JP4345507B2 - 光源装置及びプロジェクタ - Google Patents
光源装置及びプロジェクタ Download PDFInfo
- Publication number
- JP4345507B2 JP4345507B2 JP2004028204A JP2004028204A JP4345507B2 JP 4345507 B2 JP4345507 B2 JP 4345507B2 JP 2004028204 A JP2004028204 A JP 2004028204A JP 2004028204 A JP2004028204 A JP 2004028204A JP 4345507 B2 JP4345507 B2 JP 4345507B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- source device
- light source
- light emitting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Projection Apparatus (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
Claims (5)
- 照明光を供給する発光部と、
前記発光部が実装される基板と、
前記発光部の電極と前記基板側の電極とを接合することで前記発光部に電流を供給する、少なくとも2つ以上の接合部と、を有し、
前記発光部は、前記発光部の近傍に冷却用流体を流動させることにより冷却され、
前記接合部のうち1つの接合部は、他の接合部を取り囲む環状形状をなし、かつ、前記冷却用流体と略同電位であって、
前記他の接合部は、前記1つの接合部と前記発光部とを密着することで、前記冷却用流体とは電気的に絶縁されることを特徴とする光源装置。 - 前記他の接合部は、さらに前記1つの接合部と前記基板とを密着することで、前記1つの接合部、前記発光部及び前記基板により密閉される空間に設けられることを特徴とする請求項1に記載の光源装置。
- 前記基板は、前記環状形状の内周側に、前記発光部からの熱を伝播する伝熱部材をさらに有することを特徴とする請求項1に記載の光源装置。
- 前記基板は、前記環状形状の内周側に開口部を有し、
前記開口部へ冷却用気体を供給することにより前記発光部を冷却する冷却用気体供給部をさらに有することを特徴とする請求項1に記載の光源装置。 - 照明光を供給する光源装置と、
前記光源装置からの前記照明光を画像信号に応じて変調する空間光変調装置と、
前記空間光変調装置で変調された光を投写する投写レンズと、を有し、
前記光源装置は、請求項1〜4のいずれか一項に記載の光源装置であることを特徴とするプロジェクタ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004028204A JP4345507B2 (ja) | 2004-02-04 | 2004-02-04 | 光源装置及びプロジェクタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004028204A JP4345507B2 (ja) | 2004-02-04 | 2004-02-04 | 光源装置及びプロジェクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005221640A JP2005221640A (ja) | 2005-08-18 |
JP4345507B2 true JP4345507B2 (ja) | 2009-10-14 |
Family
ID=34997339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004028204A Expired - Fee Related JP4345507B2 (ja) | 2004-02-04 | 2004-02-04 | 光源装置及びプロジェクタ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4345507B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100498512C (zh) * | 2004-10-15 | 2009-06-10 | 三洋电机株式会社 | 投射型视频显示装置 |
JP2009147175A (ja) * | 2007-12-14 | 2009-07-02 | Shinko Electric Ind Co Ltd | 発光装置及び車両用前照灯 |
KR101518508B1 (ko) | 2008-09-01 | 2015-05-11 | 이형곤 | 액체냉각 발광장치와 엘이디 패키지 |
US8183585B2 (en) * | 2008-09-16 | 2012-05-22 | Osram Sylvania Inc. | Lighting module |
JP6798137B2 (ja) * | 2016-04-28 | 2020-12-09 | 岩崎電気株式会社 | 光源ユニット |
JP6658712B2 (ja) * | 2017-10-25 | 2020-03-04 | セイコーエプソン株式会社 | プロジェクター |
-
2004
- 2004-02-04 JP JP2004028204A patent/JP4345507B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005221640A (ja) | 2005-08-18 |
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