型封装方法及封装结构 |
-
2011
- 2011-11-10 JP JP2011246910A patent/JP5808227B2/ja active Active
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